Keser; Lizabeth

Patent Applications and Registrations

Patent applications and USPTO patent grants for Keser; Lizabeth.The latest application filed is for "face-up fan-out electronic package with passive components using a support".

Company Profile

16.7.12

Keser; Lizabeth - Munich DE

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Fan out package with integrated peripheral devices and methods Grant 11,404,339 - Keser , et al. August 2, 2	2022-08-02
Face-up Fan-out Electronic Package With Passive Components Using A Support App 20220051990 - Keser; Lizabeth ; et al.	2022-02-17
Face-up fan-out electronic package with passive components using a support Grant 11,211,337 - Keser , et al. December 28, 2	2021-12-28
Fan Out Package With Integrated Peripheral Devices And Methods App 20200303274 - Keser; Lizabeth ; et al.	2020-09-24
Fan Out Package And Methods App 20200251396 - Kind Code	2020-08-06
Molded substrate package in fan-out wafer level package Grant 10,720,393 - Keser , et al.	2020-07-21
Fan out package with integrated peripheral devices and methods Grant 10,699,980 - Keser , et al.	2020-06-30
Package including an integrated routing layer and a molded routing layer Grant 10,665,522 - Keser , et al.	2020-05-26
Face-up Fan-out Electronic Package With Passive Components Using A Support App 20200105678 - Keser; Lizabeth ; et al.	2020-04-02
Face-up fan-out electronic package with passive components using a support Grant 10,546,817 - Keser , et al. Ja	2020-01-28
Chip Scale Thin 3d Die Stacked Package App 20200006293 - SANKMAN; Robert ; et al.	2020-01-02
Molded Substrate Package In Fan-out Wafer Level Package App 20190393154 - Keser; Lizabeth ; et al.	2019-12-26
Fan Out Package With Integrated Peripheral Devices And Methods App 20190304863 - Keser; Lizabeth ; et al.	2019-10-03
Molded substrate package in fan-out wafer level package Grant 10,403,580 - Keser , et al. Sep	2019-09-03
Molded Substrate Package In Fan-out Wafer Level Package App 20190206800 - Keser; Lizabeth ; et al.	2019-07-04
Face-up Fan-out Electronic Package With Passive Components Using A Support App 20190206799 - Keser; Lizabeth ; et al.	2019-07-04
Interposer With Angled Vias App 20190206777 - Koller; Sonja ; et al.	2019-07-04
Fan Out Package And Methods App 20190198478 - Keser; Lizabeth ; et al.	2019-06-27

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.