Khalaf; Bilal

Patent Applications and Registrations

Patent applications and USPTO patent grants for Khalaf; Bilal.The latest application filed is for "embedded component and methods of making the same".

Company Profile

11.14.22

Khalaf; Bilal - Folsom CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Embedded Component And Methods Of Making The Same App 20220223487 - Xu; Yi Elyn ; et al.	2022-07-14
Electronic device packages and methods for maximizing electrical current to dies and minimizing bond finger size Grant 11,373,974 - Khalaf , et al. June 28, 2	2022-06-28
Microelectronic Packages Having A Die Stack And A Device Within The Footprint Of The Die Stack App 20220181306 - Khalaf; Bilal	2022-06-09
Microelectronic packages having a die stack and a device within the footprint of the die stack Grant 11,329,027 - Khalaf May 10, 2	2022-05-10
Embedded component and methods of making the same Grant 11,315,843 - Xu , et al. April 26, 2	2022-04-26
High density die package configuration on system boards Grant 11,145,632 - Dominguez , et al. October 12, 2	2021-10-12
Buried Electrical Debug Access Port App 20210298183 - PON; Florence R. ; et al.	2021-09-23
Buried electrical debug access port Grant 11,064,612 - Pon , et al. July 13, 2	2021-07-13
Microelectronic Packages Having A Die Stack And A Device Within The Footprint Of The Die Stack App 20210202442 - Khalaf; Bilal	2021-07-01
Electronic Device Packages And Methods For Maximizing Electrical Current To Dies And Minimizing Bond Finger Size App 20210074668 - Khalaf; Bilal ; et al.	2021-03-11
Through mold via (TMV) using stacked modular mold rings Grant 10,879,152 - Xu , et al. December 29, 2	2020-12-29
High Density Die Package Configuration On System Boards App 20200381406 - DOMINGUEZ; Juan E. ; et al.	2020-12-03
Compact wirebonding in stacked-chip system in package, and methods of making same Grant 10,847,450 - Shojaie , et al. November 24, 2	2020-11-24
System In Package With Interconnected Modules App 20200227393 - KIM; Hyoung Il ; et al.	2020-07-16
Dual Head Capillary Design For Vertical Wire Bond App 20200118961 - CAI; Yuhong ; et al.	2020-04-16
Solderless Bga Interconnect App 20200119467 - LEUTEN; Tyler ; et al.	2020-04-16
Embedded Component And Methods Of Making The Same App 20190371687 - Xu; Yi Elyn ; et al.	2019-12-05
Packaged integrated circuit device with cantilever structure Grant 10,490,516 - Meyers , et al. Nov	2019-11-26
Microelectronics package providing increased memory component density Grant 10,475,766 - Khalaf Nov	2019-11-12
Through Mold Via (tmv) Using Stacked Modular Mold Rings App 20190279919 - Xu; Yi Elyn ; et al.	2019-09-12
Compact Wirebonding In Stacked-chip System In Package, And Methods Of Making Same App 20190181072 - SHOJAIE; Saeed ; et al.	2019-06-13
I/O layout footprint for multiple 1LM/2LM configurations Grant 10,304,814 - Ganguly , et al.	2019-05-28
I/O Layout Footprint For Multiple 1LM/2LM Configurations App 20190006340 - GANGULY; Konika ; et al.	2019-01-03
Electronics Package Devices With Through-substrate-vias Having Pitches Independent Of Substrate Thickness App 20190006331 - Khalaf; Bilal ; et al.	2019-01-03
Microelectronics Package Providing Increased Memory Component Density App 20180286833 - KHALAF; BILAL	2018-10-04
Microelectronic package debug access ports and methods of fabricating the same Grant 10,090,261 - Pon , et al. October 2, 2	2018-10-02
Packaged Integrated Circuit Device With Cantilever Structure App 20180138133 - Meyers; John G. ; et al.	2018-05-17
System-in-package logic and method to control an external packaged memory device Grant 9,972,610 - Khalaf May 15, 2	2018-05-15
Packaged integrated circuit device with cantilever structure Grant 9,871,007 - Meyers , et al. January 16, 2	2018-01-16
Buried Electrical Debug Access Port App 20170285097 - PON; Florence R. ; et al.	2017-10-05
Microelectronic Package Debug Access Ports And Methods Of Fabricating The Same App 20170200685 - Pon; Florence R. ; et al.	2017-07-13
Microelectronic package debug access ports Grant 9,646,952 - Pon , et al. May 9, 2	2017-05-09
Packaged Integrated Circuit Device With Cantilever Structure App 20170092602 - Meyers; John G. ; et al.	2017-03-30
Microelectronic Package Debug Access Ports App 20170084573 - Pon; Florence R. ; et al.	2017-03-23
System-in-package Logic And Method To Control An External Packaged Memory Device App 20170025400 - Khalaf; Bilal	2017-01-26

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