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Patent applications and USPTO patent grants for Keung; Leung Ying.The latest application filed is for "method to form elevated source/drain using poly spacer".
Patent | Date |
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Method to form elevated source/drain using poly spacer Grant 6,566,208 - Pan , et al. May 20, 2 | 2003-05-20 |
Method to form elevated source/drain using poly spacer App 20030022450 - Pan, Yang ;   et al. | 2003-01-30 |
Method to improve latchup by forming selective sloped staircase STI structure to use in the I/0 or latchup sensitive area App 20030017710 - Yang, Pan ;   et al. | 2003-01-23 |
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