Kemper; Alfred

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kemper; Alfred.The latest application filed is for "method for connecting a component with a substrate".

Company Profile

0.10.10

Kemper; Alfred - Warstein N/A DE

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method for producing an electronic device Grant 8,698,053 - Kemper April 15, 2	2014-04-15
Method and device for producing a bondable area region on a carrier Grant 8,167,187 - Bayerer , et al. May 1, 2	2012-05-01
Power semiconductor module and method for producing the same Grant 7,986,034 - Kemper , et al. July 26, 2	2011-07-26
Method for Connecting a Component With a Substrate App 20110017803 - Guth; Karsten ; et al.	2011-01-27
Apparatus and method for connecting a component with a substrate Grant 7,793,819 - Guth , et al. September 14, 2	2010-09-14
Method for the structured application of a laminatable film to a substrate for a semiconductor module Grant 7,742,843 - Licht , et al. June 22, 2	2010-06-22
Semiconductor chip attachment Grant 7,555,832 - Guth , et al. July 7, 2	2009-07-07
Apparatus and method for connecting components Grant 7,525,187 - Speckels , et al. April 28, 2	2009-04-28
Apparatus And Method For Connecting A Component With A Substrate App 20080230589 - Guth; Karsten ; et al.	2008-09-25
Semiconductor Chip Attachment App 20080229575 - Guth; Karsten ; et al.	2008-09-25
Power Semiconductor Module and Method for Producing the Same App 20080211091 - Kemper; Alfred ; et al.	2008-09-04
Apparatus and method for connecting components App 20080096311 - Speckels; Roland ; et al.	2008-04-24
Method For Producing An Electronic Device App 20080023530 - Kemper; Alfred	2008-01-31
Method for the structured application of a laminatable film to a substrate for a semiconductor module App 20070111475 - Licht; Thomas ; et al.	2007-05-17
Method and device for producing a bondable area region on a carrier App 20060261133 - Bayerer; Reinhold ; et al.	2006-11-23
Method and apparatus for controlling and monitoring a brazing process App 20060076389 - Kemper; Alfred ; et al.	2006-04-13
Power semiconductor module with ceramic substrate Grant 6,828,600 - Lenniger , et al. December 7, 2	2004-12-07
Method and device for producing a soldered joint Grant 6,796,483 - Weber , et al. September 28, 2	2004-09-28
Power semiconductor module with ceramic substrate App 20030168724 - Lenniger, Andreas ; et al.	2003-09-11

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