Khilchenko; Leon M.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Khilchenko; Leon M..The latest application filed is for "printed circuit board for high speed, high density electrical connector with improved cross-talk minimization, attenuation and impedance mismatch characteristics".

Company Profile

0.6.6

Khilchenko; Leon M. - Manchester NH

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Printed circuit board minimizing undesirable signal reflections in a via and methods therefor Grant 8,115,110 - Khilchenko , et al. February 14, 2	2012-02-14
Lead(Pb)-free electronic component attachment Grant 7,630,210 - Gailus , et al. December 8, 2	2009-12-08
Printed circuit board for high speed, high density electrical connector with improved cross-talk minimization attenuation and impedance mismatch characteristics Grant 7,508,681 - Payne , et al. March 24, 2	2009-03-24
Electronic component with high density, low cost attachment Grant 7,484,971 - Gailus , et al. February 3, 2	2009-02-03
Printed circuit board for high speed, high density electrical connector with improved cross-talk minimization, attenuation and impedance mismatch characteristics App 20080030970 - Payne; Jason J. ; et al.	2008-02-07
Printed circuit board minimizing undesirable signal reflections in a via and methods therefor App 20070258223 - Khilchenko; Leon M. ; et al.	2007-11-08
Electronic component with high density, low cost attachment App 20070207635 - Gailus; Mark W. ; et al.	2007-09-06
Lead(Pb)-free electronic component attachment App 20070205497 - Gailus; Mark W. ; et al.	2007-09-06
Printed circuit board for high speed, high density electrical connector with improved cross-talk minimization, attenuation and impedance mismatch characteristics Grant 7,242,592 - Payne , et al. July 10, 2	2007-07-10
Method of making an electrical connection to a conductor on an inner layer of a multi-layer printed circuit board Grant 7,240,425 - Khilchenko , et al. July 10, 2	2007-07-10
Printed circuit board for high speed, high density electrical connector with improved cross-talk minimization, attenuation and impedance mismatch characteristics App 20040264153 - Payne, Jason J. ; et al.	2004-12-30
Printed circuit board minimizing undesirable signal reflections in a via and methods therefor App 20040212972 - Khilchenko, Leon M. ; et al.	2004-10-28

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