| Patent | Date |
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Radio-frequency device with radio-frequency signal carrying element and associated production method
Grant 11,416,730 - Rieder , et al. August 16, 2 | 2022-08-16 |
Semiconductor Device Including An Antenna
App 20220148951 - Huynh; Ngoc-Hoa ; et al. | 2022-05-12 |
Semiconductor device including an antenna
Grant 11,195,787 - Huynh , et al. December 7, 2 | 2021-12-07 |
Radio-frequency Device With Radio-frequency Signal Carrying Element And Associated Production Method
App 20210125021 - RIEDER; Bernhard ; et al. | 2021-04-29 |
Method of forming a chip arrangement, chip arrangement, method of forming a chip package, and chip package
Grant 10,930,541 - Kilger , et al. February 23, 2 | 2021-02-23 |
Semiconductor device including a cavity lid
Grant 10,626,012 - Muehlbauer , et al. | 2020-04-21 |
Semiconductor package with a through port for sensor applications
Grant 10,549,985 - Maier , et al. Fe | 2020-02-04 |
Method of Forming a Chip Arrangement, Chip Arrangement, Method of Forming a Chip Package, and Chip Package
App 20190221465 - Kilger; Thomas ; et al. | 2019-07-18 |
Semiconductor Apparatuses With Radio-frequency Line Elements, And Associated Manufacturing Methods
App 20190198455 - HARTNER; Walter ; et al. | 2019-06-27 |
Integrated system and method of making the integrated system
Grant 10,224,317 - Kilger | 2019-03-05 |
Semiconductor Package with a Through Port for Sensor Applications and Methods of Manufacture
App 20180148322 - Maier; Dominic ; et al. | 2018-05-31 |
Chip package and a method of producing the same
Grant 9,981,843 - Maier , et al. May 29, 2 | 2018-05-29 |
Method of packaging integrated circuits
Grant 9,806,056 - Wachter , et al. October 31, 2 | 2017-10-31 |
Integrated System and Method of Making the Integrated System
App 20170278836 - Kilger; Thomas | 2017-09-28 |
Semiconductor Device Including An Antenna
App 20170236776 - Huynh; Ngoc-Hoa ; et al. | 2017-08-17 |
Semiconductor device including a MEMS die and a conductive layer
Grant 9,725,303 - Maier , et al. August 8, 2 | 2017-08-08 |
Package arrangement, a package, and a method of manufacturing a package arrangement
Grant 9,718,678 - Wachter , et al. August 1, 2 | 2017-08-01 |
Integrated system and method of making the integrated system
Grant 9,704,843 - Kilger July 11, 2 | 2017-07-11 |
Method of packaging integrated circuits and a molded package
Grant 9,487,392 - Wachter , et al. November 8, 2 | 2016-11-08 |
Chip Package and a Method of Producing the Same
App 20160311679 - Maier; Dominic ; et al. | 2016-10-27 |
Semiconductor Device Including A Cavity Lid
App 20160297672 - Muehlbauer; Franz-Xaver ; et al. | 2016-10-13 |
Method of Packaging Integrated Circuits
App 20160163674 - Wachter; Ulrich ; et al. | 2016-06-09 |
Package Arrangement, A Package, And A Method Of Manufacturing A Package Arrangement
App 20160090294 - Wachter; Ulrich ; et al. | 2016-03-31 |
Metal redistribution layer for molded substrates
Grant 9,275,878 - Wachter , et al. March 1, 2 | 2016-03-01 |
Method For Forming A Package Arrangement And Package Arrangement
App 20160035677 - Wachter; Ulrich ; et al. | 2016-02-04 |
Integrated System and Method of Making the Integrated System
App 20160005728 - Kilger; Thomas | 2016-01-07 |
Method for fabricating a plurality of semiconductor devices
Grant 9,147,585 - Kilger , et al. September 29, 2 | 2015-09-29 |
Integrated system and method of making the integrated system
Grant 9,136,213 - Kilger September 15, 2 | 2015-09-15 |
Molded semiconductor package with backside die metallization
Grant 9,099,454 - Wachter , et al. August 4, 2 | 2015-08-04 |
System and method for a coreless transformer
Grant 9,041,505 - Beer , et al. May 26, 2 | 2015-05-26 |
Metal Redistribution Layer for Molded Substrates
App 20150091171 - Wachter; Ulrich ; et al. | 2015-04-02 |
Semiconductor Device
App 20150064846 - Kilger; Thomas ; et al. | 2015-03-05 |
Molded Semiconductor Package with Backside Die Metallization
App 20150041967 - Wachter; Ulrich ; et al. | 2015-02-12 |
Method of Packaging Integrated Circuits and a Molded Package
App 20150028435 - Wachter; Ulrich ; et al. | 2015-01-29 |
Semiconductor device
Grant 8,890,284 - Kilger , et al. November 18, 2 | 2014-11-18 |
Method of packaging integrated circuits and a molded substrate with non-functional placeholders embedded in a molding compound
Grant 8,828,807 - Wachter , et al. September 9, 2 | 2014-09-09 |
Semiconductor Device
App 20140239438 - Kilger; Thomas ; et al. | 2014-08-28 |
System and Method for a Coreless Transformer
App 20140070913 - Beer; Gottfried ; et al. | 2014-03-13 |
Integrated System and Method of Making the Integrated System
App 20140036464 - Kilger; Thomas | 2014-02-06 |
System and method for a coreless transformer
Grant 8,552,828 - Beer , et al. October 8, 2 | 2013-10-08 |
Electrical device and method
Grant 7,847,387 - Kilger , et al. December 7, 2 | 2010-12-07 |
Electrical Device And Method
App 20090127638 - Kilger; Thomas ; et al. | 2009-05-21 |
Method for producing a plurality of electronic devices
Grant 7,354,797 - Kilger , et al. April 8, 2 | 2008-04-08 |
Electronic Device With A Plurality Of Substrates And Method For Manufacturing Same
App 20080017985 - Kilger; Thomas | 2008-01-24 |
Method for producing a plurality of electronic devices
App 20060192285 - Kilger; Thomas ; et al. | 2006-08-31 |
Electronic device with external contact elements and method for producing a plurality of the devices
Grant 7,067,915 - Kilger , et al. June 27, 2 | 2006-06-27 |
Electronic device with external contact elements and method for producing a plurality of the devices
App 20040104459 - Kilger, Thomas ; et al. | 2004-06-03 |
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