KIM; Bo Seong

Patent Applications and Registrations

Patent applications and USPTO patent grants for KIM; Bo Seong.The latest application filed is for "method for manufacturing solar cell panel comprising prepreg by means of autoclave".

Company Profile

2.9.17

KIM; Bo Seong - Gyeongsangnam-do KR
KIM; Bo Seong - Yongin-si KR
Kim; Bo Seong - Chungcheongnam-do KR
KIM; Bo-Seong - Seongnam-si KR
KIM; Bo Seong - Hongseong-gun KR
Kim; Bo Seong - Suwon-si KR
KIM; Bo-Seong - Gyeonggi-do KR
Kim; Bo-Seong - Asan-si KR
Kim; Bo-Seong - Seoul N/A KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method For Manufacturing Solar Cell Panel Comprising Prepreg By Means Of Autoclave App 20220223752 - HONG; Sung Min ; et al.	2022-07-14
Light Emitting Display Device App 20220209160 - LIM; Dong Hyeok ; et al.	2022-06-30
Display device Grant 11,209,698 - Kim , et al. December 28, 2	2021-12-28
Semiconductor Package And Method Of Manufacturing The Semiconductor Package App 20210343691 - KANG; Tae-Ho ; et al.	2021-11-04
Display Device App 20200124920 - KIM; Bo Seong ; et al.	2020-04-23
Semiconductor Package And Method Of Manufacturing The Semiconductor Package App 20200118993 - KANG; Tae-ho ; et al.	2020-04-16
Method and apparatus for supporting secure chat Grant 10,484,347 - Kim , et al. Nov	2019-11-19
Organic light-emitting device with electron blocking layer and trapping layer and organic light-emitting display using the same Grant 10,483,474 - Kim Nov	2019-11-19
Semiconductor Package And Method Of Manufacturing The Semiconductor Package App 20180122789 - KANG; Tae-Ho ; et al.	2018-05-03
Organic Light-Emitting Device and Organic Light-Emitting Display Using the Same App 20180033990 - Kim; Bo-Seong	2018-02-01
Device And Method For Providing Message Service App 20170048180 - KIM; Bo-Seong ; et al.	2017-02-16
Method And Apparatus For Supporting Secure Chat App 20170012950 - KIM; Bo Seong ; et al.	2017-01-12
Optical connector and stack module including the same Grant 9,246,591 - Kim , et al. January 26, 2	2016-01-26
Semiconductor package having plural semiconductor chips and method of forming the same Grant 8,664,780 - Han , et al. March 4, 2	2014-03-04
Optical Connector and Stack Module Including the Same App 20130294778 - Kim; Bo-Seong ; et al.	2013-11-07
Semiconductor Package Having Plural Semiconductor Chips And Method Of Forming The Same App 20130049221 - HAN; CHANG-HOON ; et al.	2013-02-28
Multi-chip package and method of manufacturing thereof Grant 8,362,624 - Kang , et al. January 29, 2	2013-01-29
Multi-chip Package And Method Of Manufacturing Thereof App 20120139125 - Kang; Tae-Ho ; et al.	2012-06-07
Semiconductor chip package and method of manufacturing the same App 20080164619 - Lee; Cheol-Woo ; et al.	2008-07-10
Adhesive Sheet, Semiconductor Device Having The Same, Multi-stacked Package Having The Same, And Methods Of Manufacturing A Semiconductor Device And A Multi-stacked Package App 20070138605 - Nam; Tae-Duk ; et al.	2007-06-21
Method of forming a solder ball on a board and the board Grant 7,213,329 - Kim , et al. May 8, 2	2007-05-08
Semiconductor package having lead free conductive bumps and method of manufacturing the same App 20070001284 - Kim; Bo-Seong ; et al.	2007-01-04
Method of forming a solder ball on a board and the board App 20060035453 - Kim; Seung-Woo ; et al.	2006-02-16

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