KIM; Hoechul

Patent Applications and Registrations

Patent applications and USPTO patent grants for KIM; Hoechul.The latest application filed is for "method of fabricating a semiconductor device".

Company Profile

5.2.7

KIM; Hoechul - Seoul KR
Kim; Hoechul - Suwon-si KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method Of Fabricating A Semiconductor Device App 20220068852 - CHOI; Ju-Il ; et al.	2022-03-03
Wafer To Wafer Bonding Apparatus And Wafer To Wafer Bonding Method App 20220020624 - PHEE; Jaehyun ; et al.	2022-01-20
Semiconductor device including interconnection structure including copper and tin and semiconductor package including the same Grant 11,152,317 - Choi , et al. October 19, 2	2021-10-19
Substrate Bonding Apparatus And Method Of Manufacturing Semiconductor Device Using The Same App 20210143026 - Jeon; Hyungjun ; et al.	2021-05-13
Substrate Bonding Apparatus And Method Of Manufacturing Semiconductor Device By Using The Same App 20210057373 - KIM; TAEYEONG ; et al.	2021-02-25
Substrate Bonding Apparatus And Method Of Manufacturing Semiconductor Device By Using The Substrate Bonding Apparatus App 20210057263 - Kim; Hoechul ; et al.	2021-02-25
Substrate bonding apparatus Grant 10,923,452 - Han , et al. February 16, 2	2021-02-16
Substrate Bonding Apparatus App 20200373274 - HAN; Ilyoung ; et al.	2020-11-26
Semiconductor Device And Semiconductor Package Including The Same App 20200098711 - CHOI; Ju-Il ; et al.	2020-03-26

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