Khanna; Vijayeshwar D.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Khanna; Vijayeshwar D..The latest application filed is for "server node connnector mating condition health monitoring and reporting".

Company Profile

4.36.37

Khanna; Vijayeshwar D. - Millwood NY
Khanna; Vijayeshwar D - Millwood NY
Khanna; Vijayeshwar D. - Ossining NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Server Node Connnector Mating Condition Health Monitoring And Reporting App 20200389994 - Sri-Jayantha; Sri M. ; et al.	2020-12-10
Server node connnector mating condition health monitoring and reporting Grant 10,834,844 - Sri-Jayantha , et al. November 10, 2	2020-11-10
Server Node Connnector Mating Condition Health Monitoring And Reporting App 20200146172 - Sri-Jayantha; Sri M. ; et al.	2020-05-07
Reduction of solder interconnect stress Grant 10,276,534 - Call , et al.	2019-04-30
Method of fabricating contacts of an electronic package structure to reduce solder interconnect stress Grant 10,276,535 - Call , et al.	2019-04-30
Laminate substrate thermal warpage prediction for designing a laminate substrate Grant 10,108,753 - Call , et al. October 23, 2	2018-10-23
Reduction Of Solder Interconnect Stress App 20180061799 - Call; Anson J. ; et al.	2018-03-01
Reduction Of Solder Interconnect Stress App 20180061800 - Call; Anson J. ; et al.	2018-03-01
Reduction of solder interconnect stress Grant 9,865,557 - Call , et al. January 9, 2	2018-01-09
Laminate Substrate Thermal Warpage Prediction For Designing A Laminate Substrate App 20170351783 - Call; Anson J. ; et al.	2017-12-07
Mechanism to attach a die to a substrate Grant 9,630,269 - Khanna , et al. April 25, 2	2017-04-25
In-plane copper imbalance for warpage prediction Grant 9,563,732 - Call , et al. February 7, 2	2017-02-07
Electronic components on trenched substrates and method of forming same Grant 9,508,789 - Questad , et al. November 29, 2	2016-11-29
Constrained Die Adhesion Cure Process App 20160211161 - Blackshear; Edmund ; et al.	2016-07-21
Constrained die adhesion cure process Grant 9,305,894 - Blackshear , et al. April 5, 2	2016-04-05
Vacuum carriers for substrate bonding Grant 9,227,261 - Khanna , et al. January 5, 2	2016-01-05
Alignment of integrated circuit chip stack Grant 9,171,742 - Colgan , et al. October 27, 2	2015-10-27
Mechanism To Attach A Die To A Substrate App 20150118799 - KHANNA; Vijayeshwar D. ; et al.	2015-04-30
Vacuum Carriers For Substrate Bonding App 20150041524 - Khanna; Vijayeshwar D. ; et al.	2015-02-12
Alignment Of Integrated Circuit Chip Stack App 20150024549 - Colgan; Evan G. ; et al.	2015-01-22
Method And System For Thermomechanically Decoupling Heatsink App 20150000097 - Sri-Jayantha; Sri M. ; et al.	2015-01-01
Constrained Die Adhesion Cure Process App 20140359995 - Blackshear; Edmund ; et al.	2014-12-11
Electronic Components On Trenched Substrates And Method Of Forming Same App 20140151849 - Questad; David ; et al.	2014-06-05
Stress reduction means for warp control of substrates through clamping Grant 8,685,833 - Khanna , et al. April 1, 2	2014-04-01
Negative coefficient thermal expansion engineered particles for composite fabrication Grant 8,624,152 - Hougham , et al. January 7, 2	2014-01-07
Stress Reduction Means For Warp Control Of Substrates Through Clamping App 20130260534 - Khanna; Vijayeshwar D. ; et al.	2013-10-03
Conformal Coining of Solder Joints in Electronic Packages App 20120309187 - Sri-Jayantha; Sri M. ; et al.	2012-12-06
Heat transfer device in a rotating structure Grant 8,322,980 - Khanna , et al. December 4, 2	2012-12-04
Negative Coefficient Thermal Expansion Engineered Particles For Composite Fabrication App 20120121906 - Hougham; Gareth G. ; et al.	2012-05-17
Negative coefficient thermal expansion engineered particles for composite fabrication Grant 8,138,448 - Hougham , et al. March 20, 2	2012-03-20
Electronic components on trenched substrates and method of forming same Grant 8,054,630 - Questad , et al. November 8, 2	2011-11-08
Heat Transfer Device In A Rotating Structure App 20110123318 - Khanna; Vijayeshwar D. ; et al.	2011-05-26
Packaging substrate having pattern-matched metal layers Grant 7,901,998 - Sri-Jayantha , et al. March 8, 2	2011-03-08
Heat transfer device in a rotating structure Grant 7,896,611 - Khanna , et al. March 1, 2	2011-03-01
Electronic components on trenched substrates and method of forming same Grant 7,855,430 - Questad , et al. December 21, 2	2010-12-21
Method and structure for a pull test for controlled collapse chip connections and ball limiting metallurgy Grant 7,819,027 - Jadhav , et al. October 26, 2	2010-10-26
Packaging Substrate Having Pattern-matched Metal Layers App 20100218364 - Sri-Jayantha; Sri M. ; et al.	2010-09-02
Electronic components on trenched substrates and method of forming same Grant 7,777,301 - Questad , et al. August 17, 2	2010-08-17
Packaging substrate having pattern-matched metal layers Grant 7,759,787 - Sri-Jayantha , et al. July 20, 2	2010-07-20
Electronic components on trenched substrates and method of forming same Grant 7,732,894 - Questad , et al. June 8, 2	2010-06-08
Pump structures integral to a fluid filled heat transfer apparatus Grant 7,667,969 - Khanna , et al. February 23, 2	2010-02-23
Structures to enhance cooling of computer memory modules Grant 7,612,446 - Dang , et al. November 3, 2	2009-11-03
Organic Substrate with Asymmetric Thickness for Warp Mitigation App 20090265028 - Sri-Jayantha; Sri M. ; et al.	2009-10-22
Method for manufacturing a shock absorber that allows a disk drive to move with respect to the chassis of a computer system Grant 7,559,132 - Sri-Jayantha , et al. July 14, 2	2009-07-14
Negative Coefficient Thermal Expansion Engineered Particles For Composite Fabrication App 20090169886 - Hougham; Gareth G. ; et al.	2009-07-02
Packaging Substrate Having Pattern-matched Metal Layers App 20090114429 - Sri-Jayantha; Sri M. ; et al.	2009-05-07
Electronic Components On Trenched Substrates And Method Of Forming Same App 20090085161 - Questad; David ; et al.	2009-04-02
Integrated heat spreader and exchanger Grant 7,477,517 - Khanna , et al. January 13, 2	2009-01-13
Method And Structure For A Pull Test For Controlled Collapse Chip Connections And Ball Limiting Metallurgy App 20080313879 - Jadhav; Virendra R. ; et al.	2008-12-25
Electronic Components On Trenched Substrates And Method Of Forming Same App 20080226875 - Questad; David ; et al.	2008-09-18
Pump Structures Integral To A Fluid Filled Heat Transfer Apparatus App 20080225488 - Khanna; Vijayeshwar D. ; et al.	2008-09-18
Electronic Components On Trenched Substrates And Method Of Forming Same App 20080218990 - Questad; David ; et al.	2008-09-11
Electronic Components On Trenched Substrates And Method Of Forming Same App 20080205023 - Khanna; Vijayeshwar D. ; et al.	2008-08-28
Electronic Components On Trenched Substrates And Method Of Forming Same App 20080205024 - Questad; David ; et al.	2008-08-28
Integrated Heat Spreader And Exchanger App 20080180914 - Khanna; Vijayeshwar D. ; et al.	2008-07-31
Heat transfer device in a rotating structure App 20080159853 - Khanna; Vijayeshwar D. ; et al.	2008-07-03
Structures to enhance cooling of computer memory modules App 20080116571 - Dang; Hien P. ; et al.	2008-05-22
Apparatus for a shock absorber that allows a disk drive to move with respect to the chassis of a computer system Grant 7,248,467 - Sri-Jayantha , et al. July 24, 2	2007-07-24
Method and apparatus for limiting shock damage to hard disk drive during operation Grant 7,136,246 - Khanna , et al. November 14, 2	2006-11-14
Apparatus for a shock absorber that allows a disk drive to move with respect to the chassis of a computer system App 20060098404 - Sri-Jayantha; Sri M. ; et al.	2006-05-11
Method for manufacturing a shock absorber that allows a disk drive to move with respect to the chassis of a computer system App 20060098399 - Sri-Jayantha; Sri M. ; et al.	2006-05-11
Method and apparatus for limiting shock damage to hard disk drive during operation App 20050057842 - Khanna, Vijayeshwar D. ; et al.	2005-03-17
Method and apparatus for limiting shock damage to hard disk drive during operation App 20050057854 - Khanna, Vijayeshwar D. ; et al.	2005-03-17
Disk drive with a pivot embedded torque generating track follow actuator and method therefor Grant 6,731,454 - Sri-Jayantha , et al. May 4, 2	2004-05-04
High bandwidth track following actuator for hard disk drives Grant 6,707,207 - Khanna , et al. March 16, 2	2004-03-16
Deformable shock absorbing mechanism for a computer apparatus or a precision apparatus App 20030179543 - Sri-Jayantha, Sri M. ; et al.	2003-09-25
Disk drive with a pivot embedded torque generating track follow actuator and method therefor App 20020186498 - Sri-Jayantha, Sri M. ; et al.	2002-12-12
Crash stop shock ring for the protection of disk drive motor bearings Grant 5,550,688 - Aoyagi , et al. August 27, 1	1996-08-27
Speed independent, air bearing slider Grant 5,424,888 - Hendriks , et al. June 13, 1	1995-06-13
Programmable air bearing slider including magnetic read/write element Grant 5,021,906 - Chang , et al. June 4, 1	1991-06-04