loadpatents
Patent applications and USPTO patent grants for Kim; Doo Jin.The latest application filed is for "clothes hanger".
Patent | Date |
---|---|
Clothes hanger Grant 11,246,440 - Kim , et al. February 15, 2 | 2022-02-15 |
Collet apparatus and method for fabricating a semiconductor device using the same Grant 11,127,609 - Kim , et al. September 21, 2 | 2021-09-21 |
Clothes Hanger App 20210127877 - Kim; Dan Ha ;   et al. | 2021-05-06 |
Collet Apparatus And Method For Fabricating A Semiconductor Device Using The Same App 20200402824 - KIM; Doo Jin ;   et al. | 2020-12-24 |
Semiconductor package including semiconductor chip Grant 10,714,453 - Kim , et al. | 2020-07-14 |
Semiconductor Package Including Semiconductor Chip App 20190244932 - Kim; Doo Jin ;   et al. | 2019-08-08 |
Substrate treating apparatus Grant 9,627,236 - Lee , et al. April 18, 2 | 2017-04-18 |
Protection device for blind string Grant 9,366,078 - Choi , et al. June 14, 2 | 2016-06-14 |
Semiconductor package and method of manufacturing the same Grant 9,324,661 - Kim , et al. April 26, 2 | 2016-04-26 |
Substrate Treating Apparatus App 20150290685 - Lee; Sang Jin ;   et al. | 2015-10-15 |
Semiconductor Package And Method Of Manufacturing The Same App 20150279787 - KIM; Doo-Jin ;   et al. | 2015-10-01 |
Protection Device For Blind String App 20150247361 - CHOI; Yeon Seok ;   et al. | 2015-09-03 |
Capillary exchange system of semiconductor wire bonding Grant 8,672,210 - Kim , et al. March 18, 2 | 2014-03-18 |
Capillary Exchange System Of Semiconductor Wire Bonding App 20130221071 - KIM; Young Sik ;   et al. | 2013-08-29 |
Wire Bonding System For Semiconductor Package App 20130056448 - Kim; Doo-jin ;   et al. | 2013-03-07 |
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