| Patent | Date |
|---|
Sub-module L-shaped Millimeter Wave Antenna-in-package
App 20220131281 - SHAH; Milind ; et al. | 2022-04-28 |
Integrated Circuit (ic) Package Substrate With Embedded Trace Substrate (ets) Layer On A Substrate, And Related Fabrication Methods
App 20220068780 - Kang; Kuiwon ; et al. | 2022-03-03 |
Asymmetric antenna structure
Grant 11,258,165 - We , et al. February 22, 2 | 2022-02-22 |
Sub-module L-shaped millimeter wave antenna-in-package
Grant 11,239,573 - Shah , et al. February 1, 2 | 2022-02-01 |
Sub-module L-shaped Millimeter Wave Antenna-in-package
App 20210376493 - SHAH; Milind ; et al. | 2021-12-02 |
Radio-frequency (rf) Integrated Circuit (ic) (rfic) Packages Employing A Substrate Sidewall Partial Shield For Electro-magnetic Interference (emi) Shielding, And Related Fabrication Methods
App 20210366838 - Han; Jeahyeong ; et al. | 2021-11-25 |
Substrate comprising recessed interconnects and a surface mounted passive component
Grant 11,075,260 - Kang , et al. July 27, 2 | 2021-07-27 |
Enhanced antenna module with shield layer
Grant 11,043,740 - Hwang , et al. June 22, 2 | 2021-06-22 |
Package Comprising Discrete Antenna Device
App 20210091017 - YEON; Jaehyun ; et al. | 2021-03-25 |
Enhanced Antenna Module With Shield Layer
App 20200365983 - HWANG; Suhyung ; et al. | 2020-11-19 |
High aspect ratio interconnects in air gap of antenna package
Grant 10,734,332 - Lasiter , et al. | 2020-08-04 |
Uniform Via Pad Structure
App 20200219803 - KANG; Kuiwon ; et al. | 2020-07-09 |
Asymmetric Antenna Structure
App 20200212545 - WE; Hong Bok ; et al. | 2020-07-02 |
Substrate Comprising Recessed Interconnects And A Surface Mounted Passive Component
App 20200135839 - KANG; Kuiwon ; et al. | 2020-04-30 |
Integrated Circuit Cavity Formation With Multiple Interconnection Pads
App 20200091062 - YEON; Jaehyun ; et al. | 2020-03-19 |
Integrated device comprising embedded package on package (PoP) device
Grant 10,510,733 - Kumar , et al. Dec | 2019-12-17 |
Integrated Circuit Chip Package Having Reduced Contact Pad Size
App 20190371652 - WE; Hong Bok ; et al. | 2019-12-05 |
Tapered Corner Package For Emi Shield
App 20190341352 - WE; Hong Bok ; et al. | 2019-11-07 |
Power amplifier with RF structure
Grant 10,431,511 - Kim , et al. O | 2019-10-01 |
Thermal and electromagnetic interference shielding for die embedded in package substrate
Grant 10,410,971 - Rae , et al. Sept | 2019-09-10 |
Array type inductor
Grant 10,403,707 - We , et al. Sep | 2019-09-03 |
Backside drill embedded die substrate
Grant 10,325,855 - Kim , et al. | 2019-06-18 |
INTEGRATED DEVICE COMPRISING EMBEDDED PACKAGE ON PACKAGE (PoP) DEVICE
App 20190081027 - KUMAR; Rajneesh ; et al. | 2019-03-14 |
Thermal And Electromagnetic Interference Shielding For Die Embedded In Package Substrate
App 20190067205 - RAE; David Fraser ; et al. | 2019-02-28 |
High Aspect Ratio Interconnects In Air Gap Of Antenna Package
App 20190067221 - LASITER; Jon Bradley ; et al. | 2019-02-28 |
Integrated device comprising embedded package on package (PoP) device
Grant 10,163,871 - Kumar , et al. Dec | 2018-12-25 |
Power Amplifier With Rf Structure
App 20180316319 - KIM; Daeik Daniel ; et al. | 2018-11-01 |
Array Type Inductor
App 20180286562 - WE; Hong Bok ; et al. | 2018-10-04 |
Package-on-Package (PoP) device comprising a gap controller between integrated circuit (IC) packages
Grant 9,947,642 - Kumar , et al. April 17, 2 | 2018-04-17 |
Reinforced wafer level package comprising a core layer for reducing stress in a solder joint and improving solder joint reliability
Grant 9,806,063 - Kim , et al. October 31, 2 | 2017-10-31 |
Backside Drill Embedded Die Substrate
App 20170271266 - Kim; Daeik ; et al. | 2017-09-21 |
Conductive post protection for integrated circuit packages
Grant 9,768,108 - Fu , et al. September 19, 2 | 2017-09-19 |
Substrate and method of forming the same
Grant 9,679,841 - Jomaa , et al. June 13, 2 | 2017-06-13 |
Embedded bridge structure in a substrate
Grant 9,642,259 - Kim , et al. May 2, 2 | 2017-05-02 |
INTEGRATED DEVICE COMPRISING EMBEDDED PACKAGE ON PACKAGE (PoP) DEVICE
App 20170098634 - Kumar; Rajneesh ; et al. | 2017-04-06 |
PACKAGE-ON-PACKAGE (PoP) DEVICE COMPRISING A GAP CONTROLLER BETWEEN INTEGRATED CIRCUIT (IC) PACKAGES
App 20170098633 - Kumar; Rajneesh ; et al. | 2017-04-06 |
Package substrate comprising surface interconnect and cavity comprising electroless fill
Grant 9,609,751 - Jomaa , et al. March 28, 2 | 2017-03-28 |
On-package Connector
App 20170084523 - FU; Jie ; et al. | 2017-03-23 |
Semiconductor package with embedded components and method of making the same
Grant 9,601,435 - Kim , et al. March 21, 2 | 2017-03-21 |
Reinforced Wafer Level Package Comprising A Core Layer For Reducing Stress In A Solder Joint And Improving Solder Joint Reliability
App 20160322332 - Kim; Chin-Kwan ; et al. | 2016-11-03 |
Package-on-package structure with reduced height
Grant 9,484,327 - Kim , et al. November 1, 2 | 2016-11-01 |
Conductive Post Protection For Integrated Circuit Packages
App 20160247754 - FU; Jie ; et al. | 2016-08-25 |
Semiconductor Package With Embedded Components And Method Of Making The Same
App 20160218064 - KIM; Chin-Kwan ; et al. | 2016-07-28 |
System, apparatus, and method for split die interconnection
Grant 9,379,090 - Syed , et al. June 28, 2 | 2016-06-28 |
Package substrate with testing pads on fine pitch traces
Grant 9,370,097 - Kim , et al. June 14, 2 | 2016-06-14 |
Semiconductor package interconnections and method of making the same
Grant 9,355,963 - Kim , et al. May 31, 2 | 2016-05-31 |
Integrated Device Package Comprising Heterogeneous Solder Joint Structure
App 20160148864 - Fu; Jie ; et al. | 2016-05-26 |
Semiconductor Package Interconnections And Method Of Making The Same
App 20160093571 - KIM; Dong Wook ; et al. | 2016-03-31 |
System, Apparatus, And Method Of Interconnection In A Substrate
App 20160093567 - KIM; Chin-Kwan ; et al. | 2016-03-31 |
Flexible Film Electrical-test Substrates With Conductive Coupling Post(s) For Integrated Circuit (ic) Bump(s) Electrical Testing, And Related Methods And Testing Apparatuses
App 20160091532 - Song; Young Kyu ; et al. | 2016-03-31 |
Pattern between pattern for low profile substrate
Grant 9,269,610 - We , et al. February 23, 2 | 2016-02-23 |
Surface finish on trace for a thermal compression flip chip (TCFC)
Grant 9,269,681 - Jomaa , et al. February 23, 2 | 2016-02-23 |
Substrate And Method Of Forming The Same
App 20150333004 - JOMAA; Houssam Wafic ; et al. | 2015-11-19 |
Package Substrate Comprising Surface Interconnect And Cavity Comprising Electroless Fill
App 20150296616 - Jomaa; Houssam Wafic ; et al. | 2015-10-15 |
Pattern Between Pattern For Low Profile Substrate
App 20150294933 - We; Hong Bok ; et al. | 2015-10-15 |
Ultra fine pitch and spacing interconnects for substrate
Grant 9,159,670 - Kim , et al. October 13, 2 | 2015-10-13 |
Substrate comprising inorganic material that lowers the coefficient of thermal expansion (CTE) and reduces warpage
Grant 9,155,191 - Kim October 6, 2 | 2015-10-06 |
Substrate And Method Of Forming The Same
App 20150206812 - KIM; Chin-Kwan ; et al. | 2015-07-23 |
Low Cost Connector For High Speed, High Density Signal Delivery
App 20150187731 - KIM; Dong Wook ; et al. | 2015-07-02 |
Embedded Bridge Structure In A Substrate
App 20150116965 - Kim; Chin-Kwan ; et al. | 2015-04-30 |
Ultra Fine Pitch And Spacing Interconnects For Substrate
App 20150061143 - Kim; Chin-Kwan ; et al. | 2015-03-05 |
Substrate Comprising Inorganic Material That Lowers The Coefficient Of Thermal Expansion (cte) And Reduces Warpage
App 20140356635 - Kim; Chin-Kwan | 2014-12-04 |
Barrier Layer On Bump And Non-wettable Coating On Trace
App 20140322868 - Bchir; Omar James ; et al. | 2014-10-30 |
Package-on-package Structure With Reduced Height
App 20140264946 - Kim; Chin-Kwan ; et al. | 2014-09-18 |
Package Substrate With Testing Pads On Fine Pitch Traces
App 20140247573 - Kim; Chin-Kwan ; et al. | 2014-09-04 |
Barrier layer on bump and non-wettable coating on trace
Grant 8,802,556 - Bchir , et al. August 12, 2 | 2014-08-12 |
Ultra fine pitch and spacing interconnects for substrate
Grant 8,772,951 - Kim , et al. July 8, 2 | 2014-07-08 |
Anchoring A Trace On A Substrate To Reduce Peeling Of The Trace
App 20140175658 - Kim; Chin-Kwan ; et al. | 2014-06-26 |
Package Having Thermal Compression Flip Chip (tcfc) And Chip With Reflow Bonding On Lead
App 20140159238 - Aldrete; Manuel ; et al. | 2014-06-12 |
Surface Finish On Trace For A Thermal Compression Flip Chip (tcfc)
App 20140138831 - Jomaa; Houssam W. ; et al. | 2014-05-22 |
Barrier Layer On Bump And Non-wettable Coating On Trace
App 20140131857 - Bchir; Omar J. ; et al. | 2014-05-15 |
Printed circuit board and semiconductor package with the same
Grant 8,253,034 - Kim , et al. August 28, 2 | 2012-08-28 |
Printed circuit board
Grant 8,080,741 - Kang , et al. December 20, 2 | 2011-12-20 |
Printed Circuit Board And Method Of Manufacturing The Same
App 20110297423 - NOH; Seung Hyun ; et al. | 2011-12-08 |
Printed circuit board and semiconductor package with the same
App 20110286191 - Kim; Byoung Chan ; et al. | 2011-11-24 |
Printed circuit board
App 20090133902 - Kim; Chin-Kwan ; et al. | 2009-05-28 |
Printed circuit board
App 20090097220 - Lee; Young-Mi ; et al. | 2009-04-16 |
Printed circuit board and manufacturing method thereof
App 20090027864 - Cho; Chung-Woo ; et al. | 2009-01-29 |
Printed circuit board
App 20080314633 - Kang; Myung Sam ; et al. | 2008-12-25 |
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