Kilpatrick; Stephen

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kilpatrick; Stephen.The latest application filed is for "interconnections for flip-chip using lead-free solders and having reaction barrier layers".

Company Profile

0.6.9

Kilpatrick; Stephen - Olney MD
Kilpatrick; Stephen - Lagrangeville NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Interconnections For Flip-chip Using Lead-free Solders And Having Reaction Barrier Layers App 20120012642 - Fogel; Keith E. ; et al.	2012-01-19
Interconnections for flip-chip using lead-free solders and having reaction barrier layers Grant 8,026,613 - Fogel , et al. September 27, 2	2011-09-27
Interconnections for flip-chip using lead-free solders and having reaction barrier layers Grant 7,923,849 - Fogel , et al. April 12, 2	2011-04-12
Interconnections For Flip-chip Using Lead-free Solders And Having Reaction Barrier Layers App 20080202792 - Fogel; Keith E. ; et al.	2008-08-28
Interconnections For Flip-chip Using Lead-free Solders And Having Reaction Barrier Layers App 20080203585 - Fogel; Keith E. ; et al.	2008-08-28
Interconnections For Flip-chip Using Lead-free Solders And Having Reaction Barrier Layers App 20080206979 - Fogel; Keith E. ; et al.	2008-08-28
Interconnections for flip-chip using lead-free solders and having reaction barrier layers Grant 7,410,833 - Fogel , et al. August 12, 2	2008-08-12
Immersion plating and plated structures Grant 7,276,296 - Cooper , et al. October 2, 2	2007-10-02
Immersion plating and plated structures Grant 7,037,559 - Cooper , et al. May 2, 2	2006-05-02
Immersion plating and plated structures App 20050238906 - Cooper, Emanuel I. ; et al.	2005-10-27
Interconnections for flip-chip using lead-free solders and having reaction barrier layers App 20050224966 - Fogel, Keith E. ; et al.	2005-10-13
Stabilizing Copper Overlayer For Enhanced C4 Interconnect Reliability App 20050104208 - Bartelo, James C. ; et al.	2005-05-19
Dual-solder flip-chip solder bump Grant 6,893,799 - Danovitch , et al. May 17, 2	2005-05-17
Immersion plating and plated structures App 20040219384 - Cooper, Emanuel I. ; et al.	2004-11-04
Dual-solder Flip-chip Solder Bump App 20040175657 - Danovitch, David ; et al.	2004-09-09

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