Kever; Wayne

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kever; Wayne.The latest application filed is for "selective solder bump application".

Company Profile

0.9.5

Kever; Wayne - Fort Collins CO US

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Tunnel ram intake manifold for improved low RPM operation Grant 9,163,594 - Kever October 20, 2	2015-10-20
Tunnel ram intake manifold for improved low RPM operation Grant 8,733,312 - Kever May 27, 2	2014-05-27
Selective solder bump application Grant 6,933,611 - Kever August 23, 2	2005-08-23
Multidispatch CPU integrated circuit having virtualized and modular resources and adjustable dispatch priority Grant 6,895,497 - Fetzer , et al. May 17, 2	2005-05-17
Apparatus and methods for cache line compression Grant 6,735,673 - Kever May 11, 2	2004-05-11
Selective solder bump application App 20040021140 - Kever, Wayne	2004-02-05
Selective solder bump application Grant 6,645,841 - Kever November 11, 2	2003-11-11
Apparatus for cache compression engine for data compression of on-chip caches to increase effective cache size Grant 6,640,283 - Naffziger , et al. October 28, 2	2003-10-28
Multidispatch cpu integrated circuit having virtualized and modular resources and adjustable dispatch priority App 20030172250 - Fetzer, Eric S. ; et al.	2003-09-11
Apparatus for cache compression engine for data compression of on-chip caches to increase effective cache size App 20030135694 - Naffziger, Samuel ; et al.	2003-07-17
Apparatus and methods for cache line compression App 20030131184 - Kever, Wayne	2003-07-10
Selective solder bump application App 20030096448 - Kever, Wayne	2003-05-22

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