loadpatents
name:-0.01042103767395
name:-0.0092289447784424
name:-0.00052905082702637
KIM; Chong Ho Patent Filings

KIM; Chong Ho

Patent Applications and Registrations

Patent applications and USPTO patent grants for KIM; Chong Ho.The latest application filed is for "usb based cloud disk and disk segment management system".

Company Profile
0.8.9
  • KIM; Chong Ho - Gimpo-si KR
  • Kim; Chong Ho - Gumi-si KR
  • Kim; Chong Ho - Chungcheongbuk-do KR
  • Kim; Chong-Ho - Cheongju-si KR
  • Kim; Chong-Ho - Chungchungbuk-do KR
  • Kim; Chong-Ho - Rockville MA
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
USB based cloud disk and disk segment management system
App 20210294532 - KIM; Chong Ho
2021-09-23
Backlight unit
Grant 7,758,228 - Kim July 20, 2
2010-07-20
Via hole having fine hole land and method for forming the same
Grant 7,629,692 - Kim , et al. December 8, 2
2009-12-08
Method for forming via hole having fine hole land
App 20080209722 - Kim; Chong Ho ;   et al.
2008-09-04
Method of fabricating printed circuit board having thin core layer
Grant 7,346,982 - Kim , et al. March 25, 2
2008-03-25
System for and method of analyzing surface condition of PCB using RGB colors
Grant 7,298,887 - Lee , et al. November 20, 2
2007-11-20
Via hole having fine hole land and method for forming the same
App 20070132087 - Kim; Chong Ho ;   et al.
2007-06-14
Method of fabricating printed circuit board having thin core layer
App 20060121256 - Kim; Chong Ho ;   et al.
2006-06-08
Package substrate manufactured using electrolytic leadless plating process, and method for manufacturing the same
Grant 7,030,500 - Shin , et al. April 18, 2
2006-04-18
Backlight unit
App 20060002150 - Kim; Chong Ho
2006-01-05
Package substrate manufactured using electrolytic leadless plating process, and method for manufacturing the same
App 20050194696 - Shin, Young-Hwan ;   et al.
2005-09-08
Package substrate manufactured using electrolytic leadless plating process, and method for manufacturing the same
Grant 6,852,625 - Shin , et al. February 8, 2
2005-02-08
System for and method of analyzing surface condition of PCB using RGB colors
App 20040234119 - Lee, Hyo-Soo ;   et al.
2004-11-25
Package substrate manufactured using electrolytic leadless plating process, and method for manufacturing the same
App 20040113244 - Shin, Young-Hwan ;   et al.
2004-06-17
In vivo binding pair pretargeting
Grant 5,807,534 - Pomato , et al. September 15, 1
1998-09-15
Site specific in vivo activation of therapeutic drugs
Grant 5,433,955 - Bredehorst , et al. July 18, 1
1995-07-18

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