KIM; Eung Jae
Patent Applications and Registrations
Patent applications and USPTO patent grants for KIM; Eung Jae.The latest application filed is for "core for reverse reflow, semiconductor package, and method of fabricating semiconductor package".
- KIM; Eung Jae - Daegu KR
| Patent | Date |
|---|---|
| Core For Reverse Reflow, Semiconductor Package, And Method Of Fabricating Semiconductor Package App 20160315040 - SON; Jae Yeol ; et al. | 2016-10-27 |
| Lead-free Solder Having Low Melting Point App 20160256962 - KIM; Hui Joong ; et al. | 2016-09-08 |
| Solder Ball For Fluxless Bonding, Method Of Manufacturing The Same, And Method Of Forming Solder Bump App 20160244891 - SON; Jae Yeol ; et al. | 2016-08-25 |
| Solder balls and semiconductor device employing the same Grant 9,391,039 - Moon , et al. July 12, 2 | 2016-07-12 |
| Solder Balls And Semiconductor Device Employing The Same App 20150380373 - MOON; Jeong Tak ; et al. | 2015-12-31 |
| Metal Ball Fabricating Apparatus App 20150064293 - MOON; Jeong Tak ; et al. | 2015-03-05 |
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