| Patent | Date |
|---|
Semiconductor Package and Passive Element with Interposer
App 20220262716 - Kessler; Angela ; et al. | 2022-08-18 |
Package With Clip Having Through Hole Accommodating Component-related Structure
App 20220254696 - KESSLER; Angela ; et al. | 2022-08-11 |
Semiconductor Module
App 20220108945 - Yuferev; Sergey ; et al. | 2022-04-07 |
Semiconductor Module
App 20220093573 - Kessler; Angela ; et al. | 2022-03-24 |
Semiconductor Devices Including Parallel Electrically Conductive Layers
App 20210287964 - PALM; Petteri ; et al. | 2021-09-16 |
Package comprising chip contact element of two different electrically conductive materials
Grant 11,056,458 - Kessler , et al. July 6, 2 | 2021-07-06 |
Encapsulated Package With Carrier, Laminate Body And Component In Between
App 20210035879 - Kessler; Angela ; et al. | 2021-02-04 |
Semiconductor Package Including A Cavity In Its Package Body
App 20210035876 - Otremba; Ralf ; et al. | 2021-02-04 |
Die Package and Method of Manufacturing a Die Package
App 20200402881 - Palm; Petteri ; et al. | 2020-12-24 |
Package Comprising Chip Contact Element Of Two Different Electrically Conductive Materials
App 20200176412 - Kessler; Angela ; et al. | 2020-06-04 |
Chip carrier with electrically conductive layer extending beyond thermally conductive dielectric sheet
Grant 10,615,097 - Grassmann , et al. | 2020-04-07 |
Chip carrier configured for delamination-free encapsulation and stable sintering
Grant 10,586,756 - Roth , et al. | 2020-03-10 |
Package with interconnections having different melting temperatures
App 20190157192 - Grassmann; Andreas ; et al. | 2019-05-23 |
Molded package with chip carrier comprising brazed electrically conductive layers
Grant 10,283,432 - Pavier , et al. | 2019-05-07 |
Semiconductor package comprising a transistor chip module and a driver chip module and a method for fabricating the same
Grant 10,242,969 - Hohlfeld , et al. | 2019-03-26 |
Package with interconnections having different melting temperatures
Grant 10,211,133 - Grassmann , et al. Feb | 2019-02-19 |
Molded package with chip carrier comprising brazed electrically conductive layers
App 20190006260 - PAVIER; Mark ; et al. | 2019-01-03 |
Chip packages, chip arrangements, a circuit board, and methods for manufacturing chip packages
Grant 10,128,180 - Bauer , et al. November 13, 2 | 2018-11-13 |
Molded package with chip carrier comprising brazed electrically conductive layers
Grant 10,074,590 - Pavier , et al. September 11, 2 | 2018-09-11 |
Circuit board embedding a power semiconductor chip
Grant 10,062,671 - Gruber , et al. August 28, 2 | 2018-08-28 |
Package with interconnections having different melting temperatures
App 20180138111 - Grassmann; Andreas ; et al. | 2018-05-17 |
Chip carrier with electrically conductive layer extending beyond thermally conductive dielectric sheet
App 20180102302 - GRASSMANN; Andreas ; et al. | 2018-04-12 |
Chip carrier configured for delamination-free encapsulation and stable sintering
App 20180096919 - ROTH; Alexander ; et al. | 2018-04-05 |
Chip Packages, Chip Arrangements, A Circuit Board, And Methods For Manufacturing Chip Packages
App 20180096924 - Bauer; Michael ; et al. | 2018-04-05 |
Chip packages, chip arrangements, a circuit board, and methods for manufacturing chip packages
Grant 9,859,198 - Bauer , et al. January 2, 2 | 2018-01-02 |
Redirecting solder material to visually inspectable package surface
App 20170278762 - KESSLER; Angela ; et al. | 2017-09-28 |
Chip arrangement and method for producing a chip arrangement
Grant 9,633,927 - Mahler , et al. April 25, 2 | 2017-04-25 |
Encapsulated electronic chip device with mounting provision and externally accessible electric connection structure
Grant 9,536,816 - Kessler , et al. January 3, 2 | 2017-01-03 |
Circuit Board Embedding a Power Semiconductor Chip
App 20160316567 - Gruber; Martin ; et al. | 2016-10-27 |
Semiconductor device including multiple semiconductor chips and a laminate
Grant 9,263,425 - Scharf , et al. February 16, 2 | 2016-02-16 |
Encapsulated electronic chip device with mounting provision and externally accessible electric connection structure
App 20160035658 - KESSLER; Angela ; et al. | 2016-02-04 |
Semiconductor Device Including Multiple Semiconductor Chips and a Laminate
App 20150162319 - Scharf; Thorsten ; et al. | 2015-06-11 |
Semiconductor Package Comprising a Transistor Chip Module and a Driver Chip Module and a Method for Fabricating the Same
App 20150130071 - Hohlfeld; Olaf ; et al. | 2015-05-14 |
Chip Packages, Chip Arrangements, A Circuit Board, And Methods For Manufacturing Chip Packages
App 20150097282 - Bauer; Michael ; et al. | 2015-04-09 |
Integration of current measurement in wiring structure of an electronic circuit
App 20140327458 - GRUBER; Martin ; et al. | 2014-11-06 |
Chip Packages, Chip Arrangements, A Circuit Board, And Methods For Manufacturing Chip Packages
App 20140001622 - Bauer; Michael ; et al. | 2014-01-02 |
Chip Arrangement And Method For Producing A Chip Arrangement
App 20130328206 - Mahler; Joachim ; et al. | 2013-12-12 |
Chip arrangement and method for producing a chip arrangement
Grant 8,519,547 - Mahler , et al. August 27, 2 | 2013-08-27 |
Thermoplastic-thermosetting composite and method for bonding a thermoplastic material to a thermosetting material
Grant 8,507,080 - Mahler , et al. August 13, 2 | 2013-08-13 |
Semiconductor component and production method
Grant 8,440,733 - Mahler , et al. May 14, 2 | 2013-05-14 |
Semiconductor Component Having A Stack Of Semiconductor Chips And Method For Producing The Same
App 20130105992 - Bauer; Michael ; et al. | 2013-05-02 |
Semiconductor component having a stack of semiconductor chips and method for producing the same
Grant 8,354,299 - Bauer , et al. January 15, 2 | 2013-01-15 |
Semiconductor Component And Production Method
App 20120223424 - Mahler; Joachim ; et al. | 2012-09-06 |
Semiconductor component and production method
Grant 8,178,390 - Mahler , et al. May 15, 2 | 2012-05-15 |
Semiconductor module with at least two substrates
Grant 8,017,438 - Bauer , et al. September 13, 2 | 2011-09-13 |
Power semiconductor device in lead frame employing connecting element with conductive film
Grant 8,013,441 - Bauer , et al. September 6, 2 | 2011-09-06 |
Component arrangement comprising a carrier
Grant 7,911,039 - Bauer , et al. March 22, 2 | 2011-03-22 |
Semiconductor chip comprising a metal coating structure and associated production method
Grant 7,880,300 - Bauer , et al. February 1, 2 | 2011-02-01 |
Layer between interfaces of different components in semiconductor devices
Grant 7,834,467 - Bauer , et al. November 16, 2 | 2010-11-16 |
Semiconductor module having discrete components and method for producing the same
Grant 7,795,727 - Bauer , et al. September 14, 2 | 2010-09-14 |
Semiconductor Component Having A Stack Of Semiconductor Chips And Method For Producing The Same
App 20100207277 - Bauer; Michael ; et al. | 2010-08-19 |
Semiconductor component including semiconductor chip and method for producing the same
Grant 7,768,107 - Bauer , et al. August 3, 2 | 2010-08-03 |
Semiconductor device having a sensor chip, and method for producing the same
Grant 7,749,797 - Bauer , et al. July 6, 2 | 2010-07-06 |
Plastic housing composition for embedding semiconductor devices in a plastic housing and use of the plastic housing composition
Grant 7,728,053 - Bauer , et al. June 1, 2 | 2010-06-01 |
Electronic module with a semiconductor chip and a component housing and methods for producing the same
Grant 7,714,422 - Bauer , et al. May 11, 2 | 2010-05-11 |
Semiconductor device with semiconductor chip and method for producing it
Grant 7,705,436 - Mahler , et al. April 27, 2 | 2010-04-27 |
Method of joining a thermoplastic material to a thermoset material, and thermoplastic-thermoset composite
Grant 7,645,642 - Bauer , et al. January 12, 2 | 2010-01-12 |
Semiconductor sensor component including a sensor chip and methods for the manufacturing thereof
Grant 7,629,660 - Bauer , et al. December 8, 2 | 2009-12-08 |
Thermoplastic-thermosetting Composite And Method For Bonding A Thermoplastic Material To A Thermosetting Material
App 20090280314 - Mahler; Joachim ; et al. | 2009-11-12 |
Lead structure for a semiconductor component and method for producing the same
Grant 7,589,403 - Bauer , et al. September 15, 2 | 2009-09-15 |
Semiconductor device with semiconductor chip and method for producing it
App 20090039484 - Mahler; Joachim ; et al. | 2009-02-12 |
Semiconductor Device Having A Sensor Chip, And Method For Producing The Same
App 20090026558 - Bauer; Michael ; et al. | 2009-01-29 |
Sensor component with a cavity housing and a sensor chip and method for producing the same
Grant 7,464,603 - Bauer , et al. December 16, 2 | 2008-12-16 |
Method For Stacking Semiconductor Chips And Semiconductor Chip Stack Produced By The Method
App 20080303172 - Bauer; Michael ; et al. | 2008-12-11 |
Semiconductor component comprising flip chip contacts with polymer cores and method of producing the same
Grant 7,462,940 - Bauer , et al. December 9, 2 | 2008-12-09 |
Semiconductor device with conductor tracks between semiconductor chip and circuit carrier and method for producing the same
Grant 7,443,019 - Bauer , et al. October 28, 2 | 2008-10-28 |
Lead Structure for a Semiconductor Component and Method for Producing the Same
App 20080224301 - Bauer; Michael ; et al. | 2008-09-18 |
Semiconductor Component and Production Method
App 20080220567 - Mahler; Joachim ; et al. | 2008-09-11 |
Sensor Component With a Cavity Housing and a Sensor Chip and Method for Producing the Same
App 20080173097 - Bauer; Michael ; et al. | 2008-07-24 |
Semiconductor Module With At Least Two Substrates
App 20080122075 - Bauer; Michael ; et al. | 2008-05-29 |
Component arrangement comprising a carrier
App 20080111216 - BAUER; Michael ; et al. | 2008-05-15 |
Circuit Arrangement, System Carrier and Methods for Producing Same
App 20070278637 - Bauer; Michael ; et al. | 2007-12-06 |
Electronic Module with a Semiconductor Chip and a Component Housing and Methods for Producing the Same
App 20070268674 - Bauer; Michael ; et al. | 2007-11-22 |
Semiconductor Module Havingdiscrete Components And Method For Producing The Same
App 20070235865 - Bauer; Michael ; et al. | 2007-10-11 |
Semiconductor Chip Comprising A Metal Coating Structure And Associated Production Method
App 20070228567 - Bauer; Michael ; et al. | 2007-10-04 |
Layer Between Interfaces of Different Components in Semiconductor Devices
App 20070205518 - Bauer; Michael ; et al. | 2007-09-06 |
Semiconductor Component Comprising Flip Chip Contacts And Method For Producing The Same
App 20070182021 - Bauer; Michael ; et al. | 2007-08-09 |
Semiconductor component including semiconductor chip and method for producing the same
App 20070145552 - Bauer; Michael ; et al. | 2007-06-28 |
Power semiconductor device in lead frame technology with a vertical current path
App 20070085201 - Bauer; Michael ; et al. | 2007-04-19 |
Plastic housing composition for embedding semicondutor devices in a plastic housing and use of the plastic housing composition
App 20070054530 - Bauer; Michael ; et al. | 2007-03-08 |
Semiconductor device with conductor tracks between semiconductor chip and circuit carrier and method for producing the same
App 20070034997 - Bauer; Michael ; et al. | 2007-02-15 |
Semiconductor sensor component including a sensor chip and methods for the manufacturing thereof
App 20060273420 - Bauer; Michael ; et al. | 2006-12-07 |
Method of joining a thermoplastic material to a thermoset material, and thermoplastic-thermoset composite
App 20060175583 - Bauer; Michael ; et al. | 2006-08-10 |
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