KIM; Daniel Daeik

Patent Applications and Registrations

Patent applications and USPTO patent grants for KIM; Daniel Daeik.The latest application filed is for "system in package (sip) socket connector interface".

Company Profile

10.6.14

KIM; Daniel Daeik - San Diego CA
Kim; Daniel Daeik - Del Mar CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
System In Package (sip) Socket Connector Interface App 20220248541 - KIM; Daniel Daeik ; et al.	2022-08-04
Chip Modules Employing Conductive Pillars To Couple A Passive Component Device To Conductive Traces In A Metallization Structure To Form A Passive Component App 20220246552 - Yun; Changhan Hobie ; et al.	2022-08-04
Capacitance Fine Tuning By Fin Capacitor Design App 20220223516 - PARK; Nosun ; et al.	2022-07-14
RF damping structure in inductive device Grant 11,380,471 - Kim , et al. July 5, 2	2022-07-05
Tunable Circuit Including Integrated Filter Circuit Coupled To Variable Capacitance, And Related Integrated Circuit (ic) Packages And Fabrication Methods App 20220123735 - Yun; Changhan Hobie ; et al.	2022-04-21
Package Comprising An Integrated Passive Device Configured As A Cap For A Filter App 20220069193 - YUN; Changhan Hobie ; et al.	2022-03-03
Device, Package And/or Substrate Comprising Curved Antenna App 20220069453 - YUN; Changhan Hobie ; et al.	2022-03-03
Wire bond inductor structures for flip chip dies Grant 11,239,158 - Thadesar , et al. February 1, 2	2022-02-01
Partial Component Embedding In A Substrate App 20210375732 - THADESAR; Paragkumar Ajaybhai ; et al.	2021-12-02
Substrate Comprising Capacitor Configured For Power Amplifier Output Match App 20210351750 - KIM; Daniel Daeik ; et al.	2021-11-11
Shielding For A Laminate Inductor Coil App 20210249177 - ZHANG; Chunhu ; et al.	2021-08-12
Perpendicular inductors integrated in a substrate Grant 11,011,461 - Zhang , et al. May 18, 2	2021-05-18
Integrated circuits (ICs) on a glass substrate Grant 10,903,240 - Gu , et al. January 26, 2	2021-01-26
Conformal shielding for solder ball array Grant 10,879,191 - Kim , et al. December 29, 2	2020-12-29
Conformal Shielding For Solder Ball Array App 20200219822 - KIM; Daniel Daeik ; et al.	2020-07-09
Rf Damping Structure In Inductive Device App 20200020474 - KIM; Daniel Daeik ; et al.	2020-01-16
Integrated Circuits (ics) On A Glass Substrate App 20190259780 - GU; Shiqun ; et al.	2019-08-22
Perpendicular Inductors Integrated In A Substrate App 20190252316 - ZHANG; Shu ; et al.	2019-08-15
Embedded Vertical Inductor In Laminate Stacked Substrates App 20190189327 - Kim; Daniel Daeik ; et al.	2019-06-20
Semiconductor assembly and method of making same Grant 10,319,694 - Kim , et al.	2019-06-11

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.