loadpatents
Patent applications and USPTO patent grants for Kelvin Thermal Technologies, Inc..The latest application filed is for "thermal management planes".
Patent | Date |
---|---|
Vapor chamber, heatsink device, and electronic device Grant 11,445,636 - Wakaoka , et al. September 13, 2 | 2022-09-13 |
Thermal ground plane Grant 11,353,269 - Yang , et al. June 7, 2 | 2022-06-07 |
Thermal Management Planes App 20220163268 - Lewis; Ryan J. ;   et al. | 2022-05-26 |
Polymer-based Microfabricated Thermal Ground Plane App 20220155025 - Lewis; Ryan John ;   et al. | 2022-05-19 |
Thermal Management Planes App 20220074673 - Lewis; Ryan J. ;   et al. | 2022-03-10 |
Folding Thermal Ground Plane App 20210400846 - Lewis; Ryan J. ;   et al. | 2021-12-23 |
Deformed Mesh Thermal Ground Plane App 20210293488 - Lewis; Ryan ;   et al. | 2021-09-23 |
Vapor Chamber, Heatsink Device, And Electronic Device App 20210136955 - WAKAOKA; TAKUO ;   et al. | 2021-05-06 |
Micropillar-enabled Thermal Ground Plane App 20200300563 - Lewis; Ryan John ;   et al. | 2020-09-24 |
Micropillar-enabled thermal ground plane Grant 10,731,925 - Lewis , et al. | 2020-08-04 |
Method and device for spreading high heat fluxes in thermal ground planes Grant 10,724,804 - Lewis , et al. | 2020-07-28 |
Thermal Ground Plane App 20200191495 - Yang; Ronggui ;   et al. | 2020-06-18 |
Vapor Chamber App 20200182557A1 - | 2020-06-11 |
Thermal ground plane Grant 10,571,200 - Yang , et al. Feb | 2020-02-25 |
Thermal ground plane Grant 10,527,358 - Yang , et al. J | 2020-01-07 |
Polymer-based Microfabricated Thermal Ground Plane App 20190390919 - Lewis; Ryan John ;   et al. | 2019-12-26 |
Mechanically Improved Microelectronic Thermal Interface Structure For Low Die Stress App 20190341328 - Milne; Jason G. ;   et al. | 2019-11-07 |
Mechanically improved microelectronic thermal interface structure for low die stress Grant 10,446,466 - Milne , et al. Oc | 2019-10-15 |
Thermal Management Planes App 20180320984 - Lewis; Ryan J. ;   et al. | 2018-11-08 |
Method And Device For Spreading High Heat Fluxes In Thermal Ground Planes App 20180128553 - Lewis; Ryan John ;   et al. | 2018-05-10 |
Method And Device For Optimization Of Vapor Transport In A Thermal Ground Plane Using Void Space In Mobile Systems App 20180106554 - LEWIS; RYAN JOHN ;   et al. | 2018-04-19 |
Polymer-based microfabricated thermal ground plane Grant 9,921,004 - Lewis , et al. March 20, 2 | 2018-03-20 |
Flexible thermal ground plane and manufacturing the same Grant 9,909,814 - Yang , et al. March 6, 2 | 2018-03-06 |
Thermal Ground Plane App 20170299277 - Yang; Ronggui ;   et al. | 2017-10-19 |
Flexible thermal ground plane and manufacturing the same Grant 9,651,312 - Yang , et al. May 16, 2 | 2017-05-16 |
Thermal Ground Plane App 20170030654 - Yang; Ronggui ;   et al. | 2017-02-02 |
Flexible Thermal Ground Plane And Manufacturing The Same App 20160187070 - Yang; Ronggui ;   et al. | 2016-06-30 |
Polymer-based Microfabricated Thermal Ground Plane App 20160161193 - Lewis; Ryan John ;   et al. | 2016-06-09 |
Flexible Thermal Ground Plane And Manufacturing The Same App 20150226493 - Yang; Ronggui ;   et al. | 2015-08-13 |
NCAGE Code | 7FYW1 | KELVIN THERMAL TECHNOLOGIES, INC. |
CAGE Code | 7FYW1 | KELVIN THERMAL TECHNOLOGIES, INC. |
S.A.M. Registration | 7FYW1 [67518747] | KELVIN THERMAL TECHNOLOGIES, INC. |
SEC | 0001698360 | Kelvin Thermal Technologies, Inc. of COLORADO |
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