Khan; Reza-ur R

Patent Applications and Registrations

Patent applications and USPTO patent grants for Khan; Reza-ur R.The latest application filed is for "method and system for secure heat sink attachment on semiconductor devices with macroscopic uneven surface features".

Company Profile

0.5.11

Khan; Reza-ur R - Rancho Santa Margarita CA
Khan; Reza-ur R. - Rancho Santa Margarita CA
Khan, Reza-ur R. - Margarita CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Die-up ball grid array package with die-attached heat spreader Grant 7,859,101 - Zhao , et al. December 28, 2	2010-12-28
Method and System for Secure Heat Sink Attachment on Semiconductor Devices with Macroscopic Uneven Surface Features App 20100025810 - ZHAO; Sam Z. ; et al.	2010-02-04
Method and system for secure heat sink attachment on semiconductor devices with macroscopic uneven surface features Grant 7,566,591 - Zhao , et al. July 28, 2	2009-07-28
Multipiece Apparatus for Thermal and Electromagnetic Interference (EMI) Shielding Enhancement in Die-Up Array Packages and Method of Making the Same App 20090115048 - ZHAO; Sam Z. ; et al.	2009-05-07
Die-up ball grid array package with printed circuit board attachable heat spreader Grant 7,227,256 - Zhao , et al. June 5, 2	2007-06-05
Method and system for secure heat sink attachment on semiconductor devices with macroscopic uneven surface features App 20070040267 - Zhao; Sam Z. ; et al.	2007-02-22
Die-up ball grid array package with printed circuit board attachable heat spreader Grant 7,102,225 - Khan , et al. September 5, 2	2006-09-05
Die-up ball grid array package with attached stiffener ring Grant 7,038,312 - Khan , et al. May 2, 2	2006-05-02
Apparatus and method for thermal and electromagnetic interference (EMI) shielding enhancement in die-up array packages App 20050280127 - Zhao, Sam Z. ; et al.	2005-12-22
Multipiece apparatus for thermal and electromagnetic interference (EMI) shielding enhancement in die-up array packages and method of making the same App 20050280139 - Zhao, Sam Z. ; et al.	2005-12-22
Enhanced die-up ball grid array and method for making the same App 20050029657 - Khan, Reza-ur R. ; et al.	2005-02-10
Enhanced die-up ball grid array package with two substrates and method for making the same App 20030179556 - Zhao, Sam Z. ; et al.	2003-09-25
Die-up ball grid array package with die-attached heat spreader App 20020190361 - Zhao, Sam Z. ; et al.	2002-12-19
Die-up ball grid array package with patterned stiffener opening App 20020190362 - Khan, Reza-ur R. ; et al.	2002-12-19
Die-up ball grid array package with printed circuit board attachable heat spreader App 20020185750 - Khan, Reza-Ur R. ; et al.	2002-12-12
Die-up ball grid array package with attached stiffener ring App 20020185720 - Khan, Reza-Ur R. ; et al.	2002-12-12

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