Kim; Da Hee
Patent Applications and Registrations
Patent applications and USPTO patent grants for Kim; Da Hee.The latest application filed is for "fan-out semiconductor package".
- Kim; Da Hee - Suwon-si KR
- Kim; Da-Hee - Seoul KR
- Kim; Da Hee - Suwon KR
- Kim; Da Hee - Gyunggi-do KR
| Patent | Date |
|---|---|
| Fan-out semiconductor package Grant 11,121,066 - Kim , et al. September 14, 2 | 2021-09-14 |
| Semiconductor package Grant 10,872,863 - Choi , et al. December 22, 2 | 2020-12-22 |
| Fan-out semiconductor package Grant 10,770,418 - Kim , et al. Sep | 2020-09-08 |
| Semiconductor package Grant 10,692,805 - Kim | 2020-06-23 |
| Semiconductor package with improved flatness of an insulating layer formed on patterns Grant 10,622,273 - Choi , et al. | 2020-04-14 |
| Fan-out Semiconductor Package App 20200091054 - Kim; Da Hee ; et al. | 2020-03-19 |
| Semiconductor Package App 20200075492 - CHOI; Joo Young ; et al. | 2020-03-05 |
| Fan-out semiconductor package Grant 10,573,613 - Kim , et al. Feb | 2020-02-25 |
| Fan-out semiconductor package Grant 10,522,451 - Kim , et al. Dec | 2019-12-31 |
| Fan-out semiconductor package Grant 10,403,583 - Kim Sep | 2019-09-03 |
| Fan-out semiconductor package Grant 10,402,620 - Kim , et al. Sep | 2019-09-03 |
| Semiconductor Package App 20190206756 - KIM; Joon Sung ; et al. | 2019-07-04 |
| Semiconductor Package App 20190206783 - KIM; Da Hee | 2019-07-04 |
| Semiconductor Package App 20190206755 - CHOI; Joo Young ; et al. | 2019-07-04 |
| Fan-out Semiconductor Package App 20190139920 - LEE; Doo Hwan ; et al. | 2019-05-09 |
| Fan-out Semiconductor Package App 20190130152 - KIM; Byung Ho ; et al. | 2019-05-02 |
| Fan-out semiconductor package Grant 10,211,136 - Kim , et al. Feb | 2019-02-19 |
| Fan-out Semiconductor Package App 20190051619 - KIM; Da Hee | 2019-02-14 |
| Fan-out Semiconductor Package App 20180342449 - KIM; Da Hee ; et al. | 2018-11-29 |
| Fan-out Semiconductor Package App 20180197832 - KIM; Da Hee ; et al. | 2018-07-12 |
| Fan-out Semiconductor Package App 20180096927 - KIM; Da Hee ; et al. | 2018-04-05 |
| Fan-out Semiconductor Package App 20180061794 - KIM; Da Hee ; et al. | 2018-03-01 |
| Printed circuit board, electronic module and method of manufacturing the same Grant 9,706,668 - Kim , et al. July 11, 2 | 2017-07-11 |
| Printed Circuit Board, Electronic Module And Method Of Manufacturing The Same App 20160120060 - KIM; Da-Hee ; et al. | 2016-04-28 |
| Detach Core Substrate And Method For Manufacturing Thereof App 20160081195 - CHO; Yong Yoon ; et al. | 2016-03-17 |
| Printed Circuit Board And Method Of Manufacturing The Same App 20160021736 - HAN; Gi Ho ; et al. | 2016-01-21 |
| Printed Circuit Board And Method Of Manufacturing Printed Circuit Board App 20150129291 - JEONG; Sung Won ; et al. | 2015-05-14 |
| Printed Circuit Board And Method For Manufacturing The Same App 20150101857 - KIM; Da Hee ; et al. | 2015-04-16 |
| Interposer And Semiconductor Package Using The Same, And Method Of Manufacturing Interposer App 20150061093 - KIM; Ki Hwan ; et al. | 2015-03-05 |
| Multi-layer Type Coreless Substrate And Method Of Manufacturing The Same App 20140102766 - Kim; Da Hee ; et al. | 2014-04-17 |
| Multi-layer Type Printed Circuit Board And Method Of Manufacturing The Same App 20140102767 - Kang; Myung Sam ; et al. | 2014-04-17 |
| Multilayer Type Coreless Substrate And Method Of Manufacturing The Same App 20140027156 - Kim; Ki Hwan ; et al. | 2014-01-30 |
| Coreless Subtrate And Method Of Manufacturing The Same App 20140014398 - Kim; Ki Hwan ; et al. | 2014-01-16 |
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