Kim; Dae-sig

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kim; Dae-sig.The latest application filed is for "thin film including multi components and method of forming the same".

Company Profile

0.6.5

Kim; Dae-sig - Seongnam KR
Kim, Dae-sig - Seongnam-city KR
Kim; Dae Sig - Kyungki-Do KR
Kim, Dae-Sig - Seognam-city KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Thin film including multi components and method of forming the same Grant 7,709,377 - Lee , et al. May 4, 2	2010-05-04
Thin film including multi components and method of forming the same App 20050260348 - Lee, Jung-hyun ; et al.	2005-11-24
Atomic layer deposition using organometallic complex with .beta.-diketone ligand Grant 6,752,869 - Lee , et al. June 22, 2	2004-06-22
Group IV metal precursors and a method of chemical vapor deposition using the same Grant 6,689,427 - Min , et al. February 10, 2	2004-02-10
Atomic layer deposition method using a novel group IV metal precursor Grant 6,669,990 - Min , et al. December 30, 2	2003-12-30
Atomic layer deposition method using a novel group IV metal precursor App 20030012876 - Min, Yo Sep ; et al.	2003-01-16
Atomic layer deposition using organometallic complex with beta-diketone ligand App 20030008072 - Lee, Jung-Hyun ; et al.	2003-01-09
Thin film including multi components and method of forming the same App 20020168553 - Lee, Jung-Hyun ; et al.	2002-11-14
Bubbler Grant 6,424,800 - Kim July 23, 2	2002-07-23
Novel group IV metal precursors and a method of chemical vapor deposition using the same App 20020058843 - Min, Yo Sep ; et al.	2002-05-16
Bubbler for solid metal-organic percursors Grant 5,603,169 - Kim February 18, 1	1997-02-18

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