Patent | Date |
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Mosaic Focal Plane Array App 20220310690 - Gulbransen; David J. ;   et al. | 2022-09-29 |
Digital pixel having high sensitivity and dynamic range Grant 11,284,025 - Malone , et al. March 22, 2 | 2022-03-22 |
Digital Pixel Having High Sensitivity And Dynamic Range App 20210377470 - Malone; Neil R. ;   et al. | 2021-12-02 |
Imager With Integrated Asynchoronous Laser Pulse Detection App 20210227158 - Kennedy; Adam M. ;   et al. | 2021-07-22 |
Per-pixel dark reference bolometer Grant 10,451,487 - Kennedy , et al. Oc | 2019-10-22 |
Method of stress relief in anti-reflective coated cap wafers for wafer level packaged infrared focal plane arrays Grant 10,315,918 - Gooch , et al. | 2019-06-11 |
Infrared scene projector with per-pixel spectral and polarisation capability Grant 10,267,997 - Wehner , et al. | 2019-04-23 |
Wafer level package solder barrier used as vacuum getter Grant 10,262,913 - Gooch , et al. | 2019-04-16 |
Wafer Level Package Solder Barrier Used As Vacuum Getter App 20180226309 - Gooch; Roland W. ;   et al. | 2018-08-09 |
Wafer level MEMS package including dual seal ring Grant 9,969,610 - Diep , et al. May 15, 2 | 2018-05-15 |
Wafer level package solder barrier used as vacuum getter Grant 9,966,320 - Gooch , et al. May 8, 2 | 2018-05-08 |
Use of an external getter to reduce package pressure Grant 9,865,519 - Black , et al. January 9, 2 | 2018-01-09 |
Wafer level MEMS package including dual seal ring Grant 9,771,258 - Diep , et al. September 26, 2 | 2017-09-26 |
Hermetically sealed package having stress reducing layer Grant 9,708,181 - Kennedy , et al. July 18, 2 | 2017-07-18 |
Use Of An External Getter To Reduce Package Pressure App 20170148695 - Black; Stephen H. ;   et al. | 2017-05-25 |
Wafer Level Mems Package Including Dual Seal Ring App 20170129775 - Diep; Buu Q. ;   et al. | 2017-05-11 |
Infrared Scene Projector With Per-pixel Spectral And Polarisation Capability App 20170131475 - Wehner; Justin Gordon Adams ;   et al. | 2017-05-11 |
Use of an external getter to reduce package pressure Grant 9,570,321 - Black , et al. February 14, 2 | 2017-02-14 |
Wafer Level Package Solder Barrier Used As Vacuum Getter App 20170011977 - Gooch; Roland W. ;   et al. | 2017-01-12 |
Wafer Level Mems Package Including Dual Seal Ring App 20160376146 - Diep; Buu Q. ;   et al. | 2016-12-29 |
Wafer level package solder barrier used as vacuum getter Grant 9,520,332 - Gooch , et al. December 13, 2 | 2016-12-13 |
Method Of Stress Relief In Anti-reflective Coated Cap Wafers For Wafer Level Packaged Infrared Focal Plane Arrays App 20160340179 - Gooch; Roland W. ;   et al. | 2016-11-24 |
Method of stress relief in anti-reflective coated cap wafers for wafer level packaged infrared focal plane arrays Grant 9,427,776 - Gooch , et al. August 30, 2 | 2016-08-30 |
Hermetically Sealed Package Having Stress Reducing Layer App 20160167959 - Kennedy; Adam M. ;   et al. | 2016-06-16 |
Hermetically sealed package having stress reducing layer Grant 9,334,154 - Kennedy , et al. May 10, 2 | 2016-05-10 |
Hermetically Sealed Package Having Stress Reducing Layer App 20160039665 - Kennedy; Adam M. ;   et al. | 2016-02-11 |
Getter Structure And Method For Forming Such Structure App 20160040282 - Gooch; Roland ;   et al. | 2016-02-11 |
Wafer level packaged infrared (IR) focal plane array (FPA) with evanescent wave coupling Grant 9,227,839 - Gooch , et al. January 5, 2 | 2016-01-05 |
Getter structure and method for forming such structure Grant 9,196,556 - Gooch , et al. November 24, 2 | 2015-11-24 |
Integrated bondline spacers for wafer level packaged circuit devices Grant 9,187,312 - Gooch , et al. November 17, 2 | 2015-11-17 |
Wafer Level Packaged Infrared (ir) Focal Plane Array (fpa) With Evanescent Wave Coupling App 20150321905 - Gooch; Roland W. ;   et al. | 2015-11-12 |
Integrated bondline spacers for wafer level packaged circuit devices Grant 9,174,836 - Gooch , et al. November 3, 2 | 2015-11-03 |
Wafer Level Package Solder Barrier Used As Vacuum Getter App 20150279755 - Gooch; Roland W. ;   et al. | 2015-10-01 |
Getter Structure And Method For Forming Such Structure App 20150249042 - Gooch; Roland ;   et al. | 2015-09-03 |
Method of forming deposited patterns on a surface Grant 9,105,800 - Gooch , et al. August 11, 2 | 2015-08-11 |
Methods and apparatus for 3D UV imaging Grant 9,091,748 - Kennedy , et al. July 28, 2 | 2015-07-28 |
Wafer level package solder barrier used as vacuum getter Grant 9,093,444 - Gooch , et al. July 28, 2 | 2015-07-28 |
Method Of Forming Deposited Patterns On A Surface App 20150162479 - Gooch; Roland ;   et al. | 2015-06-11 |
Wafer Level Package Solder Barrier Used As Vacuum Getter App 20150014854 - Gooch; Roland W. ;   et al. | 2015-01-15 |
Optical device for detection of an agent Grant 8,928,883 - Jaworski , et al. January 6, 2 | 2015-01-06 |
Integrated Bondline Spacers For Wafer Level Packaged Circuit Devices App 20140346643 - Gooch; Roland ;   et al. | 2014-11-27 |
Integrated Bondline Spacers For Wafer Level Packaged Circuit Devices App 20140193948 - Gooch; Roland ;   et al. | 2014-07-10 |
Getter Structure For Wafer Level Vacuum Packaged Device App 20140175590 - Gooch; Roland ;   et al. | 2014-06-26 |
Integrated Bondline Spacers For Wafer Level Packaged Circuit Devices App 20140124899 - Gooch; Roland ;   et al. | 2014-05-08 |
Method Of Stress Relief In Anti-reflective Coated Cap Wafers For Wafer Level Packaged Infrared Focal Plane Arrays App 20140053966 - Gooch; Roland W. ;   et al. | 2014-02-27 |
Multichip packaging for imaging system Grant 8,653,467 - Black , et al. February 18, 2 | 2014-02-18 |
Pixel Structure With Reduced Vacuum Requirements App 20130334635 - Kennedy; Adam M. ;   et al. | 2013-12-19 |
Multichip Packaging for Imaging System App 20130334425 - Black; Stephen H. ;   et al. | 2013-12-19 |
Methods And Apparatus For 3d Uv Imaging App 20130278716 - Kennedy; Adam M. ;   et al. | 2013-10-24 |
Method and system for detecting neutron radiation Grant 8,389,947 - Kennedy , et al. March 5, 2 | 2013-03-05 |
Method and System for Detecting Neutron Radiation App 20120326047 - Kennedy; Adam M. ;   et al. | 2012-12-27 |
USING A MULTI-CHIP SYSTEM IN A PACKAGE (MCSiP) IN IMAGING APPLICATIONS TO YIELD A LOW COST, SMALL SIZE CAMERA ON A CHIP App 20120281113 - Kennedy; Adam M. ;   et al. | 2012-11-08 |
Variable aperture optical device having a microshutter Grant 8,218,220 - Dodds , et al. July 10, 2 | 2012-07-10 |
Variable Aperture Optical Device Having A Microshutter App 20120169884 - Dodds; Robert K. ;   et al. | 2012-07-05 |
Thermally stabilized radiation detector utilizing temperature controlled radiation filter Grant 7,105,821 - Kennedy , et al. September 12, 2 | 2006-09-12 |
Integrated package design and method for a radiation sensing device Grant 7,084,010 - Kennedy , et al. August 1, 2 | 2006-08-01 |
Method and apparatus providing focal plane array active thermal control elements Grant 6,649,913 - Kennedy , et al. November 18, 2 | 2003-11-18 |
Integrated multiple sensor package Grant 6,326,611 - Kennedy , et al. December 4, 2 | 2001-12-04 |
Bonded structure with high-conductivity bonding element Grant 6,107,216 - Kennedy , et al. August 22, 2 | 2000-08-22 |
Vacuum package having vacuum-deposited local getter and its preparation Grant 5,921,461 - Kennedy , et al. July 13, 1 | 1999-07-13 |
Integrated infrared microlens and gas molecule getter grating in a vacuum package Grant 5,701,008 - Ray , et al. December 23, 1 | 1997-12-23 |
Metal organic chemical vapor deposition (MOCVD) reactor with recirculation suppressing flow guide Grant 5,173,336 - Kennedy December 22, 1 | 1992-12-22 |