Kim; Choong Hoe

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kim; Choong Hoe.The latest application filed is for "hybrid bonding interconnection using laser and thermal compression".

Company Profile

2.4.7

Kim; Choong Hoe - Seoul KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Laser Bonded Devices, Laser Bonding Tools, And Related Methods App 20210398936 - Park; Dong Hyeon ; et al.	2021-12-23
Hybrid Bonding Interconnection Using Laser And Thermal Compression App 20210398940 - Kim; Min Ho ; et al.	2021-12-23
System And Method For Laser Assisted Bonding Of An Electronic Device App 20210082717 - Yoon; Tae Ho ; et al.	2021-03-18
System and method for laser assisted bonding of an electronic device Grant 10,763,129 - Yoon , et al. Sep	2020-09-01
System And Method For Laser Assisted Bonding Of An Electronic Device App 20190287816 - Yoon; Tae Ho ; et al.	2019-09-19
System and method for laser assisted bonding of semiconductor die Grant 10,304,698 - Yoon , et al.	2019-05-28
System And Method For Laser Assisted Bonding Of Semiconductor Die App 20180204740 - Yoon; Tae Ho ; et al.	2018-07-19
System and method for laser assisted bonding of semiconductor die Grant 9,916,989 - Yoon , et al. March 13, 2	2018-03-13
System And Method For Laser Assisted Bonding Of Semiconductor Die App 20170301560 - Yoon; Tae Ho ; et al.	2017-10-19
Laser assisted bonding for semiconductor die interconnections Grant 9,627,348 - Ryu , et al. April 18, 2	2017-04-18
Laser Assisted Bonding For Semiconductor Die Interconnections App 20160049381 - Ryu; Dong Su ; et al.	2016-02-18

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