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Patent applications and USPTO patent grants for Kilgo; Marvin M. III.The latest application filed is for "integrated circuit packaging using electrochemically fabricated structures".
Patent | Date |
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Integrated circuit packaging using electrochemically fabricated structures App 20060134831 - Cohen; Adam L. ;   et al. | 2006-06-22 |
Electrochemical fabrication process including process monitoring, making corrective action decisions, and taking appropriate actions App 20050202660 - Cohen, Adam L. ;   et al. | 2005-09-15 |
Electrochemical fabrication method for producing compliant beam-like structures App 20050053849 - Cohen, Adam L. ;   et al. | 2005-03-10 |
Methods and apparatus for forming multi-layer structures using adhered masks App 20050023145 - Cohen, Adam L. ;   et al. | 2005-02-03 |
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