Kim; Hong Hyoun
Patent Applications and Registrations
Patent applications and USPTO patent grants for Kim; Hong Hyoun.The latest application filed is for "motor and vehicle including same".
- Kim; Hong Hyoun - Seoul KR
- Kim; Hong Hyoun - Kyunggi-do KR
- KIM; Hong Hyoun - Paju-Si KR
| Patent | Date |
|---|---|
| Motor with brushes at angular interval of 63.degree. to 66.degree. and having a width and a commutator piece with a width Grant 10,840,780 - Kim , et al. November 17, 2 | 2020-11-17 |
| Motor And Vehicle Including Same App 20180367013 - KIM; JAE YOUNG ; et al. | 2018-12-20 |
| Light emitting diode Grant D656,468 - Park , et al. March 27, 2 | 2012-03-27 |
| Multi-chip package with a single die pad Grant 7,535,084 - Kim May 19, 2 | 2009-05-19 |
| Semiconductor Package Structure And Leadframe Thereof App 20090045491 - Kim; Hong-Hyoun | 2009-02-19 |
| Chip Package And Chip Packaging Process Thereof App 20090035895 - Lee; Min-Ik ; et al. | 2009-02-05 |
| Multi-chip Package With A Single Die Pad App 20080224294 - Kim; Hong Hyoun | 2008-09-18 |
| Package-on-package Device And Method For Manufacturing The Same By Using A Leadframe App 20080185695 - KIM; Hong Hyoun ; et al. | 2008-08-07 |
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