Kikuchi; Katsumi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kikuchi; Katsumi.The latest application filed is for "quantum device".

Company Profile

5.70.90

Kikuchi; Katsumi - Tokyo JP
Kikuchi; Katsumi - Kyoto JP
KIKUCHI; Katsumi - Minato-ku JP
Kikuchi; Katsumi - Aomori JP
Kikuchi; Katsumi - Minato-ko JP
Kikuchi; Katsumi - Kanagawa JP
Kikuchi; Katsumi - Shijonawate JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Measurement time determination device, measurement time determination method, and computer-readable recording medium Grant 11,448,565 - Inoue , et al. September 20, 2	2022-09-20
Leakage inspection device, leakage inspection method, and storage medium Grant 11,402,290 - Shinoda , et al. August 2, 2	2022-08-02
Quantum Device App 20210408354 - KIKUCHI; Katsumi ; et al.	2021-12-30
Quantum Device And Method Of Manufacturing The Same App 20210407928 - NANBA; Kenji ; et al.	2021-12-30
Quantum Device And Method Of Manufacturing The Same App 20210408358 - Nanba; Kenji ; et al.	2021-12-30
Quantum Device App 20210399197 - KIKUCHI; Katsumi ; et al.	2021-12-23
Quantum Device And Method Of Manufacturing The Same App 20210399194 - NANBA; Kenji ; et al.	2021-12-23
Quantum Device App 20210399195 - KIKUCHI; Katsumi ; et al.	2021-12-23
Quantum Device And Method Of Manufacturing The Same App 20210399193 - NANBA; Kenji ; et al.	2021-12-23
Quantum Device App 20210399196 - KIKUCHI; Katsumi ; et al.	2021-12-23
Quantum Device App 20210398893 - KIKUCHI; Katsumi ; et al.	2021-12-23
Fluid Leakage Diagnosing Device, Fluid Leakage Diagnosing System, Fluid Leakage Diagnosing Method, And Recording Medium Storing Fluid Leakage Diagnosing Program App 20210325005 - INOUE; Hirofumi ; et al.	2021-10-21
Fluid Leakage Diagnosis Device, Fluid Leakage Diagnosis System, Fluid Leakage Diagnosis Method, And Recording Medium Storing Fluid Leakage Diagnosis Program App 20210262886 - MATAGA; Junichiro ; et al.	2021-08-26
Estimating Device, Estimating Method, And Program Storing Medium App 20210181057 - INOUE; Hirofumi ; et al.	2021-06-17
Analyzing Device, Analysis Method, And Storage Medium App 20210164859 - SHINODA; Shigeki ; et al.	2021-06-03
Analysis device, analysis method, and recording medium storing a program for deriving information relating to degradation of a pipe Grant 10,996,202 - Kusumoto , et al. May 4, 2	2021-05-04
Leakage Inspection Device, Leakage Inspection Method, And Storage Medium App 20210116323 - SHINODA; Shigeki ; et al.	2021-04-22
Vehicle Grant 10,942,035 - Aiuchi , et al. March 9, 2	2021-03-09
System Identification Device, System Identification Method, And Recording Medium App 20210010980 - TAKATA; Soichiro ; et al.	2021-01-14
Asset Management Device And Asset Management Method App 20200401971 - TOMINAGA; Shin ; et al.	2020-12-24
Analyzing Device, Diagnostic Method, And Program Recording Medium App 20200333223 - INOUE; Hirofumi ; et al.	2020-10-22
Vehicle Grant 10,737,580 - Aiuchi , et al. A	2020-08-11
Sub-mobility device charging system for vehicle Grant 10,732,638 - Aiuchi , et al.	2020-08-04
Sub-mobility device charging system for vehicle Grant 10,649,456 - Aiuchi , et al.	2020-05-12
Analyzing Device, Diagnosing Device, Analysis Method, And Computer-readable Recording Medium App 20200003653 - TAKATA; Soichiro ; et al.	2020-01-02
Diagnosis Cost Output Device, Diagnosis Cost Output Method, And Computer-readable Recording Medium App 20190378181 - SHINODA; Shigeki ; et al.	2019-12-12
Measurement Time Determination Device, Measurement Time Determination Method, And Computer-readable Recording Medium App 20190368964 - INOUE; Hirofumi ; et al.	2019-12-05
Analysis Device, Analysis Method, And Storage Medium Storing Program App 20190154637 - KUSUMOTO; Manabu ; et al.	2019-05-23
Sub-mobility Device Charging System For Vehicle App 20180314262 - AIUCHI; Yuji ; et al.	2018-11-01
Vehicle App 20180313654 - AIUCHI; Yuji ; et al.	2018-11-01
Sub-mobility Device Charging System For Vehicle App 20180314263 - AIUCHI; Yuji ; et al.	2018-11-01
Vehicle App 20180312068 - Aiuchi; Yuji ; et al.	2018-11-01
Electric hair clipper Grant D784,618 - Mori , et al. April 18, 2	2017-04-18
Electric hair clipper Grant D784,619 - Mori , et al. April 18, 2	2017-04-18
Functional Element Built-in Substrate And Wiring Substrate App 20150053474 - NAKASHIMA; Yoshiki ; et al.	2015-02-26
Buckstay connecting system Grant 8,939,112 - Kikuchi January 27, 2	2015-01-27
Functional element built-in substrate and wiring substrate Grant 8,929,090 - Nakashima , et al. January 6, 2	2015-01-06
Electric shaver Grant D718,900 - Kikuchi , et al. December 2, 2	2014-12-02
Electric shaver Grant D717,996 - Kikuchi November 18, 2	2014-11-18
Method for manufacturing semiconductor device Grant 8,872,334 - Yamamichi , et al. October 28, 2	2014-10-28
Semiconductor element-embedded substrate, and method of manufacturing the substrate Grant 8,810,008 - Mori , et al. August 19, 2	2014-08-19
Wiring board with built-in semiconductor element Grant 8,766,440 - Kikuchi , et al. July 1, 2	2014-07-01
Semiconductor element-embedded wiring substrate Grant 8,710,639 - Kikuchi , et al. April 29, 2	2014-04-29
Semiconductor device manufacture in which minimum wiring pitch of connecting portion wiring layer is less than minimum wiring pitch of any other wiring layer Grant 8,710,669 - Mori , et al. April 29, 2	2014-04-29
Semiconductor device and method for manufacturing the same Grant 8,692,364 - Kikuchi , et al. April 8, 2	2014-04-08
Semiconductor Device And Manufacturing Method Thereof App 20140024177 - MORI; KENTARO ; et al.	2014-01-23
Semiconductor device and manufacturing method thereof Grant 8,569,892 - Mori , et al. October 29, 2	2013-10-29
Wiring board, semiconductor device, and method for manufacturing wiring board and semiconductor device Grant 8,552,570 - Kikuchi , et al. October 8, 2	2013-10-08
Semiconductor device and method for manufacturing the same Grant 8,536,691 - Kikuchi , et al. September 17, 2	2013-09-17
Semiconductor Device Built-in Substrate App 20130127037 - Mori; Kentaro ; et al.	2013-05-23
Substrate With Built-in Functional Element App 20130088841 - Ohshima; Daisuke ; et al.	2013-04-11
Method of manufacturing a wiring board Grant 8,389,414 - Kikuchi , et al. March 5, 2	2013-03-05
Functional Device-embedded Substrate App 20130050967 - Ohshima; Daisuke ; et al.	2013-02-28
Semiconductor Element-embedded Wiring Substrate App 20130026632 - Kikuchi; Katsumi ; et al.	2013-01-31
Method For Manufacturing Semiconductor Device App 20130026653 - Yamamichi; Shintaro ; et al.	2013-01-31
Semiconductor Element-embedded Substrate, And Method Of Manufacturing The Substrate App 20130009325 - Mori; Kentaro ; et al.	2013-01-10
Wiring Board With Built-in Semiconductor Element App 20120319254 - Kikuchi; Katsumi ; et al.	2012-12-20
Functional Element Built-in Substrate And Wiring Substrate App 20120300425 - Nakashima; Yoshiki ; et al.	2012-11-29
Wiring substrate for mounting semiconductors, method of manufacturing the same, and semiconductor package Grant 8,198,140 - Murai , et al. June 12, 2	2012-06-12
Semiconductor Device And Method For Manufacturing The Same App 20120133052 - Kikuchi; Katsumi ; et al.	2012-05-31
Semiconductor device Grant 8,148,816 - Sasaki , et al. April 3, 2	2012-04-03
Semiconductor Device And Method For Manufacturing Semiconductor Device App 20120068359 - Mori; Kentaro ; et al.	2012-03-22
Semiconductor device and method of manufacturing same Grant 8,072,073 - Kikuchi , et al. December 6, 2	2011-12-06
Wiring board, semiconductor device, and method of manufacturing the same Grant 8,050,050 - Yamamichi , et al. November 1, 2	2011-11-01
Multilayered wiring board, semiconductor device in which multilayered wiring board is used, and method for manufacturing the same Grant 8,039,756 - Kikuchi , et al. October 18, 2	2011-10-18
Semiconductor device and method of manufacturing the same Grant 8,030,201 - Soejima , et al. October 4, 2	2011-10-04
Semiconductor Element-embedded Wiring Substrate App 20110215478 - YAMAMICHI; Shintaro ; et al.	2011-09-08
Semiconductor device and fabrication method Grant 8,004,074 - Mori , et al. August 23, 2	2011-08-23
Semiconductor device and method of manufacturing semiconductor device Grant 8,004,085 - Yamamichi , et al. August 23, 2	2011-08-23
Semiconductor Device And Manufacturing Method Thereof App 20110175213 - Mori; Kentaro ; et al.	2011-07-21
Method Of Manufacturing A Wiring Board App 20110136298 - KIKUCHI; Katsumi ; et al.	2011-06-09
Buckstay Connecting System App 20110094455 - KIKUCHI; Katsumi	2011-04-28
Wiring Board, Semiconductor Device, And Method Of Manufacturing The Same App 20110075389 - YAMAMICHI; Shintaro ; et al.	2011-03-31
Wiring board, semiconductor device using wiring board and their manufacturing methods Grant 7,911,038 - Kikuchi , et al. March 22, 2	2011-03-22
Wiring board, semiconductor device, and method of manufacturing the same Grant 7,889,514 - Yamamichi , et al. February 15, 2	2011-02-15
Wiring board, semiconductor device in which wiring board is used, and method for manufacturing the same Grant 7,880,295 - Kikuchi , et al. February 1, 2	2011-02-01
Wiring Substrate For Mounting Semiconductors, Method Of Manufacturing The Same, And Semiconductor Package App 20110003472 - MURAI; Hideya ; et al.	2011-01-06
Wiring Board, Semiconductor Device, And Method For Manufacturing Wiring Board And Semiconductor Device App 20100295191 - Kikuchi; Katsumi ; et al.	2010-11-25
Wiring board, method for manufacturing same, and semiconductor package Grant 7,838,779 - Yamamichi , et al. November 23, 2	2010-11-23
Wiring substrate for mounting semiconductors, method of manufacturing the same, and semiconductor package Grant 7,816,782 - Murai , et al. October 19, 2	2010-10-19
Wiring Board Composite Body, Semiconductor Device, And Method For Manufacturing The Wiring Board Composite Body And The Semiconductor Device App 20100232127 - Mori; Kentaro ; et al.	2010-09-16
Wiring board, semiconductor device in which wiring board is used, and method for manufacturing the same Grant 7,791,186 - Kikuchi , et al. September 7, 2	2010-09-07
Discharge device and discharge method Grant 7,784,653 - Kikuchi August 31, 2	2010-08-31
Wiring Boad, Semiconductor Device In Which Wiring Board Is Used, And Method For Manufaturing The Same App 20100127405 - KIKUCHI; Katsumi ; et al.	2010-05-27
Semiconductor Device And Method Of Manufacturing Semiconductor Device App 20100117228 - Yamamichi; Shintaro ; et al.	2010-05-13
Functional-device-embedded Circuit Board, Method For Manufacturing The Same, And Electronic Equipment App 20100103634 - Funaya; Takuo ; et al.	2010-04-29
Method of manufacturing a wiring substrate and semiconductor device Grant 7,701,726 - Tsukano , et al. April 20, 2	2010-04-20
Semiconductor package board using a metal base Grant 7,696,007 - Kikuchi , et al. April 13, 2	2010-04-13
Semiconductor Device And Method Of Manufacturing The Same App 20100087058 - SOEJIMA; Koji ; et al.	2010-04-08
Wiring board and method for manufacturing the same Grant 7,674,989 - Kikuchi , et al. March 9, 2	2010-03-09
Semiconductor device and method of manufacturing the same Grant 7,652,375 - Soejima , et al. January 26, 2	2010-01-26
Wiring substrate, semiconductor device, and method of manufacturing the same Grant 7,649,749 - Tsukano , et al. January 19, 2	2010-01-19
Wiring Board, Semiconductor Device Using Wiring Board And Their Manufacturing Methods App 20090315190 - Kikuchi; Katsumi ; et al.	2009-12-24
Semiconductor Device App 20090315167 - Sasaki; Hideki ; et al.	2009-12-24
Semiconductor Device And Method For Manufacturing The Same App 20090283895 - Kikuchi; Katsumi ; et al.	2009-11-19
Semiconductor package board using a metal base Grant 7,585,699 - Kikuchi , et al. September 8, 2	2009-09-08
Wiring board and semiconductor package using the same Grant 7,566,834 - Shimoto , et al. July 28, 2	2009-07-28
Semiconductor Package Board Using A Metal Base App 20090162974 - KIKUCHI; Katsumi ; et al.	2009-06-25
Method Of Manufacturing A Wiring Substrate And Semiconductor Device App 20090137085 - TSUKANO; Jun ; et al.	2009-05-28
Semiconductor Device And Method Of Manufacturing Same App 20090072404 - Kikuchi; Katsumi ; et al.	2009-03-19
Wiring Board For Mounting Semiconductor Device, Manufacturing Method Of The Same, And Wiring Board Assembly App 20090046441 - Funaya; Takuo ; et al.	2009-02-19
Semiconductor device mounting board, method of manufacturing the same, method of inspecting the same, and semiconductor package Grant 7,474,538 - Kikuchi , et al. January 6, 2	2009-01-06
Semiconductor Package and Method for Producing Same App 20090001604 - Tanaka; Daisuke ; et al.	2009-01-01
Semiconductor Device And Fabrication Method App 20080284001 - Mori; Kentaro ; et al.	2008-11-20
Wiring Board And Semiconductor Package Using The Same App 20080258283 - SHIMOTO; Tadanori ; et al.	2008-10-23
Wiring board and semiconductor package using the same Grant 7,397,000 - Shimoto , et al. July 8, 2	2008-07-08
Semiconductor device and method of manufacturing the same App 20080136020 - Soejima; Koji ; et al.	2008-06-12
Semiconductor device Grant 7,348,673 - Kikuchi , et al. March 25, 2	2008-03-25
Interconnecting substrate for carrying semiconductor device, method of producing thereof and package of semiconductor device Grant 7,338,884 - Shimoto , et al. March 4, 2	2008-03-04
Wiring substrate, semiconductor device, and method of manufacturing the same App 20080012140 - Tsukano; Jun ; et al.	2008-01-17
Sheet material and wiring board Grant 7,294,393 - Murai , et al. November 13, 2	2007-11-13
Multilayer wiring substrate, and method of producing same Grant 7,233,066 - Kata , et al. June 19, 2	2007-06-19
Wiring board, semiconductor device in which wiring board is used, and method for manufacturing the same App 20070080439 - Kikuchi; Katsumi ; et al.	2007-04-12
Wiring board, semiconductor device, and method of manufacturing the same App 20070079987 - Yamamichi; Shintaro ; et al.	2007-04-12
Multilayered wiring board, semiconductor device in which multilayered wiring board is used, and method for manufacturing the same App 20070079986 - Kikuchi; Katsumi ; et al.	2007-04-12
Wiring board and method for manufacturing the same App 20060283629 - Kikuchi; Katsumi ; et al.	2006-12-21
Wiring board, method for manufacturing same, and semiconductor package App 20060283625 - Yamamichi; Shintaro ; et al.	2006-12-21
Semiconductor package board using a metal base App 20060244137 - Kikuchi; Katsumi ; et al.	2006-11-02
Multilayer wiring substrate, and method of producing same App 20060189125 - Kata; Keiichiro ; et al.	2006-08-24
Multilayer wiring substrate, and method of producing same Grant 7,060,604 - Kata , et al. June 13, 2	2006-06-13
Wiring substrate for mounting semiconductors, method of manufacturing the same, and semiconductor package App 20060012048 - Murai; Hideya ; et al.	2006-01-19
Semiconductor device App 20060012029 - Kikuchi; Katsumi ; et al.	2006-01-19
Sheet material and wiring board App 20050281995 - Murai, Hideya ; et al.	2005-12-22
Discharge device and discharge method App 20050268844 - Kikuchi, Katsumi	2005-12-08
Wiring board and semiconductor package using the same App 20050252682 - Shimoto, Tadanori ; et al.	2005-11-17
Discharge device and discharge method Grant 6,960,258 - Kikuchi November 1, 2	2005-11-01
Interconnecting substrate for carrying semiconductor device, method of producing thereof and package of semiconductor device App 20050130413 - Shimoto, Tadanori ; et al.	2005-06-16
Semiconductor package board using a metal base App 20050098875 - Kikuchi, Katsumi ; et al.	2005-05-12
Semiconductor device mounting board, method of manufacturing the same, method of inspecting the same, and semiconductor package App 20050088833 - Kikuchi, Katsumi ; et al.	2005-04-28
Interconnecting substrate for carrying semiconductor device, method of producing thereof and package of semiconductor device Grant 6,861,757 - Shimoto , et al. March 1, 2	2005-03-01
Semiconductor package board using a metal base Grant 6,841,862 - Kikuchi , et al. January 11, 2	2005-01-11
Wire duct plug Grant D492,254 - Nakashima , et al. June 29, 2	2004-06-29
Printed circuit board, semiconductor package, base insulating film, and manufacturing method for interconnect substrate App 20040089470 - Shimoto, Tadanori ; et al.	2004-05-13
Multilayer wiring substrate, and method of producing same App 20040053489 - Kata, Keiichiro ; et al.	2004-03-18
Discharge device and discharge method App 20030089795 - Kikuchi, Katsumi	2003-05-15
Interconnecting substrate for carrying semiconductor device, method of producing thereof and package of semiconductor device App 20030045024 - Shimoto, Tadanori ; et al.	2003-03-06
Wiring board for high dense mounting and method of producing the same App 20020024138 - Shimoto, Tadanori ; et al.	2002-02-28
Thin film capacitor avoiding short circuit between electrodes App 20020020836 - Kikuchi, Katsumi ; et al.	2002-02-21
Semiconductor package board using a metal base App 20020001937 - Kikuchi, Katsumi ; et al.	2002-01-03
Occupant protection structure Grant 6,299,208 - Kasahara , et al. October 9, 2	2001-10-09
Thin film capacitor formed in via Grant 6,278,153 - Kikuchi , et al. August 21, 2	2001-08-21

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