| Patent | Date |
|---|
Printed circuit board assembly defect detection
Grant 11,423,577 - Kelly , et al. August 23, 2 | 2022-08-23 |
Advising audit ratings in a multiple-auditor environment
Grant 11,403,580 - Zulpa , et al. August 2, 2 | 2022-08-02 |
Method and System for Relay Attack Prevention Using Subzones
App 20220024412 - Kelly; Matthew S. | 2022-01-27 |
Printed Circuit Board Assembly Defect Detection
App 20220012917 - Kelly; Matthew S. ; et al. | 2022-01-13 |
Anti-eavesdrop Security Device
App 20220005449 - Berge; Layne A. ; et al. | 2022-01-06 |
Selective dielectric resin application on circuitized core layers
Grant 11,178,757 - Chamberlin , et al. November 16, 2 | 2021-11-16 |
Non-destructive identifying of plating dissolution in soldered, plated through-hole
Grant 11,059,120 - Kelly , et al. July 13, 2 | 2021-07-13 |
Electrical Apparatus Having Tin Whisker Sensing And Prevention
App 20210208190 - JUDD; Jeffrey N. ; et al. | 2021-07-08 |
Glass fiber coatings for improved resistance to conductive anodic filament formation
Grant 10,932,363 - Chamberlin , et al. February 23, 2 | 2021-02-23 |
Compliant pin with self sensing deformation
Grant 10,768,245 - Kelly , et al. Sep | 2020-09-08 |
Method of making integrated die paddle structures for bottom terminated components
Grant 10,679,926 - Hugo , et al. | 2020-06-09 |
Non-destructive Identifying Of Plating Dissolution In Soldered, Plated Through-hole
App 20200139466 - KELLY; Matthew S. ; et al. | 2020-05-07 |
Compliant Pin With Self Sensing Deformation
App 20200103454 - Kelly; Matthew S. ; et al. | 2020-04-02 |
Liquid immersion techniques for improved resistance to conductive anodic filament formation
Grant 10,590,037 - Chamberlin , et al. | 2020-03-17 |
Integrated die paddle structures for bottom terminated components
Grant 10,559,522 - Hugo , et al. Feb | 2020-02-11 |
Advising Audit Ratings In A Multiple-auditor Environment
App 20200012987 - Zulpa; Paul A. ; et al. | 2020-01-09 |
Glass Fiber Coatings For Improved Resistance To Conductive Anodic Filament Formation
App 20190364659 - Chamberlin; Bruce J. ; et al. | 2019-11-28 |
Selective Dielectric Resin Application On Circuitized Core Layers
App 20190342994 - CHAMBERLIN; BRUCE J. ; et al. | 2019-11-07 |
Selective Dielectric Resin Application On Circuitized Core Layers
App 20190342995 - CHAMBERLIN; BRUCE J. ; et al. | 2019-11-07 |
Glass fiber coatings for improved resistance to conductive anodic filament formation
Grant 10,462,900 - Chamberlin , et al. Oc | 2019-10-29 |
Selective dielectric resin application on circuitized core layers
Grant 10,405,421 - Chamberlin , et al. Sep | 2019-09-03 |
Selective Dielectric Resin Application On Circuitized Core Layers
App 20190191559 - CHAMBERLIN; BRUCE J. ; et al. | 2019-06-20 |
Selective Dielectric Resin Application On Circuitized Core Layers
App 20190191558 - CHAMBERLIN; BRUCE J. ; et al. | 2019-06-20 |
Testing printed circuit board assembly
Grant 10,168,383 - Hoffmeyer , et al. J | 2019-01-01 |
Connector module having insulated metal frame
Grant 10,141,703 - Ang , et al. Nov | 2018-11-27 |
Testing Printed Circuit Board Assembly
App 20180328980 - Hoffmeyer; Mark K. ; et al. | 2018-11-15 |
Integrated Die Paddle Structures For Bottom Terminated Components
App 20180301399 - Hugo; Stephen M. ; et al. | 2018-10-18 |
Liquid Immersion Techniques For Improved Resistance To Conductive Anodic Filament Formation
App 20180273426 - CHAMBERLIN; BRUCE J. ; et al. | 2018-09-27 |
Integrated die paddle structures for bottom terminated components
Grant 10,083,894 - Hugo , et al. September 25, 2 | 2018-09-25 |
Testing printed circuit board assembly
Grant 10,048,312 - Hoffmeyer , et al. August 14, 2 | 2018-08-14 |
Glass Fiber Coatings For Improved Resistance To Conductive Anodic Filament Formation
App 20180153042 - CHAMBERLIN; BRUCE J. ; et al. | 2018-05-31 |
Increasing solder hole-fill in a printed circuit board assembly
Grant 9,986,649 - Hugo , et al. May 29, 2 | 2018-05-29 |
Connector module having insulated metal frame
Grant 9,972,957 - Ang , et al. May 15, 2 | 2018-05-15 |
Connector module having insulated metal frame
Grant 9,966,719 - Ang , et al. May 8, 2 | 2018-05-08 |
Integrated Die Paddle Structures For Bottom Terminated Components
App 20180053711 - Hugo; Stephen M. ; et al. | 2018-02-22 |
Integrated Die Paddle Structures For Bottom Terminated Components
App 20170179004 - Hugo; Stephen M. ; et al. | 2017-06-22 |
Increasing solder hole-fill in a printed circuit board assembly
Grant 9,662,732 - Hugo , et al. May 30, 2 | 2017-05-30 |
Increasing Solder Hole-fill In A Printed Circuit Board Assembly
App 20170142845 - HUGO; STEPHEN M. ; et al. | 2017-05-18 |
Technology for temperature sensitive components in thermal processing
Grant 9,563,739 - Ferrill , et al. February 7, 2 | 2017-02-07 |
Increasing Solder Hole-fill In A Printed Circuit Board Assembly
App 20160297022 - Hugo; Stephen M. ; et al. | 2016-10-13 |
Increasing solder hole-fill in a printed circuit board assembly
Grant 9,427,828 - Hugo , et al. August 30, 2 | 2016-08-30 |
Technology For Temperature Sensitive Components In Thermal Processing
App 20160188786 - Ferrill; Mitchell G. ; et al. | 2016-06-30 |
Technology for temperature sensitive components in thermal processing
Grant 9,317,643 - Ferrill , et al. April 19, 2 | 2016-04-19 |
Increasing Solder Hole-fill In A Printed Circuit Board Assembly
App 20160044791 - Hugo; Stephen M. ; et al. | 2016-02-11 |
Heat transfer device for wave soldering
Grant 9,232,664 - Hugo , et al. January 5, 2 | 2016-01-05 |
Technology For Temperature Sensitive Components In Thermal Processing
App 20150342056 - Ferrill; Mitchell G. ; et al. | 2015-11-26 |
Heat transfer device for wave soldering
Grant 9,148,962 - Hugo , et al. September 29, 2 | 2015-09-29 |
Heat Transfer Device For Wave Soldering
App 20140182909 - Hugo; Stephen M. ; et al. | 2014-07-03 |
Heat Transfer Device For Wave Soldering
App 20140183250 - Hugo; Stephen M. ; et al. | 2014-07-03 |
Interconnect Formation Under Load
App 20120300423 - Advocate, JR.; Gerald G. ; et al. | 2012-11-29 |
Selective thermal conditioning components on a PCB
Grant 8,299,393 - Kelly , et al. October 30, 2 | 2012-10-30 |
Selective Thermal Conditioning Components On A Pcb
App 20120043305 - Kelly; Matthew S. ; et al. | 2012-02-23 |
Heat sink
Grant 7,856,341 - Carlson , et al. December 21, 2 | 2010-12-21 |
Heat Sink Method, System, And Program Product
App 20090210190 - Carlson; Brian L. ; et al. | 2009-08-20 |
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