| Patent | Date |
|---|
Fabricating thermal transfer structure with in-plane tube lengths and out-of-plane tube bend(s)
Grant 10,024,606 - Arvelo , et al. July 17, 2 | 2018-07-17 |
Selective clamping of electronics card to coolant-cooled structure
Grant 9,591,787 - Arvelo , et al. March 7, 2 | 2017-03-07 |
System to improve an in-line memory module
Grant 9,537,237 - Brandon , et al. January 3, 2 | 2017-01-03 |
Thermal transfer structure with in-plane tube lengths and out-of-plane tube bend(s)
Grant 9,341,418 - Arvelo , et al. May 17, 2 | 2016-05-17 |
Selective clamping of electronics card to coolant-cooled structure
Grant 9,258,925 - Arvelo , et al. February 9, 2 | 2016-02-09 |
Selective Clamping Of Electronics Card To Coolant-cooled Structure
App 20150359140 - ARVELO; Amilcar R. ; et al. | 2015-12-10 |
Selective clamping of electronics card to coolant-cooled structure
Grant 9,144,178 - Arvelo , et al. September 22, 2 | 2015-09-22 |
Fabricating Thermal Transfer Structure With In-plane Tube Lengths And Out-of-plane Tube Bend(s)
App 20150053388 - ARVELO; Amilcar R. ; et al. | 2015-02-26 |
Selective Clamping Of Electronics Card To Coolant-cooled Structure
App 20150052753 - ARVELO; Amilcar R. ; et al. | 2015-02-26 |
Selective Clamping Of Electronics Card To Coolant-cooled Structure
App 20140247555 - ARVELO; Amilcar R. ; et al. | 2014-09-04 |
System To Improve An In-line Memory Module
App 20140098482 - Brandon; Mark A. ; et al. | 2014-04-10 |
Customized thermal interface to optimize mechanical loading and thermal conductivity characteristics
Grant 8,582,297 - Edwards , et al. November 12, 2 | 2013-11-12 |
Cooling A Multi-chip Electronic Module
App 20130033820 - Edwards; David L. ; et al. | 2013-02-07 |
Heat Spreader For Multi-chip Modules
App 20130027885 - Edwards; David L. ; et al. | 2013-01-31 |
Automatically reconfigurable liquid-cooling apparatus for an electronics rack
Grant 8,274,790 - Campbell , et al. September 25, 2 | 2012-09-25 |
System to improve an in-line memory module
Grant 8,248,805 - Brandon , et al. August 21, 2 | 2012-08-21 |
Customized Thermal Interface To Optimize Mechanical Loading And Thermal Conductivity Characteristics
App 20120199333 - Edwards; David L. ; et al. | 2012-08-09 |
System To Improve An In-line Memory Module
App 20120200997 - Brandon; Mark A. ; et al. | 2012-08-09 |
Automatically Reconfigurable Liquid-cooling Apparatus For An Electronics Rack
App 20120120603 - CAMPBELL; Levi A. ; et al. | 2012-05-17 |
In-line memory module cooling system
Grant 8,125,780 - Goth , et al. February 28, 2 | 2012-02-28 |
In-line Memory Module Cooling System
App 20110149505 - Goth; Gary F. ; et al. | 2011-06-23 |
System To Improve An In-line Memory Module
App 20110069456 - Brandon; Mark A. ; et al. | 2011-03-24 |
Low compressive force, non-silicone, high thermal conducting formulation for thermal interface material and package
Grant 7,816,785 - Iruvanti , et al. October 19, 2 | 2010-10-19 |
Low Compressive Force, Non-silicone, High Thermal Conducting Formulation For Thermal Interface Material And Package
App 20100181663 - IRUVANTI; SUSHUMNA ; et al. | 2010-07-22 |
Conductive heat transport cooling system and method for a multi-component electronics system
Grant 7,639,498 - Campbell , et al. December 29, 2 | 2009-12-29 |
Conductive Heat Transport Cooling System And Method For A Multi-component Electronics System
App 20080259567 - Campbell; Levi A. ; et al. | 2008-10-23 |
Conductive heat transport cooling system and method for a multi-component electronics system
Grant 7,408,776 - Campbell , et al. August 5, 2 | 2008-08-05 |
Conductive Heat Transport Cooling System And Method For A Multi-component Electronics System
App 20080084668 - Campbell; Levi A. ; et al. | 2008-04-10 |
Heat sink and method of making the same
Grant 7,100,281 - Kemink , et al. September 5, 2 | 2006-09-05 |
Heat sink and method of making the same
App 20050199371 - Kemink, Randall G. ; et al. | 2005-09-15 |
Separable hybrid cold plate and heat sink device and method
Grant 6,829,145 - Corrado , et al. December 7, 2 | 2004-12-07 |
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