KHAN; Reza-ur Rahman

Patent Applications and Registrations

Patent applications and USPTO patent grants for KHAN; Reza-ur Rahman.The latest application filed is for "enhanced die-up ball grid array and method for making the same".

Company Profile

0.33.37

KHAN; Reza-ur Rahman - Rancho Santa Margarita CA
Khan, Reza-ur Rahman - Santa Margarita CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Enhanced Die-up Ball Grid Array And Method For Making The Same App 20150137343 - KHAN; Reza-ur Rahman ; et al.	2015-05-21
Thermally And Electrically Enhanced Ball Grid Array Package App 20140210083 - Zhao; Sam Ziqun ; et al.	2014-07-31
Thermally and electrically enhanced ball grid array package Grant 8,686,558 - Zhao , et al. April 1, 2	2014-04-01
Ball grid array package enhanced with a thermal and electrical connector Grant 8,310,067 - Zhao , et al. November 13, 2	2012-11-13
Die down ball grid array packages and method for making same Grant 8,021,927 - Khan , et al. September 20, 2	2011-09-20
Ball Grid Array Package Enhanced With a Thermal and Electrical Connector App 20110140272 - ZHAO; Sam Ziqun ; et al.	2011-06-16
Ball grid array package enhanced with a thermal and electrical connector Grant 7,893,546 - Zhao , et al. February 22, 2	2011-02-22
Die Down Ball Grid Array Packages and Method for Making Same App 20100285637 - Khan; Reza-Ur Rahman ; et al.	2010-11-11
Multipiece apparatus for thermal and electromagnetic interference (EMI) shielding enhancement in die-up array packages and method of making the same Grant 7,791,189 - Zhao , et al. September 7, 2	2010-09-07
Die down ball grid array package Grant 7,786,591 - Khan , et al. August 31, 2	2010-08-31
Methods and apparatus for improved thermal performance and electromagnetic interference (EMI) shielding in leadframe integrated circuit (IC) packages Grant 7,781,266 - Zhao , et al. August 24, 2	2010-08-24
Low voltage drop and high thermal performance ball grid array package Grant 7,781,882 - Zhong , et al. August 24, 2	2010-08-24
Flip chip package including a non-planar heat spreader and method of making the same Grant 7,719,110 - Zhao , et al. May 18, 2	2010-05-18
Ball Grid Array Package Having One or More Stiffeners App 20100052151 - ZHAO; Sam Ziqun ; et al.	2010-03-04
Methods and Apparatus for Improved Thermal Performance and Electromagnetic Interference (EMI) Shielding in Leadframe Integrated Circuit (IC) Packages App 20100035383 - Zhao; Sam Ziqun ; et al.	2010-02-11
Ball grid array package with patterned stiffener surface and method of assembling the same Grant 7,629,681 - Zhao , et al. December 8, 2	2009-12-08
Low Voltage Drop and High Thermal Performance Ball Grid Array Package App 20090267222 - Zhong; Chonghua ; et al.	2009-10-29
Methods and apparatus for improved thermal performance and electromagnetic interference (EMI) shielding in leadframe integrated circuit (IC) packages Grant 7,582,951 - Zhao , et al. September 1, 2	2009-09-01
Enhanced Die-Up Ball Grid Array and Method for Making the Same App 20090203172 - Khan; Reza-ur Rahman ; et al.	2009-08-13
Ball Grid Array Package Enhanced With a Thermal and Electrical Connector App 20090057871 - ZHAO; Sam Ziqun ; et al.	2009-03-05
Multipiece apparatus for thermal and electromagnetic interference (EMI) shielding enhancement in die-up array packages and method of making the same Grant 7,482,686 - Zhao , et al. January 27, 2	2009-01-27
Apparatus and method for thermal and electromagnetic interference (EMI) shielding enhancement in die-up array packages Grant 7,432,586 - Zhao , et al. October 7, 2	2008-10-07
Ball grid array package substrates with a modified central opening and method for making the same Grant 7,405,145 - Khan , et al. July 29, 2	2008-07-29
Flip Chip Package Including a Non-Planar Heat Spreader and Method of Making the Same App 20080006934 - Zhao; Sam Ziqun ; et al.	2008-01-10
Method for assembling a ball grid array package with two substrates Grant 7,312,108 - Zhao , et al. December 25, 2	2007-12-25
Flip chip package including a non-planar heat spreader and method of making the same Grant 7,271,479 - Zhao , et al. September 18, 2	2007-09-18
Die-up ball grid array package with a heat spreader and method for making the same Grant 7,259,448 - Zhang , et al. August 21, 2	2007-08-21
Die-up ball grid array package including a substrate capable of mounting an integrated circuit die and method for making the same Grant 7,259,457 - Zhang , et al. August 21, 2	2007-08-21
Ball grid array package with stepped stiffener layer Grant 7,245,500 - Khan , et al. July 17, 2	2007-07-17
Method for assembling a ball grid array package with multiple interposers Grant 7,241,645 - Zhao , et al. July 10, 2	2007-07-10
Low Voltage Drop and High Thermal Performance Ball Grid Array Package App 20070108598 - ZHONG; Chonghua ; et al.	2007-05-17
Methods and apparatus for improved thermal performance and electromagnetic interference (EMI) shielding in leadframe integrated circuit (IC) packages App 20070090502 - Zhao; Sam Ziqun ; et al.	2007-04-26
Ball grid array package enhanced with a thermal and electrical connector App 20070007644 - Zhao; Sam Ziqun ; et al.	2007-01-11
Ball grid array package enhanced with a thermal and electrical connector Grant 7,161,239 - Zhao , et al. January 9, 2	2007-01-09
Enhanced die-up ball grid array packages and method for making the same Grant 7,132,744 - Zhao , et al. November 7, 2	2006-11-07
IC die support structures for ball grid array package fabrication Grant 7,078,806 - Khan , et al. July 18, 2	2006-07-18
Flip chip package including a non-planar heat spreader and method of making the same App 20060091509 - Zhao; Sam Ziqun ; et al.	2006-05-04
Flip chip package including a heat spreader having an edge with a recessed edge portion and method of making the same App 20060091542 - Zhao; Sam Ziqun ; et al.	2006-05-04
Die down ball grid array packages and method for making same App 20060065972 - Khan; Reza-ur Rahman ; et al.	2006-03-30
Die-up ball grid array package with enhanced stiffener Grant 7,005,737 - Zhao , et al. February 28, 2	2006-02-28
Die-up ball grid array package with patterned stiffener opening Grant 6,989,593 - Khan , et al. January 24, 2	2006-01-24
Method for assembling a ball grid array package with two substrates App 20050173787 - Zhao, Sam Zinqun ; et al.	2005-08-11
Method of assembling a ball grid array package with patterned stiffener layer App 20050133905 - Zhao, Sam Ziqun ; et al.	2005-06-23
Ball grid array package substrates with a modified central opening and method for making the same App 20050127501 - Khan, Reza-ur Rahman ; et al.	2005-06-16
Ball grid array package with patterned stiffener layer Grant 6,906,414 - Zhao , et al. June 14, 2	2005-06-14
Method for making an enhanced die-up ball grid array package with two substrates Grant 6,887,741 - Zhao , et al. May 3, 2	2005-05-03
Ball grid array package substrates and method of making the same Grant 6,879,039 - Khan , et al. April 12, 2	2005-04-12
Enhanced die-up ball grid array package with two substrates Grant 6,876,553 - Zhao , et al. April 5, 2	2005-04-05
Die-up ball grid array package including a substrate capable of mounting an integrated circuit die and method for making the same App 20050051890 - Zhang, Tonglong ; et al.	2005-03-10
Ball grid array package with multiple interposers Grant 6,861,750 - Zhao , et al. March 1, 2	2005-03-01
Die-up ball grid array package including a substrate having an opening and method for making the same App 20050035452 - Zhang, Tonglong ; et al.	2005-02-17
Die-down ball grid array package with die-attached heat spreader and method for making the same Grant 6,853,070 - Khan , et al. February 8, 2	2005-02-08
Method for assembling a ball grid array package with multiple interposers App 20050023677 - Zhao, Sam Ziqun ; et al.	2005-02-03
IC die support structures for ball grid array package fabrication App 20040262754 - Khan, Reza-ur Rahman ; et al.	2004-12-30
Ball grid array package fabrication with IC die support structures Grant 6,825,108 - Khan , et al. November 30, 2	2004-11-30
Method for making an enhanced die-up ball grid array package with two substrates App 20040113284 - Zhao, Sam Ziqun ; et al.	2004-06-17
Ball grid array package with separated stiffener layer App 20030146509 - Zhao, Sam Ziqun ; et al.	2003-08-07
Ball grid array package with stepped stiffener layer App 20030146503 - Khan, Reza-ur Rahman ; et al.	2003-08-07
Ball grid array package fabrication with IC die support structures App 20030146506 - Khan, Reza-ur Rahman ; et al.	2003-08-07
Ball grid array package with multiple interposers App 20030146511 - Zhao, Sam Ziqun ; et al.	2003-08-07
Ball grid array package substrates and method of making the same App 20030111726 - Khan, Reza-Ur Rahman ; et al.	2003-06-19
Ball grid array package enhanced with a thermal and electrical connector App 20030057550 - Zhao, Sam Ziqun ; et al.	2003-03-27
Die-up ball grid array package with printed circuit board attachable heat spreader App 20020185734 - Zhao, Sam Ziqun ; et al.	2002-12-12
Die-up ball grid array package with enhanced stiffener App 20020185722 - Zhao, Sam Ziqun ; et al.	2002-12-12
Die-up ball grid array package with a heat spreader and method for making the same App 20020171144 - Zhang, Tonglong ; et al.	2002-11-21
Thermally and electrically enhanced ball grid array packaging App 20020135065 - Zhao, Sam Ziqun ; et al.	2002-09-26
Enhanced die-down ball grid array and method for making the same App 20020109226 - Khan, Reza-Ur Rahman ; et al.	2002-08-15
Enhanced die-up ball grid array and method for making the same App 20020079572 - Khan, Reza-ur Rahman ; et al.	2002-06-27
Enhanced die-up ball grid array packages and method for making the same App 20020079562 - Zhao, Sam Ziqun ; et al.	2002-06-27

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