Ken; Weng-Dah

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ken; Weng-Dah.The latest application filed is for "non-contact angle measuring apparatus".

Company Profile

6.12.16

Ken; Weng-Dah - Hsinchu City TW
Ken; Weng-Dah - Hsinchu N/A TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Non-contact Angle Measuring Apparatus App 20200397391 - Ken; Weng-Dah ; et al.	2020-12-24
Transistor With Low Leakage Currents And Manufacturing Method Thereof App 20200381548 - Lu; Chao-Chun ; et al.	2020-12-03
Green bike Grant 10,604,203 - Ken	2020-03-31
System-in-package module with memory Grant 10,504,603 - Ken , et al. Dec	2019-12-10
Reconfigurable high speed memory chip module and electronic device with a reconfigurable high speed memory chip module Grant 9,940,292 - Ken , et al. April 10, 2	2018-04-10
Mobile Computing Device Reconfiguration Is Response To Environmental Factors Including Downloading Hardware And Software Associated With Multiple Users Of The Mobile Device App 20180024959 - Ken; Weng-Dah ; et al.	2018-01-25
System-in-package Module With Memory App 20170323687 - Ken; Weng-Dah ; et al.	2017-11-09
Reconfigurable high speed memory chip module and electronic device with a reconfigurable high speed memory chip module Grant 9,798,692 - Ken , et al. October 24, 2	2017-10-24
Non-contact Angle Measuring Apparatus, Mission Critical Inspection Apparatus, Non-invasive Diagnosis/treatment Apparatus, Method For Filtering Matter Wave From A Composite Particle Beam, Non-invasive Measuring Apparatus, Apparatus For Generating A Virtual Space-time Lattice, And Fine Atomic Clock App 20170281102 - Ken; Weng-Dah ; et al.	2017-10-05
System-in-package module with memory Grant 9,748,002 - Ken , et al. August 29, 2	2017-08-29
System-in-package module and manufacture method for a system-in-package module Grant 9,601,456 - Rong , et al. March 21, 2	2017-03-21
Semiconductor multi-project or multi-product wafer process Grant 9,312,254 - Ken April 12, 2	2016-04-12
Semiconductor Multi-project Or Multi-product Wafer Process App 20160043065 - Ken; Weng-Dah	2016-02-11
Reconfigurable high speed memory chip module and electronic device with a reconfigurable high speed memory chip module Grant 9,201,834 - Ken , et al. December 1, 2	2015-12-01
Reconfigurable High Speed Memory Chip Module And Electronic Device With A Reconfigurable High Speed Memory Chip Module App 20150317276 - Ken; Weng-Dah ; et al.	2015-11-05
High speed memory chip module and electronics system device with a high speed memory chip module Grant 9,164,942 - Ken , et al. October 20, 2	2015-10-20
System-in-package Module And Manufacture Method For A System-in-package Module App 20150206849 - Rong; Bor-Doou ; et al.	2015-07-23
System-in-package Module With Memory App 20150113356 - Ken; Weng-Dah ; et al.	2015-04-23
High Speed Memory Chip Module And Electronics System Device With A High Speed Memory Chip Module App 20130091315 - Ken; Weng-Dah ; et al.	2013-04-11
Reconfigurable High Speed Memory Chip Module And Electronics System Device App 20130091312 - Ken; Weng-Dah ; et al.	2013-04-11
Green Bike App 20120086183 - Ken; Weng-Dah	2012-04-12
Semiconductor Multi-project Or Multi-product Wafer Process App 20120088329 - Ken; Weng-Dah	2012-04-12

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