| Patent | Date |
|---|
System, apparatus, and method for embedding a 3D component with an interconnect structure
Grant 10,163,687 - Rae , et al. Dec | 2018-12-25 |
Semiconductor device comprising mold for top side and sidewall protection
Grant 10,141,202 - Alvarado , et al. Nov | 2018-11-27 |
System, apparatus, and method for embedding a device in a faceup workpiece
Grant 9,985,010 - Rae , et al. May 29, 2 | 2018-05-29 |
Redistribution Layer (rdl) Fan-out Wafer Level Packaging (fowlp) Structure
App 20170373032 - OH; Jihoon ; et al. | 2017-12-28 |
Semiconductor package interconnect
Grant 9,806,052 - Keser , et al. October 31, 2 | 2017-10-31 |
Planar fan-out wafer level packaging
Grant 9,806,048 - Keser , et al. October 31, 2 | 2017-10-31 |
Planar Fan-out Wafer Level Packaging
App 20170271289 - KESER; Lizabeth Ann ; et al. | 2017-09-21 |
Low profile integrated circuit (IC) package comprising a plurality of dies
Grant 9,679,873 - Keser , et al. June 13, 2 | 2017-06-13 |
Package on package (POP) device comprising solder connections between integrated circuit device packages
Grant 9,601,472 - Keser , et al. March 21, 2 | 2017-03-21 |
Semiconductor Package Interconnect
App 20170077053 - KESER; Lizabeth Ann ; et al. | 2017-03-16 |
Low Profile Integrated Circuit (ic) Package Comprising A Plurality Of Dies
App 20160372446 - Keser; Lizabeth Ann ; et al. | 2016-12-22 |
System, Apparatus, And Method For Embedding A Device In A Faceup Workpiece
App 20160343635 - RAE; David Fraser ; et al. | 2016-11-24 |
High Aspect Ratio Interconnect For Wafer Level Package (wlp) And Integrated Circuit (ic) Package
App 20160343646 - Alvarado; Reynante Tamunan ; et al. | 2016-11-24 |
System, Apparatus, And Method For Embedding A 3d Component With An Interconnect Structure
App 20160343651 - RAE; David Fraser ; et al. | 2016-11-24 |
Package On Package (pop) Device Comprising Solder Connections Between Integrated Circuit Device Packages
App 20160315072 - Keser; Lizabeth Ann ; et al. | 2016-10-27 |
Crack stopping structure in wafer level packaging (WLP)
Grant 9,379,065 - Keser , et al. June 28, 2 | 2016-06-28 |
Wafer level package without sidewall cracking
Grant 9,318,405 - Xu , et al. April 19, 2 | 2016-04-19 |
Integrated device comprising wires as vias in an encapsulation layer
Grant 9,209,110 - Alvarado , et al. December 8, 2 | 2015-12-08 |
Integrated Device Comprising Wires As Vias In An Encapsulation Layer
App 20150325496 - Alvarado; Reynante Tamunan ; et al. | 2015-11-12 |
Wafer Level Package And Fan Out Reconstitution Process For Making The Same
App 20150318229 - XU; Jianwen ; et al. | 2015-11-05 |
Stacked redistribution layers on die
Grant 9,171,782 - Hau-Riege , et al. October 27, 2 | 2015-10-27 |
Method for singulating electronic components from a substrate
Grant 9,142,434 - Gao , et al. September 22, 2 | 2015-09-22 |
Via Under The Interconnect Structures For Semiconductor Devices
App 20150228594 - Alvarado; Reynante Tamunan ; et al. | 2015-08-13 |
Crack Stopping Structure In Wafer Level Packaging (wlp)
App 20150048517 - Keser; Lizabeth Ann ; et al. | 2015-02-19 |
Stacked Redistribution Layers On Die
App 20150041982 - Hau-Riege; Christine Sung-An ; et al. | 2015-02-12 |
Semiconductor Device Comprising Mold For Top Side And Sidewall Protection
App 20140339712 - Alvarado; Reynante Tamunan ; et al. | 2014-11-20 |
Method For Singulating Electronic Components From A Substrate
App 20110217814 - Gao; Wei ; et al. | 2011-09-08 |
Electronic Device And Method Of Packaging An Electronic Device
App 20100252919 - Xu; Jianwen ; et al. | 2010-10-07 |
Method For Forming A Microelectronic Assembly Including Encapsulating A Die Using A Sacrificial Layer
App 20080182363 - Amrine; Craig S. ; et al. | 2008-07-31 |
Methods and apparatus for thermal management in a multi-layer embedded chip structure
Grant 7,405,102 - Lee , et al. July 29, 2 | 2008-07-29 |
Methods and apparatus for thermal management in a multi-layer embedded chip structure
App 20070284711 - Lee; Tien Yu T. ; et al. | 2007-12-13 |
Perforated embedded plane package and method
App 20070212813 - Fay; Owen R. ; et al. | 2007-09-13 |
Simplification of ball attach method using super-saturated fine crystal flux
Grant 7,108,755 - Wetz , et al. September 19, 2 | 2006-09-19 |
Under bump metallurgy structural design for high reliability bumped packages
Grant 6,930,032 - Sarihan , et al. August 16, 2 | 2005-08-16 |
Simplification of ball attach method using super-saturated fine crystal flux
App 20040020562 - Wetz, Li Ann ; et al. | 2004-02-05 |
Under bump metallurgy structural design for high reliability bumped packages
App 20030214036 - Sarihan, Vijay ; et al. | 2003-11-20 |
Stress compensation composition and semiconductor component formed using the stress compensation composition
Grant 6,458,622 - Keser , et al. October 1, 2 | 2002-10-01 |
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