loadpatents
name:-0.010978937149048
name:-0.0096518993377686
name:-0.0047030448913574
Kim; Doo Jin Patent Filings

Kim; Doo Jin

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kim; Doo Jin.The latest application filed is for "clothes hanger".

Company Profile
3.8.10
  • Kim; Doo Jin - Seongnam-si KR
  • Kim; Doo Jin - Asan-si KR
  • Kim; Doo Jin - Hwaseong-si KR
  • Kim; Doo Jin - Chungcheongnam-do KR
  • Kim; Doo Jin - Seoul N/A KR
  • Kim; Doo-Jin - Cheonan-si KR
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Clothes hanger
Grant 11,246,440 - Kim , et al. February 15, 2
2022-02-15
Collet apparatus and method for fabricating a semiconductor device using the same
Grant 11,127,609 - Kim , et al. September 21, 2
2021-09-21
Clothes Hanger
App 20210127877 - Kim; Dan Ha ;   et al.
2021-05-06
Collet Apparatus And Method For Fabricating A Semiconductor Device Using The Same
App 20200402824 - KIM; Doo Jin ;   et al.
2020-12-24
Semiconductor package including semiconductor chip
Grant 10,714,453 - Kim , et al.
2020-07-14
Semiconductor Package Including Semiconductor Chip
App 20190244932 - Kim; Doo Jin ;   et al.
2019-08-08
Substrate treating apparatus
Grant 9,627,236 - Lee , et al. April 18, 2
2017-04-18
Protection device for blind string
Grant 9,366,078 - Choi , et al. June 14, 2
2016-06-14
Semiconductor package and method of manufacturing the same
Grant 9,324,661 - Kim , et al. April 26, 2
2016-04-26
Substrate Treating Apparatus
App 20150290685 - Lee; Sang Jin ;   et al.
2015-10-15
Semiconductor Package And Method Of Manufacturing The Same
App 20150279787 - KIM; Doo-Jin ;   et al.
2015-10-01
Protection Device For Blind String
App 20150247361 - CHOI; Yeon Seok ;   et al.
2015-09-03
Capillary exchange system of semiconductor wire bonding
Grant 8,672,210 - Kim , et al. March 18, 2
2014-03-18
Capillary Exchange System Of Semiconductor Wire Bonding
App 20130221071 - KIM; Young Sik ;   et al.
2013-08-29
Wire Bonding System For Semiconductor Package
App 20130056448 - Kim; Doo-jin ;   et al.
2013-03-07

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