Kim; Hoe-Chul
Patent Applications and Registrations
Patent applications and USPTO patent grants for Kim; Hoe-Chul.The latest application filed is for "wafer bonding apparatuses".
- Kim; Hoe-Chul - Seoul KR
- Kim; Hoe Chul - Suwon-si KR
- Kim; Hoe Chul - Hwaseong-si KR
| Patent | Date |
|---|---|
| Semiconductor laser device Grant 11,283,235 - Kang , et al. March 22, 2 | 2022-03-22 |
| Wafer bonding apparatus for directly bonding wafers and a wafer bonding system having the same Grant 10,906,283 - Kim , et al. February 2, 2 | 2021-02-02 |
| Wafer Bonding Apparatuses App 20200373186 - Kim; Hoe Chul ; et al. | 2020-11-26 |
| Apparatuses of bonding substrates and methods of bonding substrates Grant 10,833,047 - Kim , et al. November 10, 2 | 2020-11-10 |
| Apparatuses Of Bonding Substrates And Methods Of Bonding Substrates App 20200152596 - KIM; Hoe Chul ; et al. | 2020-05-14 |
| Semiconductor Laser Device App 20200136341 - KANG; Pil-Kyu ; et al. | 2020-04-30 |
| Wafer Bonding Apparatus For Directly Bonding Wafers And A Wafer Bonding System Having The Same App 20200055296 - KIM; Tae-Yeong ; et al. | 2020-02-20 |
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