Patent | Date |
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Plasma processing chamber with a grounded electrode assembly Grant 9,905,402 - Kholodenko , et al. February 27, 2 | 2018-02-27 |
Metal Mesh Touch Sensor With Randomized Channel Displacement App 20160282973 - Kholodenko; Arnold ;   et al. | 2016-09-29 |
Plasma Processing Chamber With a Grounded Electrode Assembly App 20150325416 - Kholodenko; Arnold ;   et al. | 2015-11-12 |
Plasma processing chamber with a grounded electrode assembly Grant 9,111,968 - Kholodenko , et al. August 18, 2 | 2015-08-18 |
Proximity head having a fluid resistor Grant 8,900,400 - Kholodenko , et al. December 2, 2 | 2014-12-02 |
Methods for Confinement of Foam Delivered by a Proximity Head App 20140251382 - Kholodenko; Arnold ;   et al. | 2014-09-11 |
Multi-stage substrate cleaning method and apparatus Grant 8,757,177 - Kholodenko , et al. June 24, 2 | 2014-06-24 |
Confinement of foam delivered by a proximity head Grant 8,739,805 - Kholodenko , et al. June 3, 2 | 2014-06-03 |
Single Substrate Processing Head For Particle Removal Using Low Viscosity Fluid App 20140041581 - Kholodenko; Arnold ;   et al. | 2014-02-13 |
Single substrate processing head for particle removal using low viscosity fluid Grant 8,584,613 - Kholodenko , et al. November 19, 2 | 2013-11-19 |
Method for using generator for foam to clean substrate Grant 8,557,051 - Kholodenko , et al. October 15, 2 | 2013-10-15 |
Multi-stage Substrate Cleaning Method And Apparatus App 20130068261 - Kholodenko; Arnold ;   et al. | 2013-03-21 |
Proximity Head Having a Fluid Resistor App 20130048765 - Kholodenko; Arnold ;   et al. | 2013-02-28 |
Multi-stage substrate cleaning method and apparatus Grant 8,317,934 - Kholodenko , et al. November 27, 2 | 2012-11-27 |
Apparatus for substantially uniform fluid flow rates relative to a proximity head in processing of a wafer surface by a meniscus Grant 8,317,966 - Kholodenko , et al. November 27, 2 | 2012-11-27 |
System, method and apparatus for maintaining separation of liquids in a controlled meniscus Grant 8,313,582 - O'Donnell , et al. November 20, 2 | 2012-11-20 |
Method for manufacturing a hybrid composite wafer carrier for wet clean equipment Grant 8,292,697 - Cheng , et al. October 23, 2 | 2012-10-23 |
Method for Using Generator for Foam to Clean Substrate App 20120255618 - Kholodenko; Arnold ;   et al. | 2012-10-11 |
Wafer carrier drive apparatus and method for operating the same Grant 8,261,905 - Kholodenko , et al. September 11, 2 | 2012-09-11 |
In situ morphological characterization of foam for a proximity head Grant 8,246,755 - Kholodenko , et al. August 21, 2 | 2012-08-21 |
Method for Manufacturing a Hybrid Composite Wafer Carrier for Wet Clean Equipment App 20120168079 - Cheng; Wing Lau ;   et al. | 2012-07-05 |
System, Method And Apparatus For Maintaining Separation Of Liquids In A Controlled Meniscus App 20120138098 - O'Donnell; Robert ;   et al. | 2012-06-07 |
Generator for foam to clean substrate Grant 8,161,984 - Kholodenko , et al. April 24, 2 | 2012-04-24 |
Hybrid composite wafer carrier for wet clean equipment Grant 8,146,902 - Cheng , et al. April 3, 2 | 2012-04-03 |
System, method and apparatus for maintaining separation of liquids in a controlled meniscus Grant 8,141,566 - O'Donnell , et al. March 27, 2 | 2012-03-27 |
Methods of configuring a proximity head that provides uniform fluid flow relative to a wafer Grant 7,998,304 - Kholodenko , et al. August 16, 2 | 2011-08-16 |
In Situ Morphological Characterization Of Foam For A Proximity Head App 20110100399 - Kholodenko; Arnold ;   et al. | 2011-05-05 |
Multi-Stage Substrate Cleaning Method and Apparatus App 20100288311 - Kholodenko; Arnold ;   et al. | 2010-11-18 |
Plasma Processing Chamber With A Grounded Electrode Assembly App 20100263592 - Kholodenko; Arnold ;   et al. | 2010-10-21 |
Wafer Carrier Drive Apparatus and Method for Operating the Same App 20100230243 - Kholodenko; Arnold ;   et al. | 2010-09-16 |
Apparatus for an optimized plasma chamber grounded electrode assembly Grant 7,743,730 - Kholodenko , et al. June 29, 2 | 2010-06-29 |
Confinement of Foam Delivered by a Proximity Head App 20100126528 - Kholodenko; Arnold ;   et al. | 2010-05-27 |
High power electrical connector for a laminated heater Grant 7,699,634 - Kholodenko , et al. April 20, 2 | 2010-04-20 |
Apparatus For Substantially Uniform Fluid Flow Rates Relative To A Proximity Head In Processing Of A Wafer Surface By A Meniscus App 20100037922 - Kholodenko; Arnold ;   et al. | 2010-02-18 |
Generator For Foam To Clean Substrate App 20100024842 - Kholodenko; Arnold ;   et al. | 2010-02-04 |
Single Substrate Processing Head For Particle Removal Using Low Viscosity Fluid App 20090320942 - Kholodenko; Arnold ;   et al. | 2009-12-31 |
Methods Of Configuring A Proximity Head That Provides Uniform Fluid Flow Relative To A Wafer App 20090159201 - Kholodenko; Arnold ;   et al. | 2009-06-25 |
System, method and apparatus for maintaining separation of liquids in a controlled meniscus App 20080314422 - O'Donnell; Robert ;   et al. | 2008-12-25 |
High Power Electrical Connector for a Laminated Heater App 20080227323 - Kholodenko; Arnold ;   et al. | 2008-09-18 |
Hybrid Composite Wafer Carrier For Wet Clean Equipment App 20080152922 - Cheng; Wing Lau ;   et al. | 2008-06-26 |
Chemical resistant semiconductor processing chamber bodies App 20080038448 - Kholodenko; Arnold ;   et al. | 2008-02-14 |
Apparatus for an optimized plasma chamber grounded electrode assembly App 20070137573 - Kholodenko; Arnold ;   et al. | 2007-06-21 |
Method and apparatus for encapsulation of an edge of a substrate during an electro-chemical deposition process Grant 6,908,540 - Kholodenko June 21, 2 | 2005-06-21 |
Electrostatic chuck having dielectric member with stacked layers and manufacture App 20040190215 - Weldon, Edwin C. ;   et al. | 2004-09-30 |
Apparatus for regulating temperature of a process kit in a semiconductor wafer-processing chamber Grant 6,795,292 - Grimard , et al. September 21, 2 | 2004-09-21 |
Actively-controlled electrostatic chuck heater App 20040081439 - Kholodenko, Arnold ;   et al. | 2004-04-29 |
Electrostatic chuck having composite dielectric layer and method of manufacture Grant 6,721,162 - Weldon , et al. April 13, 2 | 2004-04-13 |
Electrostatic chuck having heater and method Grant 6,538,872 - Wang , et al. March 25, 2 | 2003-03-25 |
Method and apparatus for encapsulation of an edge of a substrate during an electro-chemical deposition process App 20030010641 - Kholodenko, Arnold | 2003-01-16 |
Method and apparatus for encapsulation of an edge of a substrate during an electro-chemical deposition process App 20030010640 - Kholodenko, Arnold | 2003-01-16 |
Substrate support having bonded sections and method Grant 6,503,368 - Kholodenko , et al. January 7, 2 | 2003-01-07 |
Electrostatic chuck bonded to base with a bond layer and method Grant 6,490,146 - Wang , et al. December 3, 2 | 2002-12-03 |
Apparatus for regulating temperature of a process kit in a semiconductor wafer-processing chamber App 20020171994 - Grimard, Dennis ;   et al. | 2002-11-21 |
Plasma chamber support having dual electrodes Grant 6,478,924 - Shamouilian , et al. November 12, 2 | 2002-11-12 |
Magnetically enhanced inductively coupled plasma reactor with magnetically confined plasma Grant 6,471,822 - Yin , et al. October 29, 2 | 2002-10-29 |
Substrate support member for a processing chamber Grant 6,464,795 - Sherstinsky , et al. October 15, 2 | 2002-10-15 |
Substrate support member Grant 6,464,790 - Sherstinsky , et al. October 15, 2 | 2002-10-15 |
Electrostatic chuck having improved electrical connector and method Grant 6,462,928 - Shamouilian , et al. October 8, 2 | 2002-10-08 |
Electrostatic chuck having composite dielectric layer and method of manufacture App 20020135969 - Weldon, Edwin C. ;   et al. | 2002-09-26 |
Electrostatic chuck bonded to base with a bond layer and method App 20020075624 - Wang, You ;   et al. | 2002-06-20 |
Electrostatic Chuck Having Composite Base And Method App 20020036881 - SHAMOUILIAN, SHAMOUIL ;   et al. | 2002-03-28 |
Chuck having pressurized zones of heat transfer gas Grant 6,320,736 - Shamouilian , et al. November 20, 2 | 2001-11-20 |
Electrostatic chuck having gas cavity and method Grant 6,310,755 - Kholodenko , et al. October 30, 2 | 2001-10-30 |
Method of fabricating a semiconductor wafer support chuck apparatus having small diameter gas distribution ports for distributing a heat transfer gas App 20010024349 - Shamoulian, Shamouil ;   et al. | 2001-09-27 |
Electrostatic chuck with improved temperature control and puncture resistance Grant 6,278,600 - Shamouilian , et al. August 21, 2 | 2001-08-21 |
Plasma reactor having a helicon wave high density plasma source Grant 6,189,484 - Yin , et al. February 20, 2 | 2001-02-20 |
Connectors for an electrostatic chuck and combination thereof Grant 6,151,203 - Shamouilian , et al. November 21, 2 | 2000-11-21 |
Electrostatic chuck having improved gas conduits Grant 6,108,189 - Weldon , et al. August 22, 2 | 2000-08-22 |
High density plasma process chamber Grant 6,095,084 - Shamouilian , et al. August 1, 2 | 2000-08-01 |
Polymer chuck with heater and method of manufacture Grant 6,094,334 - Bedi , et al. July 25, 2 | 2000-07-25 |
Wafer support with improved temperature control Grant 6,033,478 - Kholodenko March 7, 2 | 2000-03-07 |
Temperature control system for semiconductor process chamber Grant 6,015,465 - Kholodenko , et al. January 18, 2 | 2000-01-18 |
Plasma process chamber Grant 5,900,064 - Kholodenko May 4, 1 | 1999-05-04 |
Topographical structure of an electrostatic chuck and method of fabricating same Grant 5,885,469 - Kholodenko , et al. March 23, 1 | 1999-03-23 |
Electrostatic chuck having a unidirectionally conducting coupler layer Grant 5,801,915 - Kholodenko , et al. September 1, 1 | 1998-09-01 |
Resilient rotary seal with projecting edge Grant 5,356,158 - Simmons , et al. October 18, 1 | 1994-10-18 |
Rotary shaft sealing method and device Grant 5,292,137 - Simmons , et al. March 8, 1 | 1994-03-08 |