Kido; Masayoshi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kido; Masayoshi.The latest application filed is for "thermosetting resin composition, thermosetting resin film, thermoset film, multilayer body, printed wiring board and method for producing same".

Company Profile

3.15.19

Kido; Masayoshi - Osaka JP
Kido; Masayoshi - Otsu JP
KIDO; Masayoshi - Otsu-shi JP
Kido; Masayoshi - Shiga JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Thermosetting Resin Composition, Thermosetting Resin Film, Thermoset Film, Multilayer Body, Printed Wiring Board And Method For Producing Same App 20220153909 - Kono; Fumiya ; et al.	2022-05-19
Low Dielectric Resin Composition, Molded Article, Film, Multilayer Film And Flexible Printed Wiring Board App 20220041932 - Imamura; Yuichi ; et al.	2022-02-10
Thermosetting resin composition, cured film and method for producing same, and flexible printed board with cured film and method for producing same Grant 10,975,263 - Kido , et al. April 13, 2	2021-04-13
Black resin composition, polyimide with black resin cured film and production method therefor, and flexible printed wiring board using black resin cured film Grant 10,822,465 - Kogiso , et al. November 3, 2	2020-11-03
Printed Wiring Board And Method For Manufacturing Same App 20200045833 - ASAHINA; Yuji ; et al.	2020-02-06
Thermosetting Resin Composition, Cured Film And Method For Producing Same, And Flexible Printed Board With Cured Film And Method App 20190161638 - KIDO; Masayoshi ; et al.	2019-05-30
Reinforcing-plate-integrated flexible printed circuit board Grant 10,292,262 - Kido , et al.	2019-05-14
Black Resin Composition, Polyimide With Black Resin Cured Film And Production Method Therefor, And Flexible Printed Wiring Board Using Black Resin Cured Film App 20180319945 - KOGISO; Tetsuya ; et al.	2018-11-08
Conductive-layer-integrated flexible printed circuit board Grant 10,045,433 - Kido , et al. August 7, 2	2018-08-07
Black photosensitive resin composition and use of same Grant 10,030,133 - Kido , et al. July 24, 2	2018-07-24
Photosensitive resin composition and use thereof Grant 9,835,942 - Sekito , et al. December 5, 2	2017-12-05
Conductive-layer-integrated Flexible Printed Circuit Board App 20170290141 - Kido; Masayoshi ; et al.	2017-10-05
Flexible printed circuit integrated with conductive layer Grant 9,237,645 - Kido , et al. January 12, 2	2016-01-12
Flexible printed circuit integrated with stiffener Grant 9,204,528 - Kido , et al. December 1, 2	2015-12-01
Conductive-layer-integrated Flexible Printed Circuit Board App 20150195899 - Kido; Masayoshi ; et al.	2015-07-09
Reinforcing-plate-integrated Flexible Printed Circuit Board App 20150189740 - Kido; Masayoshi ; et al.	2015-07-02
Conductive layer integrated FPC Grant 9,072,177 - Kido , et al. June 30, 2	2015-06-30
Black Photosensitive Resin Composition And Use Of Same App 20150044451 - Kido; Masayoshi ; et al.	2015-02-12
Flexible printed circuit board integrated with reinforcing plate, and method for manufacturing flexible printed circuit board integrated with reinforcing plate Grant 8,828,525 - Kido , et al. September 9, 2	2014-09-09
Novel Conductive Layer Integrated Fpc App 20140158412 - Kido; Masayoshi ; et al.	2014-06-12
Novel Flexible Printed Circuit Integrated With Conductive Layer App 20140054081 - Kido; Masayoshi ; et al.	2014-02-27
Flexible Printed Circuit Integrated With Reinforcing Plate App 20140048314 - Kido; Masayoshi ; et al.	2014-02-20
Novel Photosensitive Resin Composition And Use Thereof App 20130264099 - Sekido; Yoshihide ; et al.	2013-10-10
Flexible Printed Circuit Board Integrated With Reinforcing Plate, And Method For Manufacturing Flexible Printed Circuit Board Integrated With Reinforcing Plate App 20130183499 - Kido; Masayoshi ; et al.	2013-07-18

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