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Patent applications and USPTO patent grants for Keser; Lizabeth Ann A..The latest application filed is for "redistributed chip packaging with thermal contact to device backside".
Patent | Date |
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Electronic device and method of packaging an electronic device Grant 9,054,111 - Xu , et al. June 9, 2 | 2015-06-09 |
Redistributed Chip Packaging With Thermal Contact To Device Backside App 20120252169 - Tracht; Neil T. ;   et al. | 2012-10-04 |
Redistributed chip packaging with thermal contact to device backside Grant 8,217,511 - Tracht , et al. July 10, 2 | 2012-07-10 |
Method Of Packaging Integrated Circuit Dies With Thermal Dissipation Capability App 20100148357 - Yang; Liyu ;   et al. | 2010-06-17 |
Redistributed Chip Packaging With Thermal Contact To Device Backside App 20090032933 - Tracht; Neil T. ;   et al. | 2009-02-05 |
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