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Patent applications and USPTO patent grants for Kennedy; Craig M..The latest application filed is for "solder reserve transfer device and process".
Patent | Date |
---|---|
Solder reserve transfer device and process Grant 6,976,855 - Kennedy , et al. December 20, 2 | 2005-12-20 |
Tape-packaged headed pin contact Grant 6,966,440 - Kennedy , et al. November 22, 2 | 2005-11-22 |
Solder reserve transfer device and process App 20040209495 - Kennedy, Craig M. ;   et al. | 2004-10-21 |
Solder reserve transfer device and process Grant 6,780,028 - Kennedy , et al. August 24, 2 | 2004-08-24 |
Discrete solder ball contact and circuit board assembly utilizing same Grant 6,700,079 - Bogursky , et al. March 2, 2 | 2004-03-02 |
Liquid pin transfer assembly with common pin bias Grant 6,610,253 - Kennedy , et al. August 26, 2 | 2003-08-26 |
Discrete solder ball contact and circuit board assembly utilizing same App 20030079911 - Bogursky, Robert M. ;   et al. | 2003-05-01 |
Header for surface mount between parallel circuit boards App 20030080174 - Kennedy, Craig M. | 2003-05-01 |
Liquid pin transfer assembly with common pin bias App 20010049149 - Kennedy, Craig M. ;   et al. | 2001-12-06 |
Hybrid solder ball and pin grid array circuit board interconnect system and method Grant 6,272,741 - Kennedy , et al. August 14, 2 | 2001-08-14 |
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