Kim; Chi Seong

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kim; Chi Seong.The latest application filed is for "substrate with electronic component embedded therein".

Company Profile

2.6.10

Kim; Chi Seong - Suwon-si KR
Kim; Chi Seong - Gyeonggi-do KR
Kim; Chi Seong - Suwon KR
Kim; Chi Seong - Gyunggi-do KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Substrate With Electronic Component Embedded Therein App 20220022310 - Park; Chang Hwa ; et al.	2022-01-20
Coil electronic component Grant 10,902,994 - Kim , et al. January 26, 2	2021-01-26
Coil Electronic Component App 20190115145 - KIM; Chi Seong ; et al.	2019-04-18
Electroless surface treatment plated layers of printed circuit board and method for preparing the same Grant 9,743,508 - Lee , et al. August 22, 2	2017-08-22
Electroless Surface Treatment Plated Layers Of Printed Circuit Board And Method For Preparing The Same App 20150382452 - LEE; Dong Jun ; et al.	2015-12-31
Electroless surface treatment plated layers of printed circuit board and method for preparing the same Grant 9,150,002 - Lee , et al. October 6, 2	2015-10-06
Electrode pad, printed circuit board using the same, and method of manufacturing printed circuit board Grant 8,946,911 - Pang , et al. February 3, 2	2015-02-03
Electrode Pad, Printed Circuit Board Using The Same, And Method Of Manufacturing Printed Circuit Board App 20140087205 - PANG; Jung Youn ; et al.	2014-03-27
Circuit Board And Method For Manufacturing The Same App 20140069694 - CHO; Seong Min ; et al.	2014-03-13
Electroless Surface Treatment Plated Layers Of Printed Circuit Board And Method For Preparing The Same App 20130003332 - Lee; Dong Jun ; et al.	2013-01-03
Printed Circuit Board And Method For Manufacturing The Same App 20130000960 - LEE; Dong Jun ; et al.	2013-01-03
Method for manufacturing package on package with cavity App 20100006446 - Kim; Chi-Seong ; et al.	2010-01-14
Method of manufacturing printed circuit board for fine circuit formation Grant 7,562,447 - Lee , et al. July 21, 2	2009-07-21
Method of manufacturing printed circuit board for fine circuit formation App 20070264755 - Lee; Choon Keun ; et al.	2007-11-15
Printed circuit board having inner via hole and manufacturing method thereof App 20070199735 - Kim; Chi-Seong ; et al.	2007-08-30

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