Kim; Dong W.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kim; Dong W..The latest application filed is for "air through-silicon via structure".

Company Profile

0.11.3

Kim; Dong W. - San Jose CA
Kim; Dong W. - El Dorado Hills CA
Kim; Dong W. - Chester VA
Kim; Dong W. - Seoul KR
Kim; Dong W. - Tokyo JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Through-silicon vias with metal system fill Grant 9,236,341 - Kim , et al. January 12, 2	2016-01-12
Methods of manufacturing a semiconductor structure Grant 8,802,454 - Rahman , et al. August 12, 2	2014-08-12
Air through-silicon via structure Grant 8,519,542 - Kim , et al. August 27, 2	2013-08-27
Integrated circuit assembly having vented heat-spreader Grant 8,258,013 - Nagarajan , et al. September 4, 2	2012-09-04
Air Through-silicon Via Structure App 20120032326 - Kim; Namhoon ; et al.	2012-02-09
Microelectronic assembly having second level interconnects including solder joints reinforced with crack arrester elements and method of forming same Grant 7,750,466 - Rothman , et al. July 6, 2	2010-07-06
Microelectronic Assembly Having Second Level Interconnects Including Solder Joints Reinforced with Crack Arrester Elements and Method of Forming Same App 20090065943 - Rothman; Timothy P. ; et al.	2009-03-12
High luster fiber materials, methods of manufacture and uses thereof App 20060040090 - Frink; Robert A. ; et al.	2006-02-23
Methods of patterning and manufacturing semiconductor devices Grant 5,393,373 - Jun , et al. February 28, 1	1995-02-28
Methods of patterning and manufacturing semiconductor devices Grant 5,256,587 - Jun , et al. October 26, 1	1993-10-26
DNA fragment and expression plasmid containing the DNA fragment Grant 5,225,348 - Nagata , et al. July 6, 1	1993-07-06

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