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Kelvin Thermal Technologies, Inc. Patent Filings

Kelvin Thermal Technologies, Inc.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kelvin Thermal Technologies, Inc..The latest application filed is for "thermal management planes".

Company Profile
14.19.18
  • Kelvin Thermal Technologies, Inc. - Boulder CO US
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Vapor chamber, heatsink device, and electronic device
Grant 11,445,636 - Wakaoka , et al. September 13, 2
2022-09-13
Thermal ground plane
Grant 11,353,269 - Yang , et al. June 7, 2
2022-06-07
Thermal Management Planes
App 20220163268 - Lewis; Ryan J. ;   et al.
2022-05-26
Polymer-based Microfabricated Thermal Ground Plane
App 20220155025 - Lewis; Ryan John ;   et al.
2022-05-19
Thermal Management Planes
App 20220074673 - Lewis; Ryan J. ;   et al.
2022-03-10
Folding Thermal Ground Plane
App 20210400846 - Lewis; Ryan J. ;   et al.
2021-12-23
Deformed Mesh Thermal Ground Plane
App 20210293488 - Lewis; Ryan ;   et al.
2021-09-23
Vapor Chamber, Heatsink Device, And Electronic Device
App 20210136955 - WAKAOKA; TAKUO ;   et al.
2021-05-06
Micropillar-enabled Thermal Ground Plane
App 20200300563 - Lewis; Ryan John ;   et al.
2020-09-24
Micropillar-enabled thermal ground plane
Grant 10,731,925 - Lewis , et al.
2020-08-04
Method and device for spreading high heat fluxes in thermal ground planes
Grant 10,724,804 - Lewis , et al.
2020-07-28
Thermal Ground Plane
App 20200191495 - Yang; Ronggui ;   et al.
2020-06-18
Vapor Chamber
App 20200182557A1 -
2020-06-11
Thermal ground plane
Grant 10,571,200 - Yang , et al. Feb
2020-02-25
Thermal ground plane
Grant 10,527,358 - Yang , et al. J
2020-01-07
Polymer-based Microfabricated Thermal Ground Plane
App 20190390919 - Lewis; Ryan John ;   et al.
2019-12-26
Mechanically Improved Microelectronic Thermal Interface Structure For Low Die Stress
App 20190341328 - Milne; Jason G. ;   et al.
2019-11-07
Mechanically improved microelectronic thermal interface structure for low die stress
Grant 10,446,466 - Milne , et al. Oc
2019-10-15
Thermal Management Planes
App 20180320984 - Lewis; Ryan J. ;   et al.
2018-11-08
Method And Device For Spreading High Heat Fluxes In Thermal Ground Planes
App 20180128553 - Lewis; Ryan John ;   et al.
2018-05-10
Method And Device For Optimization Of Vapor Transport In A Thermal Ground Plane Using Void Space In Mobile Systems
App 20180106554 - LEWIS; RYAN JOHN ;   et al.
2018-04-19
Polymer-based microfabricated thermal ground plane
Grant 9,921,004 - Lewis , et al. March 20, 2
2018-03-20
Flexible thermal ground plane and manufacturing the same
Grant 9,909,814 - Yang , et al. March 6, 2
2018-03-06
Thermal Ground Plane
App 20170299277 - Yang; Ronggui ;   et al.
2017-10-19
Flexible thermal ground plane and manufacturing the same
Grant 9,651,312 - Yang , et al. May 16, 2
2017-05-16
Thermal Ground Plane
App 20170030654 - Yang; Ronggui ;   et al.
2017-02-02
Flexible Thermal Ground Plane And Manufacturing The Same
App 20160187070 - Yang; Ronggui ;   et al.
2016-06-30
Polymer-based Microfabricated Thermal Ground Plane
App 20160161193 - Lewis; Ryan John ;   et al.
2016-06-09
Flexible Thermal Ground Plane And Manufacturing The Same
App 20150226493 - Yang; Ronggui ;   et al.
2015-08-13

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