KIHARA; Yoshikazu
Patent Applications and Registrations
Patent applications and USPTO patent grants for KIHARA; Yoshikazu.The latest application filed is for "multiple layer system, method of manufacture and saw device formed on the multiple layer system".
- KIHARA; Yoshikazu - Honjo JP
- Kihara; Yoshikazu - Chiba JP
- Kihara; Yoshikazu - Tokyo JP
- Kihara; Yoshikazu - Saitama JP
| Patent | Date |
|---|---|
| Multiple Layer System, Method Of Manufacture And Saw Device Formed On The Multiple Layer System App 20210013862 - METZGER; Thomas ; et al. | 2021-01-14 |
| Surface acoustic wave filter and saw filter package Grant RE43,958 - Noguchi , et al. February 5, 2 | 2013-02-05 |
| Surface acoustic wave device Grant 7,411,333 - Kihara , et al. August 12, 2 | 2008-08-12 |
| Surface Acoustic Wave Element And Surface Acoustic Wave Device Comprising The Element App 20070229191 - Yamaki; Masahiro ; et al. | 2007-10-04 |
| Surface Acoustic Wave Device App 20070018533 - Kihara; Yoshikazu ; et al. | 2007-01-25 |
| Demultiplexer App 20050046512 - Kihara, Yoshikazu ; et al. | 2005-03-03 |
| Saw filter with an attenuation pole including a band-pass ladder type of saw filter having a saw resonator Grant 6,677,835 - Noguchi , et al. January 13, 2 | 2004-01-13 |
| Saw filter with an attenuation pole including a band-pass ladder type of saw filter having a saw resonator App 20020089396 - Noguchi, Kazushige ; et al. | 2002-07-11 |
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