KIKUCHI; Toshimitsu
Patent Applications and Registrations
Patent applications and USPTO patent grants for KIKUCHI; Toshimitsu.The latest application filed is for "block polymer, polymer composition, and adhesive".
- KIKUCHI; Toshimitsu - Tokyo JP
- KIKUCHI; Toshimitsu - Minato-ku JP
- Kikuchi; Toshimitsu - Sendai JP
- KIKUCHI; Toshimitsu - Sendai-shi JP
- Kikuchi; Toshimitsu - Tsukuba-shi JP
| Patent | Date |
|---|---|
| Block Polymer, Polymer Composition, And Adhesive App 20220290017 - KIKUCHI; Toshimitsu ; et al. | 2022-09-15 |
| Block Copolymer And Adhesive App 20220289886 - KIKUCHI; Toshimitsu ; et al. | 2022-09-15 |
| Cross-linked Product And Tire App 20220251351 - ADACHI; Takumi ; et al. | 2022-08-11 |
| Hydrogenated Conjugated Diene Polymer, Polymer Composition, Crosslinked Body And Tire App 20220153971 - ADACHI; Takumi ; et al. | 2022-05-19 |
| Polymer Composition, Crosslinked Body, And Tire App 20220098380 - KIKUCHI; Toshimitsu ; et al. | 2022-03-31 |
| Polymer Composition, Crosslinked Polymer, And Tire App 20210238396 - KIKUCHI; Toshimitsu ; et al. | 2021-08-05 |
| Wavelength conversion member Grant 11,060,020 - Kikuchi , et al. July 13, 2 | 2021-07-13 |
| Wavelength Conversion Member App 20190316034 - KIKUCHI; Toshimitsu ; et al. | 2019-10-17 |
| Substrate for printed wiring and resin composition used therefor Grant 9,028,949 - Okaniwa , et al. May 12, 2 | 2015-05-12 |
| Lithium Ion Capacitor App 20140217322 - Yamada; Kinji ; et al. | 2014-08-07 |
| Substrate For Printed Wiring And Resin Composition Used Therefor App 20120199383 - Okaniwa; Motoki ; et al. | 2012-08-09 |
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