Kightlinger; John T.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kightlinger; John T..The latest application filed is for "wiring harness assembly having multiple separated conductors embedded within a substrate".

Company Profile

2.4.4

Kightlinger; John T. - Canfield OH

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Wiring Harness Assembly Having Multiple Separated Conductors Embedded Within A Substrate App 20220189656 - Bilas; Jared ; et al.	2022-06-16
Wiring harness assembly having multiple separated conductors embedded within a substrate Grant 11,302,460 - Bilas , et al. April 12, 2	2022-04-12
Wiring Harness Assembly Having Multiple Separated Conductors Embedded Within A Substrate App 20200381140 - Bilas; Jared ; et al.	2020-12-03
Wiring harness assembly having multiple separated conductors embedded within a substrate Grant 10,777,334 - Bilas , et al. Sept	2020-09-15
Wiring Harness Assembly Having Multiple Separated Conductors Embedded Within A Substrate App 20190172607 - Bilas; Jared ; et al.	2019-06-06
Electrical connection system having wafer connectors Grant 7,485,012 - Daugherty , et al. February 3, 2	2009-02-03
Electrical Connection System Having Wafer Connectors App 20090004922 - Daugherty; James D. ; et al.	2009-01-01
Low profile connector position assurance Grant 5,308,261 - Kightlinger May 3, 1	1994-05-03

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