Kheng; Lee Teck

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kheng; Lee Teck.The latest application filed is for "system and apparatus for guiding an instrument".

Company Profile

2.4.10

Kheng; Lee Teck - Singapore SG

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
System And Apparatus For Guiding An Instrument App 20210059768 - Leong; Foo Soo ; et al.	2021-03-04
System and apparatus for guiding an instrument Grant 10,835,323 - Leong , et al. November 17, 2	2020-11-17
System And Apparatus For Guiding An Instrument App 20160206383 - Leong; Foo Soo ; et al.	2016-07-21
Methods of forming semiconductor packages Grant 7,572,670 - Kheng August 11, 2	2009-08-11
Partitioned Through-layer Via And Associated Systems And Methods App 20090057912 - Kheng; Lee Teck	2009-03-05
Semiconductor packages Grant 7,262,499 - Kheng August 28, 2	2007-08-28
Methods of forming semiconductor packages App 20060134826 - Kheng; Lee Teck	2006-06-22
Methods of forming semiconductor packages App 20060055033 - Kheng; Lee Teck	2006-03-16
Semiconductor packages App 20060055052 - Kheng; Lee Teck	2006-03-16
Semiconductor packages App 20060055010 - Kheng; Lee Teck	2006-03-16
Semiconductor packages, and methods of forming semiconductor packages App 20050230821 - Kheng, Lee Teck	2005-10-20
Methods of forming circuit traces and contact pads for interposers utilized in semiconductor packages Grant 6,913,952 - Moxham , et al. July 5, 2	2005-07-05
Methods of forming circuit traces and contact pads for interposers utilized in semiconductor packages App 20050003607 - Moxham, Stephen F. ; et al.	2005-01-06
Interposer configured to reduce the profiles of semiconductor device assemblies and packages including the same and methods App 20030164543 - Kheng Lee, Teck	2003-09-04

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