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Patent applications and USPTO patent grants for Keser; Helmut.The latest application filed is for "insulated power semiconductor module with reduced partial discharge and manufacturing method".
Patent | Date |
---|---|
Power semiconductor module Grant 7,768,139 - Knapp , et al. August 3, 2 | 2010-08-03 |
Insulated power semiconductor module with reduced partial discharge and manufacturing method App 20080153211 - Hamidi; Amina ;   et al. | 2008-06-26 |
Power semiconductor module App 20060238983 - Knapp; Wolfgang ;   et al. | 2006-10-26 |
Insulated power semiconductor module with reduced partial discharge and manufacturing method App 20060214186 - Hamidi; Amina ;   et al. | 2006-09-28 |
Method for diffusing aluminum Grant 4,720,469 - Keser , et al. January 19, 1 | 1988-01-19 |
Method for the bubble-free joining of a large-area semiconductor component by means of soldering to a component part serving as substrate Grant 4,650,107 - Keser March 17, 1 | 1987-03-17 |
Method for directly joining metal pieces to oxide-ceramic substrates Grant 4,483,810 - Bunk , et al. November 20, 1 | 1984-11-20 |
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