Kikuchi; Yuuki

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kikuchi; Yuuki.The latest application filed is for "metal hard mask and method of manufacturing same".

Company Profile

0.4.8

Kikuchi; Yuuki - Nirasaki JP
KIKUCHI; Yuuki - Yamanashi JP
Kikuchi; Yuuki - Nikkou JP
Kikuchi; Yuuki - Tochigi JP
Kikuchi; Yuuki - Nikkou-city JP
Kikuchi; Yuuki - Tochigi-ken JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Integration of a self-forming barrier layer and a ruthenium metal liner in copper metallization Grant 10,157,784 - Yu , et al. Dec	2018-12-18
Metal Hard Mask And Method Of Manufacturing Same App 20170287727 - KIKUCHI; Yuuki ; et al.	2017-10-05
Integration Of A Self-forming Barrier Layer And A Ruthenium Metal Liner In Copper Metallization App 20170236752 - Yu; Kai-Hung L. ; et al.	2017-08-17
Laminated circuit board Grant 7,976,956 - Suzuki , et al. July 12, 2	2011-07-12
Method for preparing a circuit board material having a conductive base and a resistance layer Grant 7,794,578 - Matsuda , et al. September 14, 2	2010-09-14
Conductive Base Material With Thin Film Resistance Layer, Method Of Production Of Conductive Base Material With Thin Film Resistance Layer, And Circuit Board With Thin Film Resistance Layer App 20070228443 - KIKUCHI; Yuuki ; et al.	2007-10-04
Laminated circuit board App 20070110969 - Suzuki; Yuuji ; et al.	2007-05-17
Conductive substrate with resistance layer, resistance board, and resistance circuit board Grant 7,215,235 - Matsuda , et al. May 8, 2	2007-05-08
Laminated Circuit Board App 20070048507 - SUZUKI; Yuuji ; et al.	2007-03-01
Conductive base material with resistance layer and circuit board material with resistance layer App 20050280498 - Kikuchi, Yuuki ; et al.	2005-12-22
Conductive substrate with resistance layer, resistance board, and resistance circuit board App 20040201446 - Matsuda, Akira ; et al.	2004-10-14
Plating bath for forming thin resistance layer, method of formation of resistance layer, conductive base with resistance layer, and circuit board material with resistance layer App 20040144656 - Matsuda, Akira ; et al.	2004-07-29

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