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Mosaic Focal Plane Array
App 20220310690 - Gulbransen; David J. ; et al. | 2022-09-29 |
Iterative formation of damascene interconnects
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Wafer level shim processing
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Integrating Optical Elements With Electro-optical Sensors Via Direct-bond Hybridization
App 20220157881 - Mustafa; Jamal I. ; et al. | 2022-05-19 |
Close Butted Collocated Variable Technology Imaging Arrays On A Single Roic
App 20220130883 - Kilcoyne; Sean P. ; et al. | 2022-04-28 |
Integrated Circuit Having Vertical Routing To Bond Pads
App 20220115423 - Miller; Eric ; et al. | 2022-04-14 |
3d Modified Surface To Enable Improved Bond Strength And Yield Of Electrical Interconnections
App 20220115348 - Harris; Sean F. ; et al. | 2022-04-14 |
Iterative Formation Of Damascene Interconnects
App 20220013478 - Miller; Eric R. ; et al. | 2022-01-13 |
Method of manufacturing wafer level low melting temperature interconnections
Grant 11,222,813 - Kilcoyne , et al. January 11, 2 | 2022-01-11 |
Imager With Integrated Asynchoronous Laser Pulse Detection
App 20210227158 - Kennedy; Adam M. ; et al. | 2021-07-22 |
Wafer Level Shim Processing
App 20210043665 - Burkhart; Jeffery H. ; et al. | 2021-02-11 |
Stacked sensor with integrated capacitors
Grant 10,879,291 - Malone , et al. December 29, 2 | 2020-12-29 |
Wafer level shim processing
Grant 10,847,569 - Burkhart , et al. November 24, 2 | 2020-11-24 |
Stress compensation and relief in bonded wafers
Grant 10,847,419 - Miller , et al. November 24, 2 | 2020-11-24 |
Wafer Level Shim Processing
App 20200273893 - Burkhart; Jeffery H. ; et al. | 2020-08-27 |
Segmented channel stop grid for crosstalk mitigation in visible imaging arrays
Grant 10,672,826 - Kilcoyne , et al. | 2020-06-02 |
Stacked Sensor With Integrated Capacitors
App 20200168651 - Malone; Neil R. ; et al. | 2020-05-28 |
Method Of Manufacturing Wafer Level Low Melting Temperature Interconnections
App 20200075396 - Kilcoyne; Sean P. ; et al. | 2020-03-05 |
Method of wafer bonding of dissimilar thickness die
Grant 10,515,837 - Kilcoyne , et al. Dec | 2019-12-24 |
Method of manufacturing wafer level low melting temperature interconnections
Grant 10,504,777 - Kilcoyne , et al. Dec | 2019-12-10 |
Segmented Channel Stop Grid For Crosstalk Mitigation In Visible Imaging Arrays
App 20190326346 - Kilcoyne; Sean P. ; et al. | 2019-10-24 |
Stress Compensation And Relief In Bonded Wafers
App 20190287854 - Miller; Scott S. ; et al. | 2019-09-19 |
Hybrid sensor chip assembly and method for reducing radiative transfer between a detector and read-out integrated circuit
Grant 10,418,406 - Kilcoyne , et al. Sept | 2019-09-17 |
Method Of Manufacturing Wafer Level Low Melting Temperature Interconnections
App 20190252244 - Kilcoyne; Sean P. ; et al. | 2019-08-15 |
In-situ Calibration Structures And Methods Of Use In Semiconductor Processing
App 20190214319 - Kilcoyne; Sean P. ; et al. | 2019-07-11 |
In-situ calibration structures and methods of use in semiconductor processing
Grant 10,236,226 - Kilcoyne , et al. | 2019-03-19 |
Method Of Wafer Bonding Of Dissimilar Thickness Die
App 20180301365 - Kilcoyne; Sean P. ; et al. | 2018-10-18 |
Hybrid Sensor Chip Assembly And Method For Reducing Radiative Transfer Between A Detector And Read-out Integrated Circuit
App 20180190705 - Kilcoyne; Sean P. ; et al. | 2018-07-05 |
In-situ Calibration Structures And Methods Of Use In Semiconductor Processing
App 20170271217 - Kilcoyne; Sean P. ; et al. | 2017-09-21 |
Image device having a plurality of detectors in a time delay and integration (TDI) configuration and associated method
Grant 9,100,545 - Vampola , et al. August 4, 2 | 2015-08-04 |
High quantum efficiency optical detectors
Grant 8,294,232 - Vampola , et al. October 23, 2 | 2012-10-23 |
High Quantum Efficiency Optical Detectors
App 20110147878 - Vampola; John L. ; et al. | 2011-06-23 |
Image Device Having a Plurality of Detectors in a Time Delay and Integration (TDI) Configuration and Associated Method
App 20100177224 - Vampola; John L. ; et al. | 2010-07-15 |
Photonic device having an integal guide and method of manufacturing
Grant 6,151,430 - Traver, Jr. , et al. November 21, 2 | 2000-11-21 |
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