Keum; Hohyun

Patent Applications and Registrations

Patent applications and USPTO patent grants for Keum; Hohyun.The latest application filed is for "methods of making a bonded assembly and a re-entrant structure, and method of transfer printing a masking layer".

Company Profile

4.5.9

Keum; Hohyun - Champaign IL
KEUM; Hohyun - Goyang-si KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Methods Of Making A Bonded Assembly And A Re-entrant Structure, And Method Of Transfer Printing A Masking Layer App 20220163883 - Kim; Seok ; et al.	2022-05-26
Methods of making a bonded assembly and a re-entrant structure, and method of transfer printing a masking layer Grant 11,281,096 - Kim , et al. March 22, 2	2022-03-22
Flexible Printed Circuit Film And Stretchable Display Device Including The Same App 20220061154 - KEUM; Hohyun ; et al.	2022-02-24
Photoresist Contact Patterning Of Quantum Dot Films App 20210408325 - KIM; Seok ; et al.	2021-12-30
Flexible printed circuit film and stretchable display device including the same Grant 11,197,370 - Keum , et al. December 7, 2	2021-12-07
Photoresist contact patterning of quantum dot films Grant 11,152,536 - Kim , et al. October 19, 2	2021-10-19
Stretchable Display Device App 20210234135 - KIM; Kihan ; et al.	2021-07-29
Stretchable display device Grant 11,018,324 - Kim , et al. May 25, 2	2021-05-25
Microassembly of heterogeneous materials Grant 10,804,103 - Kim , et al. October 13, 2	2020-10-13
Stretchable Display Device App 20200111996 - KIM; Kihan ; et al.	2020-04-09
Photoresist Contact Patterning Of Quantum Dot Films App 20200091375 - KIM; Seok ; et al.	2020-03-19
Flexible Printed Circuit Film And Stretchable Display Device Including The Same App 20200037442 - KEUM; Hohyun ; et al.	2020-01-30
Methods Of Making A Bonded Assembly And A Re-entrant Structure, And Method Of Transfer Printing A Masking Layer App 20200026184 - Kim; Seok ; et al.	2020-01-23
Microassembly Of Heterogeneous Materials App 20190006180 - Kim; Seok ; et al.	2019-01-03

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