loadpatents
name:-0.21870398521423
name:-0.025851964950562
name:-0.019228935241699
KIM; Byung Moon Patent Filings

KIM; Byung Moon

Patent Applications and Registrations

Patent applications and USPTO patent grants for KIM; Byung Moon.The latest application filed is for "air suspension apparatus for vehicle seats".

Company Profile
1.6.15
  • KIM; Byung Moon - Jeonju-si KR
  • Kim; Byung Moon - Jeonju KR
  • Kim; Byung-Moon - Busan KR
  • Kim; Byung Moon - Seoul KR
  • Kim; Byung-Moon - Gyeongsangnam-do KR
  • Kim; Byung-Moon - Goyang-si N/A KR
  • KIM; Byung Moon - Suwon KR
  • Kim; Byung Moon - Gyunggi-do KR
  • Kim; Byung-Moon - Goyano-si KR
  • Kim; Byung Moon - Suwon-si KR
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Air Suspension Apparatus For Vehicle Seats
App 20220161699 - KIM; Byung Moon
2022-05-26
System And Method For Loading Cargo In Vehicle
App 20210380358 - Kim; Byung Moon
2021-12-09
Printed circuit board and manufacturing method thereof
Grant 9,674,944 - Kim , et al. June 6, 2
2017-06-06
Printed Circuit Board And Manufacturing Method Thereof
App 20170006700 - KIM; Byung-Moon ;   et al.
2017-01-05
Self-expanding Stent Transfer Device
App 20160220402 - Kim; Dong Joon ;   et al.
2016-08-04
Articulator
App 20160220336 - Byun; Tae-Hee ;   et al.
2016-08-04
Method of manufacturing component embedded printed circuit board
Grant 8,683,684 - Cho , et al. April 1, 2
2014-04-01
Carrier For Manufacturing Substrate and Method Of Manufacturing Substrate Using The Same
App 20130243995 - KIM; Jin Ho ;   et al.
2013-09-19
Carrier for manufacturing substrate and method of manufacturing substrate using the same
Grant 8,435,376 - Kim , et al. May 7, 2
2013-05-07
Method Of Manufacturing Coreless Substrate
App 20120324723 - Hong; Myeong Ho ;   et al.
2012-12-27
Method of manufacturing component embedded printed circuit board
App 20120030940 - Cho; Suk-Hyeon ;   et al.
2012-02-09
Method For Preparing Recombinant Peptide From Spider Venom And Method For Relieving Pain
App 20120015886 - OH; UhTaek ;   et al.
2012-01-19
Component embedded printed circuit board
Grant 8,064,217 - Cho , et al. November 22, 2
2011-11-22
Carrier For Manufacturing Substrate And Method Of Manufacturing Substrate Using The Same
App 20110159282 - KIM; Jin Ho ;   et al.
2011-06-30
Method of manufacturing printed circuit board
App 20110079349 - Cho; Suk Hyeon ;   et al.
2011-04-07
Printed Circuit Board Having A Bump And A Method Of Manufacturing The Same
App 20110048786 - Cho; Suk Hyeon ;   et al.
2011-03-03
Method For Preparing Recombinant Peptide From Spider Venom and Analgesic Composition Containing The Peptide
App 20090023183 - Oh; UhTaek ;   et al.
2009-01-22
Method of manufacturing as component embedded printed circuit board
App 20080055863 - Cho; Suk-Hyeon ;   et al.
2008-03-06
Printed circuit board and method of manufacturing the same
App 20080000680 - Cho; Suk Hyeon ;   et al.
2008-01-03

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