KIDO; Takanori

Patent Applications and Registrations

Patent applications and USPTO patent grants for KIDO; Takanori.The latest application filed is for "seed crystal for single crystal 4h-sic growth and method for processing the same".

Company Profile

4.16.12

KIDO; Takanori - Tsukuba-shi JP
Kido; Takanori - Hiratsuka JP
Kido; Takanori - Hikone JP
KIDO; Takanori - Hikone-shi JP
Kido; Takanori - Hiratsuka-shi Kanagawa
KIDO; Takanori - HIRATSUKA-CITY JP
Kido; Takanori - Nagano JP
Kido; Takanori - Shiojiri JP
Kido, Takanori - Shiojiri-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
SEED CRYSTAL FOR SINGLE CRYSTAL 4H-SiC GROWTH AND METHOD FOR PROCESSING THE SAME App 20210047750 - KIDO; Takanori ; et al.	2021-02-18
Two-pack type urethane-based adhesive composition Grant 10,793,758 - Matsuki , et al. October 6, 2	2020-10-06
Two-pack curable urethane adhesive composition Grant 10,513,644 - Abe , et al. Dec	2019-12-24
Surface machining method for single crystal SiC substrate, manufacturing method thereof, and grinding plate for surface machining single crystal SiC substrate Grant 10,453,693 - Kido , et al. Oc	2019-10-22
Surface Machining Method For Single Crystal Sic Substrate, Manufacturing Method Thereof, And Grinding Plate For Surface Machining Single Crystal Sic Substrate App 20180218916 - KIDO; Takanori ; et al.	2018-08-02
Two-Pack Curable Urethane Adhesive Composition App 20180163103 - Abe; Megumi ; et al.	2018-06-14
Surface machining method for single crystal SiC substrate, manufacturing method thereof, and grinding plate for surface machining single crystal SiC substrate Grant 9,960,048 - Kido , et al. May 1, 2	2018-05-01
Two-pack Type Urethane-based Adhesive Composition App 20170204311 - MATSUKI; Yuichi ; et al.	2017-07-20
Surface Machining Method For Single Crystal Sic Substrate, Manufacturing Method Thereof, And Grinding Plate For Surface Machining Single Crystal Sic Substrate App 20170178919 - KIDO; Takanori ; et al.	2017-06-22
Primer composition Grant 9,617,432 - Yamauchi , et al. April 11, 2	2017-04-11
Surface machining method for single crystal SiC substrate, manufacturing method thereof, and grinding plate for surface machining single crystal SiC substrate Grant 9,620,374 - Kido , et al. April 11, 2	2017-04-11
Primer Composition App 20160185975 - Yamauchi; Shigeru ; et al.	2016-06-30
Surface Machining Method For Single Crystal Sic Substrate, Manufacturing Method Thereof, And Grinding Plate For Surface Machining Single Crystal Sic Substrate App 20160035579 - KIDO; Takanori ; et al.	2016-02-04
LSI device polishing composition and method for producing LSI device Grant 6,844,263 - Shimazu , et al. January 18, 2	2005-01-18
Abrasive composition for polishing semiconductor device and method for producing semiconductor device using the same Grant 6,733,553 - Kido , et al. May 11, 2	2004-05-11
LSI device polishing composition and method for producing LSI device App 20030153188 - Shimazu, Yoshitomo ; et al.	2003-08-14
LSI device polishing composition and method for producing LSI device Grant 6,547,843 - Shimazu , et al. April 15, 2	2003-04-15
Cerium oxide slurry for polishing, process for preparing the slurry, and process for polishing with the slurry Grant 6,478,836 - Kido , et al. November 12, 2	2002-11-12
Composition for polishing a semiconductor device and process for manufacturing a semiconductor device using the same Grant 6,436,835 - Kido , et al. August 20, 2	2002-08-20
Composition for polishing a semiconductor device and process for manufacturing a semiconductor device using the same Grant 6,410,444 - Kido , et al. June 25, 2	2002-06-25
Abrasive composition for polishing semiconductor device and method for producing semiconductor device using the same App 20020059755 - Kido, Takanori ; et al.	2002-05-23
Cerium oxide slurry for polishing, process for preparing the slurry, and process for polishing with the slurry Grant 6,387,139 - Kido , et al. May 14, 2	2002-05-14
Composition For Polishing A Semiconductor Device And Process For Manufacturing A Semiconductor Device Using The Same App 20020045350 - Kido, Takanori ; et al.	2002-04-18
Cerium oxide slurry for polishing, process for preparing the slurry, and process for polishing with the slurry App 20020032989 - Kido, Takanori ; et al.	2002-03-21
LSI device polishing composition and method for reproducing LSI device App 20020017064 - Shimazu, Yoshitomo ; et al.	2002-02-14
Polishing material composition and polishing method for polishing LSI devices Grant 6,299,659 - Kido , et al. October 9, 2	2001-10-09
Abrasive composition for magnetic recording disc substrate Grant 5,935,278 - Ishitobi , et al. August 10, 1	1999-08-10
Polishing composition for chemical mechanical polishing Grant 5,800,577 - Kido September 1, 1	1998-09-01

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