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Patent applications and USPTO patent grants for Kennedy; John V..The latest application filed is for "high density interconnect assembly comprising stacked electronic module".
Patent | Date |
---|---|
Three-dimensional Imaging Processing Module Incorporating Stacked Layers Containing Microelectronic Circuits App 20070052947 - Ludwig; David E. ;   et al. | 2007-03-08 |
High density interconnect assembly comprising stacked electronic module App 20070052084 - Kennedy; John V. | 2007-03-08 |
Three-dimensional imaging processing module incorporating stacked layers containing microelectronic circuits Grant 7,180,579 - Ludwig , et al. February 20, 2 | 2007-02-20 |
Three-dimensional imaging device incorporating stacked layers containing microelectronic circuits App 20040188596 - Ludwig, David E. ;   et al. | 2004-09-30 |
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