Kim; Daeik Daniel
Patent Applications and Registrations
Patent applications and USPTO patent grants for Kim; Daeik Daniel.The latest application filed is for "segmented thermal and rf ground".
Company Profile
23.64.82
- Kim; Daeik Daniel - Del Mar CA
- Kim; Daeik Daniel - San Diego CA
Patent Activity
| Patent | Date |
|---|---|
| High performance inductors Grant 11,024,454 - Kim , et al. June 1, 2 | 2021-06-01 |
| Inductor with embraced corner capture pad Grant 10,978,240 - Kim , et al. April 13, 2 | 2021-04-13 |
| Low DC resistance and high RF resistance power amplifier choke inductor Grant 10,832,848 - Kim , et al. November 10, 2 | 2020-11-10 |
| Passive-on-glass (POG) device and method Grant 10,607,980 - Lan , et al. | 2020-03-31 |
| 3D pillar inductor Grant 10,553,671 - Zuo , et al. Fe | 2020-02-04 |
| Segmented thermal and RF ground Grant 10,511,268 - Kim , et al. Dec | 2019-12-17 |
| Two-dimensional structure to form an embedded three-dimensional structure Grant 10,490,348 - Velez , et al. Nov | 2019-11-26 |
| Power amplifier with RF structure Grant 10,431,511 - Kim , et al. O | 2019-10-01 |
| Land grid array (LGA) packaging of passive-on-glass (POG) structure Grant 10,361,149 - Zuo , et al. | 2019-07-23 |
| Varying thickness inductor Grant 10,354,795 - Kim , et al. July 16, 2 | 2019-07-16 |
| Solenoid inductor Grant 10,332,671 - Velez , et al. | 2019-06-25 |
| Integrated circuits (ICs) on a glass substrate Grant 10,332,911 - Gu , et al. | 2019-06-25 |
| Substrate comprising an embedded inductor and a thin film magnetic core Grant 10,290,414 - Yun , et al. | 2019-05-14 |
| Skewed co-spiral inductor structure Grant 10,283,257 - Kim , et al. | 2019-05-07 |
| Stepped-width co-spiral inductor structure Grant 10,262,786 - Kim , et al. | 2019-04-16 |
| Stacked substrate inductor Grant 10,249,580 - Kim , et al. | 2019-04-02 |
| Compartment shielding in flip-chip (FC) module Grant 10,242,957 - Kim , et al. | 2019-03-26 |
| Tunable matching network Grant 10,187,031 - Ma , et al. Ja | 2019-01-22 |
| Segmented Thermal And Rf Ground App 20190006999 - KIM; Daeik Daniel ; et al. | 2019-01-03 |
| Low Dc Resistance And High Rf Resistance Power Amplifier Choke Inductor App 20180374622 - KIM; Daeik Daniel ; et al. | 2018-12-27 |
| Passive device assembly for accurate ground plane control Grant 10,154,591 - Zuo , et al. Dec | 2018-12-11 |
| Passive components implemented on a plurality of stacked insulators Grant 10,141,353 - Yun , et al. Nov | 2018-11-27 |
| Inductor With Embraced Corner Capture Pad App 20180315540 - KIM; Daeik Daniel ; et al. | 2018-11-01 |
| Power Amplifier With Rf Structure App 20180316319 - KIM; Daeik Daniel ; et al. | 2018-11-01 |
| Open-passivation ball grid array pads Grant 10,103,116 - Kim , et al. October 16, 2 | 2018-10-16 |
| Double-sided circuit Grant 10,103,703 - Yun , et al. October 16, 2 | 2018-10-16 |
| Wafer level package (WLP) ball support using cavity structure Grant 10,074,625 - Velez , et al. September 11, 2 | 2018-09-11 |
| Encapsulation of acoustic resonator devices Grant 10,069,474 - Yun , et al. September 4, 2 | 2018-09-04 |
| Nested through glass via transformer Grant 10,049,815 - Kim , et al. August 14, 2 | 2018-08-14 |
| Embedded layered inductor Grant 10,051,741 - Song , et al. August 14, 2 | 2018-08-14 |
| Wire-bond Cage In Conformal Shielding App 20180228016 - KIM; Daeik Daniel ; et al. | 2018-08-09 |
| Apparatus with 3D wirewound inductor integrated within a substrate Grant 10,026,546 - Yun , et al. July 17, 2 | 2018-07-17 |
| Passive Device Assembly For Accurate Ground Plane Control App 20180177052 - Zuo; Chengjie ; et al. | 2018-06-21 |
| Passive-on-glass (pog) Device And Method App 20180145062 - Lan; Je-Hsiung Jeffrey ; et al. | 2018-05-24 |
| Augmented capacitor structure for high quality (Q)-factor radio frequency (RF) applications Grant 9,966,426 - Mudakatte , et al. May 8, 2 | 2018-05-08 |
| Thin film magnet inductor structure for high quality (Q)-factor radio frequency (RF) applications Grant 9,959,964 - Yun , et al. May 1, 2 | 2018-05-01 |
| Multiplexer design using a 2D passive on glass filter integrated with a 3D through glass via filter Grant 9,954,267 - Yun , et al. April 24, 2 | 2018-04-24 |
| Passive device assembly for accurate ground plane control Grant 9,930,783 - Zuo , et al. March 27, 2 | 2018-03-27 |
| Frequency multiplexer Grant 9,906,318 - Zuo , et al. February 27, 2 | 2018-02-27 |
| Semiconductor Assembly And Method Of Making Same App 20180047687 - KIM; Daeik Daniel ; et al. | 2018-02-15 |
| Land Grid Array (lga) Packaging Of Passive-on-glass (pog) Structure App 20180047660 - ZUO; Chengjie ; et al. | 2018-02-15 |
| Passive-on-glass (POG) device and method Grant 9,893,048 - Lan , et al. February 13, 2 | 2018-02-13 |
| Stepped-width Co-spiral Inductor Structure App 20180033537 - KIM; Daeik Daniel ; et al. | 2018-02-01 |
| MIM capacitor and method of making the same Grant 9,875,848 - Berdy , et al. January 23, 2 | 2018-01-23 |
| LC filter layer stacking by layer transfer to make 3D multiplexer structures Grant 9,876,513 - Yun , et al. January 23, 2 | 2018-01-23 |
| Two-dimensional Structure To Form An Embedded Three-dimensional Structure App 20170372831 - VELEZ; Mario Francisco ; et al. | 2017-12-28 |
| Stacked Substrate Inductor App 20170373025 - KIM; Daeik Daniel ; et al. | 2017-12-28 |
| Exposed Side-wall And Lga Assembly App 20170372989 - KIM; Daeik Daniel ; et al. | 2017-12-28 |
| Inline Kerf Probing Of Passive Devices App 20170372975 - KIM; Daeik Daniel ; et al. | 2017-12-28 |
| Double-sided Circuit App 20170338788 - YUN; Changhan Hobie ; et al. | 2017-11-23 |
| Passive Components Implemented On A Plurality Of Stacked Insulators App 20170338255 - YUN; Changhan Hobie ; et al. | 2017-11-23 |
| Apparatus With 3d Wirewound Inductor Integrated Within A Substrate App 20170338034 - Yun; Changhan Hobie ; et al. | 2017-11-23 |
| Tunable Matching Network App 20170331445 - Ma; Yunfei ; et al. | 2017-11-16 |
| Solenoid inductor in a substrate Grant 9,806,144 - Kim , et al. October 31, 2 | 2017-10-31 |
| Lc Filter Layer Stacking By Layer Transfer To Make 3d Multiplexer Structures App 20170288707 - YUN; Changhan Hobie ; et al. | 2017-10-05 |
| Passive Device Assembly For Accurate Ground Plane Control App 20170280562 - Zuo; Chengjie ; et al. | 2017-09-28 |
| High quality factor capacitors and methods for fabricating high quality factor capacitors Grant 9,773,862 - Yun , et al. September 26, 2 | 2017-09-26 |
| Integrated circuits (ICS) on a glass substrate Grant 9,768,109 - Gu , et al. September 19, 2 | 2017-09-19 |
| Open-passivation Ball Grid Array Pads App 20170221846 - KIM; Daeik Daniel ; et al. | 2017-08-03 |
| Backside coupled symmetric varactor structure Grant 9,721,946 - Kim , et al. August 1, 2 | 2017-08-01 |
| Skewed Co-spiral Inductor Structure App 20170200550 - KIM; Daeik Daniel ; et al. | 2017-07-13 |
| Multiplexer Design Using A 2d Passive On Glass Filter Integrated With A 3d Through Glass Via Filter App 20170187345 - YUN; Changhan Hobie ; et al. | 2017-06-29 |
| Three-dimensional wire bond inductor Grant 9,692,386 - Zuo , et al. June 27, 2 | 2017-06-27 |
| Mim Capacitor And Method Of Making The Same App 20170178810 - BERDY; David Francis ; et al. | 2017-06-22 |
| Isolated complementary metal-oxide semiconductor (CMOS) devices for radio-frequency (RF) circuits Grant 9,673,275 - Kim , et al. June 6, 2 | 2017-06-06 |
| Superposed structure 3D orthogonal through substrate inductor Grant 9,666,362 - Berdy , et al. May 30, 2 | 2017-05-30 |
| Thin Film Magnet Inductor Structure For High Quality (q)-factor Radio Frequency (rf) Applications App 20170140862 - YUN; Changhan Hobie ; et al. | 2017-05-18 |
| Acoustic Resonator Devices App 20170141756 - Yun; Changhan Hobie ; et al. | 2017-05-18 |
| Metal-insulator-metal (mim) Array For Integrated Radio Frequency (rf) Filter App 20170133996 - Kim; Daeik Daniel ; et al. | 2017-05-11 |
| Solenoid Inductor App 20170133148 - VELEZ; Mario Francisco ; et al. | 2017-05-11 |
| High Quality Factor Capacitors And Methods For Fabricating High Quality Factor Capacitors App 20170125512 - YUN; Changhan Hobie ; et al. | 2017-05-04 |
| Isolated Complementary Metal-oxide Semiconductor (cmos) Devices For Radio-frequency (rf) Circuits App 20170117358 - Kim; Daeik Daniel ; et al. | 2017-04-27 |
| High Performance Inductors App 20170110237 - KIM; Daeik Daniel ; et al. | 2017-04-20 |
| Radio-frequency (RF) shielding in fan-out wafer level package (FOWLP) Grant 9,620,463 - Kim , et al. April 11, 2 | 2017-04-11 |
| Integrated Circuits (ics) On A Glass Substrate App 20170098663 - Gu; Shiqun ; et al. | 2017-04-06 |
| Wafer Level Package (wlp) Ball Support Using Cavity Structure App 20170084565 - VELEZ; Mario Francisco ; et al. | 2017-03-23 |
| Integrated Circuits (ics) On A Glass Substrate App 20170084531 - Gu; Shiqun ; et al. | 2017-03-23 |
| On-package Connector App 20170084523 - FU; Jie ; et al. | 2017-03-23 |
| Substrate-transferred, Deep Trench Isolation Silicon-on-insulator (soi) Semiconductor Devices Formed From Bulk Semiconductor Wafers App 20170084628 - Kim; Daeik Daniel ; et al. | 2017-03-23 |
| Dual mode transistor Grant 9,601,607 - Li , et al. March 21, 2 | 2017-03-21 |
| Augmented Capacitor Structure For High Quality (q)-factor Radio Frequency (rf) Applications App 20170077214 - MUDAKATTE; Niranjan Sunil ; et al. | 2017-03-16 |
| Backside Coupled Symmetric Varactor Structure App 20170077093 - KIM; Daeik Daniel ; et al. | 2017-03-16 |
| Passive-on-glass (pog) Device And Method App 20170077079 - Lan; Je-Hsiung Jeffrey ; et al. | 2017-03-16 |
| Substrate Comprising An Embedded Inductor And A Thin Film Magnetic Core App 20170062120 - Yun; Changhan Hobie ; et al. | 2017-03-02 |
| Tunable Cavity Resonator App 20170033429 - Berdy; David Francis ; et al. | 2017-02-02 |
| Devices and methods to reduce stress in an electronic device Grant 9,560,745 - Kim , et al. January 31, 2 | 2017-01-31 |
| High quality factor capacitors and methods for fabricating high quality factor capacitors Grant 9,548,350 - Yun , et al. January 17, 2 | 2017-01-17 |
| Face-up Substrate Integration With Solder Ball Connection In Semiconductor Package App 20160381809 - KIM; Daeik Daniel ; et al. | 2016-12-29 |
| Varying Thickness Inductor App 20160358709 - Kim; Daeik Daniel ; et al. | 2016-12-08 |
| Backside coupled symmetric varactor structure Grant 9,502,586 - Kim , et al. November 22, 2 | 2016-11-22 |
| Vertical spiral inductor Grant 9,478,348 - Kim , et al. October 25, 2 | 2016-10-25 |
| Face-up substrate integration with solder ball connection in semiconductor package Grant 9,468,098 - Kim , et al. October 11, 2 | 2016-10-11 |
| Silicon-on-insulator (soi) Wafers Employing Molded Substrates To Improve Insulation And Reduce Current Leakage App 20160293477 - Kim; Daeik Daniel ; et al. | 2016-10-06 |
| Asymmetric unbalanced acoustically coupled resonators for spurious mode suppression Grant 9,461,614 - Yun , et al. October 4, 2 | 2016-10-04 |
| 3d Pillar Inductor App 20160284789 - ZUO; Chengjie ; et al. | 2016-09-29 |
| Nested Through Glass Via Transformer App 20160276101 - KIM; Daeik Daniel ; et al. | 2016-09-22 |
| Varying thickness inductor Grant 9,449,753 - Kim , et al. September 20, 2 | 2016-09-20 |
| Radio-frequency (rf) Shielding In Fan-out Wafer Level Package (fowlp) App 20160254237 - KIM; Daeik Daniel ; et al. | 2016-09-01 |
| Compartment Shielding In Flip-chip (fc) Module App 20160254236 - KIM; Daeik Daniel ; et al. | 2016-09-01 |
| Three Dimensional (3d) Antenna Structure App 20160248149 - Kim; Daeik Daniel ; et al. | 2016-08-25 |
| High pass filters and low pass filters using through glass via technology Grant 9,425,761 - Zuo , et al. August 23, 2 | 2016-08-23 |
| Nested through glass via transformer Grant 9,384,883 - Kim , et al. July 5, 2 | 2016-07-05 |
| Resonator with a staggered electrode configuration Grant 9,379,686 - Yun , et al. June 28, 2 | 2016-06-28 |
| Metal-insulator-metal (mim) Capacitors Arranged In A Pattern To Reduce Inductance, And Related Methods App 20160181233 - Yun; Changhan Hobie ; et al. | 2016-06-23 |
| Package on package (PoP) integrated device comprising a capacitor in a substrate Grant 9,368,566 - Lee , et al. June 14, 2 | 2016-06-14 |
| Low package parasitic inductance using a thru-substrate interposer Grant 9,370,103 - Yun , et al. June 14, 2 | 2016-06-14 |
| 3D pillar inductor Grant 9,368,564 - Zuo , et al. June 14, 2 | 2016-06-14 |
| Superposed Structure 3d Orthogonal Through Substrate Inductor App 20160163450 - BERDY; David Francis ; et al. | 2016-06-09 |
| Integrated passive device (IPD) on substrate Grant 9,362,218 - Kim , et al. June 7, 2 | 2016-06-07 |
| Thick conductive stack plating process with fine critical dimension feature size for compact passive on glass technology Grant 9,343,399 - Lan , et al. May 17, 2 | 2016-05-17 |
| Stress mitigation structure for wafer warpage reduction Grant 9,343,403 - Lan , et al. May 17, 2 | 2016-05-17 |
| Toroid inductor in an integrated device Grant 9,324,779 - Song , et al. April 26, 2 | 2016-04-26 |
| Devices And Methods To Reduce Stress In An Electronic Device App 20160095208 - Kim; Daeik Daniel ; et al. | 2016-03-31 |
| Varactor Device With Backside Contact App 20160093750 - Kim; Daeik Daniel ; et al. | 2016-03-31 |
| Systems for reducing magnetic coupling in integrated circuits (ICS), and related components and methods Grant 9,264,013 - Zuo , et al. February 16, 2 | 2016-02-16 |
| Superposed Structure 3d Orthogonal Through Substrate Inductor App 20160020013 - BERDY; David Francis ; et al. | 2016-01-21 |
| PACKAGE ON PACKAGE (PoP) INTEGRATED DEVICE COMPRISING A CAPACITOR IN A SUBSTRATE App 20160020193 - Lee; Jong-Hoon ; et al. | 2016-01-21 |
| Vertical Spiral Inductor App 20150371751 - KIM; Daeik Daniel ; et al. | 2015-12-24 |
| Die package comprising die-to-wire connector and a wire-to-die connector configured to couple to a die package Grant 9,202,789 - Kim , et al. December 1, 2 | 2015-12-01 |
| Frequency Multiplexer App 20150304059 - Zuo; Chengjie ; et al. | 2015-10-22 |
| Die Package Comprising Die-to-wire Connector And A Wire-to-die Connector Configured To Couple To A Die Package App 20150303148 - Kim; Daeik Daniel ; et al. | 2015-10-22 |
| Stress Mitigation Structure For Wafer Warpage Reduction App 20150287677 - LAN; Je-Hsiung Jeffrey ; et al. | 2015-10-08 |
| 3d Pillar Inductor App 20150279920 - ZUO; Chengjie ; et al. | 2015-10-01 |
| Face-up Substrate Integration With Solder Ball Connection In Semiconductor Package App 20150271920 - KIM; Daeik Daniel ; et al. | 2015-09-24 |
| Compact 3-D coplanar transmission lines Grant 9,136,574 - Kim , et al. September 15, 2 | 2015-09-15 |
| Resonator With A Staggered Electrode Configuration App 20150256143 - YUN; Changhan Hobie ; et al. | 2015-09-10 |
| Low-profile Package With Passive Device App 20150237732 - Velez; Mario Francisco ; et al. | 2015-08-20 |
| High Quality Factor Capacitors And Methods For Fabricating High Quality Factor Capacitors App 20150228712 - YUN; Changhan Hobie ; et al. | 2015-08-13 |
| Nested Through Glass Via Transformer App 20150200049 - KIM; Daeik Daniel ; et al. | 2015-07-16 |
| Stacked Conductive Interconnect Inductor App 20150201495 - KIM; Daeik Daniel ; et al. | 2015-07-16 |
| Lateral Metal Insulator Metal (mim) Capacitor With High-q And Reduced Area App 20150200245 - YUN; Changhan Hobie ; et al. | 2015-07-16 |
| Three-dimensional Wire Bond Inductor App 20150180437 - Zuo; Chengjie ; et al. | 2015-06-25 |
| Dual Mode Transistor App 20150145592 - Li; Xia ; et al. | 2015-05-28 |
| Multi Spiral Inductor App 20150130579 - Kim; Daeik Daniel ; et al. | 2015-05-14 |
| Solonoid Inductor In A Substrate App 20150130021 - Kim; Daeik Daniel ; et al. | 2015-05-14 |
| Embedded Layered Inductor App 20150124418 - Song; Young Kyu ; et al. | 2015-05-07 |
| Asymmetric Unbalanced Acoustically Coupled Resonators For Spurious Mode Suppression App 20150115777 - YUN; Changhan Hobie ; et al. | 2015-04-30 |
| Toroid Inductor In An Integrated Device App 20150115403 - Song; Young Kyu ; et al. | 2015-04-30 |
| Connector Placement For A Substrate Integrated With A Toroidal Inductor App 20150092314 - Kim; Daeik Daniel ; et al. | 2015-04-02 |
| Low Package Parasitic Inductance Using A Thru-substrate Interposer App 20150070863 - YUN; Changhan Hobie ; et al. | 2015-03-12 |
| Varying Thickness Inductor App 20150061813 - Kim; Daeik Daniel ; et al. | 2015-03-05 |
| Integrated Passive Device (ipd) On Subtrate App 20150048480 - Kim; Daeik Daniel ; et al. | 2015-02-19 |
| Thick Conductive Stack Plating Process With Fine Critical Dimension Feature Size For Compact Passive On Glass Technology App 20150014812 - LAN; Je-Hsiung ; et al. | 2015-01-15 |
| Compact 3-d Coplanar Transmission Lines App 20140361854 - Kim; Daeik Daniel ; et al. | 2014-12-11 |
| Design For High Pass Filters And Low Pass Filters Using Through Glass Via Technology App 20140354378 - ZUO; Chengjie ; et al. | 2014-12-04 |
| High Density, Low Loss 3-d Through-glass Inductor With Magnetic Core App 20140247269 - Berdy; David Francis ; et al. | 2014-09-04 |
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